JPWO2021210440A1 - - Google Patents

Info

Publication number
JPWO2021210440A1
JPWO2021210440A1 JP2022515315A JP2022515315A JPWO2021210440A1 JP WO2021210440 A1 JPWO2021210440 A1 JP WO2021210440A1 JP 2022515315 A JP2022515315 A JP 2022515315A JP 2022515315 A JP2022515315 A JP 2022515315A JP WO2021210440 A1 JPWO2021210440 A1 JP WO2021210440A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022515315A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021210440A1 publication Critical patent/JPWO2021210440A1/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0056—Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/02—Diffusing elements; Afocal elements
    • G02B5/0205—Diffusing elements; Afocal elements characterised by the diffusing properties
    • G02B5/021—Diffusing elements; Afocal elements characterised by the diffusing properties the diffusion taking place at the element's surface, e.g. by means of surface roughening or microprismatic structures
    • G02B5/0215—Diffusing elements; Afocal elements characterised by the diffusing properties the diffusion taking place at the element's surface, e.g. by means of surface roughening or microprismatic structures the surface having a regular structure
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/02—Diffusing elements; Afocal elements
    • G02B5/0268—Diffusing elements; Afocal elements characterized by the fabrication or manufacturing method
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/02—Diffusing elements; Afocal elements
    • G02B5/0273—Diffusing elements; Afocal elements characterized by the use
    • G02B5/0278—Diffusing elements; Afocal elements characterized by the use used in transmission
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02218—Material of the housings; Filling of the housings
    • H01S5/02234—Resin-filled housings; the housings being made of resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02315—Support members, e.g. bases or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/42—Arrays of surface emitting lasers
    • H01S5/423—Arrays of surface emitting lasers having a vertical cavity

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Led Device Packages (AREA)
JP2022515315A 2020-04-17 2021-04-05 Pending JPWO2021210440A1 (https=)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020074267 2020-04-17
JP2020149558 2020-09-07
JP2020165068 2020-09-30
PCT/JP2021/014512 WO2021210440A1 (ja) 2020-04-17 2021-04-05 拡散カバーの製造方法、拡散カバーおよびこれを備えた半導体発光装置

Publications (1)

Publication Number Publication Date
JPWO2021210440A1 true JPWO2021210440A1 (https=) 2021-10-21

Family

ID=78085260

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022515315A Pending JPWO2021210440A1 (https=) 2020-04-17 2021-04-05

Country Status (4)

Country Link
US (1) US20230101361A1 (https=)
JP (1) JPWO2021210440A1 (https=)
DE (1) DE112021001354T5 (https=)
WO (1) WO2021210440A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001255660A (ja) * 2000-03-10 2001-09-21 Ricoh Opt Ind Co Ltd 特殊表面形状の創成方法及び光学素子
JP2006278356A (ja) * 2005-03-25 2006-10-12 Dainippon Printing Co Ltd 固体撮像素子の製造方法及び固体撮像素子
WO2014021232A1 (ja) * 2012-07-31 2014-02-06 旭硝子株式会社 マイクロレンズアレイ、撮像素子パッケージおよびマイクロレンズアレイの製造方法
JP2020077678A (ja) * 2018-11-06 2020-05-21 ローム株式会社 半導体発光装置
WO2020100890A1 (ja) * 2018-11-13 2020-05-22 株式会社ダイセル 光学部材、該光学部材を含むレーザーモジュール及びレーザーデバイス
JP2020141019A (ja) * 2019-02-27 2020-09-03 富士ゼロックス株式会社 発光装置、発光デバイス、光学装置及び情報処理装置
JP2020141018A (ja) * 2019-02-27 2020-09-03 富士ゼロックス株式会社 発光装置、発光デバイス、光学装置及び情報処理装置
WO2020217943A1 (ja) * 2019-04-22 2020-10-29 日本板硝子株式会社 放射角度変換素子および発光装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101078812B1 (ko) * 2010-03-03 2011-11-02 재단법인대구경북과학기술원 비구면 형태의 실리콘 몰드, 마이크로 렌즈 어레이 및 상기 실리콘 몰드와 마이크로 렌즈 어레이를 제조하는 방법
JP2012074451A (ja) 2010-09-28 2012-04-12 Stanley Electric Co Ltd 配線基板及びその製造方法
EP3165873B1 (en) * 2015-11-04 2020-03-04 Hexagon Technology Center GmbH Laser module comprising a micro-lens array
JP2019110278A (ja) 2017-12-20 2019-07-04 株式会社デンソー 半導体装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001255660A (ja) * 2000-03-10 2001-09-21 Ricoh Opt Ind Co Ltd 特殊表面形状の創成方法及び光学素子
JP2006278356A (ja) * 2005-03-25 2006-10-12 Dainippon Printing Co Ltd 固体撮像素子の製造方法及び固体撮像素子
WO2014021232A1 (ja) * 2012-07-31 2014-02-06 旭硝子株式会社 マイクロレンズアレイ、撮像素子パッケージおよびマイクロレンズアレイの製造方法
JP2020077678A (ja) * 2018-11-06 2020-05-21 ローム株式会社 半導体発光装置
WO2020100890A1 (ja) * 2018-11-13 2020-05-22 株式会社ダイセル 光学部材、該光学部材を含むレーザーモジュール及びレーザーデバイス
JP2020141019A (ja) * 2019-02-27 2020-09-03 富士ゼロックス株式会社 発光装置、発光デバイス、光学装置及び情報処理装置
JP2020141018A (ja) * 2019-02-27 2020-09-03 富士ゼロックス株式会社 発光装置、発光デバイス、光学装置及び情報処理装置
WO2020217943A1 (ja) * 2019-04-22 2020-10-29 日本板硝子株式会社 放射角度変換素子および発光装置

Also Published As

Publication number Publication date
WO2021210440A1 (ja) 2021-10-21
US20230101361A1 (en) 2023-03-30
DE112021001354T5 (de) 2022-12-29

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