DE112021001354T5 - Verfahren zur herstellung einer streuabdeckung, streuabdeckung und lichtemittierende halbleitervorrichtung mit einer solchen - Google Patents
Verfahren zur herstellung einer streuabdeckung, streuabdeckung und lichtemittierende halbleitervorrichtung mit einer solchen Download PDFInfo
- Publication number
- DE112021001354T5 DE112021001354T5 DE112021001354.8T DE112021001354T DE112021001354T5 DE 112021001354 T5 DE112021001354 T5 DE 112021001354T5 DE 112021001354 T DE112021001354 T DE 112021001354T DE 112021001354 T5 DE112021001354 T5 DE 112021001354T5
- Authority
- DE
- Germany
- Prior art keywords
- lens
- base member
- layer
- wiring board
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0056—Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/02—Diffusing elements; Afocal elements
- G02B5/0205—Diffusing elements; Afocal elements characterised by the diffusing properties
- G02B5/021—Diffusing elements; Afocal elements characterised by the diffusing properties the diffusion taking place at the element's surface, e.g. by means of surface roughening or microprismatic structures
- G02B5/0215—Diffusing elements; Afocal elements characterised by the diffusing properties the diffusion taking place at the element's surface, e.g. by means of surface roughening or microprismatic structures the surface having a regular structure
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/02—Diffusing elements; Afocal elements
- G02B5/0268—Diffusing elements; Afocal elements characterized by the fabrication or manufacturing method
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/02—Diffusing elements; Afocal elements
- G02B5/0273—Diffusing elements; Afocal elements characterized by the use
- G02B5/0278—Diffusing elements; Afocal elements characterized by the use used in transmission
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02218—Material of the housings; Filling of the housings
- H01S5/02234—Resin-filled housings; the housings being made of resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02253—Out-coupling of light using lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02257—Out-coupling of light using windows, e.g. specially adapted for back-reflecting light to a detector inside the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02315—Support members, e.g. bases or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/02345—Wire-bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/42—Arrays of surface emitting lasers
- H01S5/423—Arrays of surface emitting lasers having a vertical cavity
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020074267 | 2020-04-17 | ||
| JP2020-074267 | 2020-04-17 | ||
| JP2020149558 | 2020-09-07 | ||
| JP2020-149558 | 2020-09-07 | ||
| JP2020-165068 | 2020-09-30 | ||
| JP2020165068 | 2020-09-30 | ||
| PCT/JP2021/014512 WO2021210440A1 (ja) | 2020-04-17 | 2021-04-05 | 拡散カバーの製造方法、拡散カバーおよびこれを備えた半導体発光装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE112021001354T5 true DE112021001354T5 (de) | 2022-12-29 |
Family
ID=78085260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE112021001354.8T Pending DE112021001354T5 (de) | 2020-04-17 | 2021-04-05 | Verfahren zur herstellung einer streuabdeckung, streuabdeckung und lichtemittierende halbleitervorrichtung mit einer solchen |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20230101361A1 (https=) |
| JP (1) | JPWO2021210440A1 (https=) |
| DE (1) | DE112021001354T5 (https=) |
| WO (1) | WO2021210440A1 (https=) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012074451A (ja) | 2010-09-28 | 2012-04-12 | Stanley Electric Co Ltd | 配線基板及びその製造方法 |
| JP2019110278A (ja) | 2017-12-20 | 2019-07-04 | 株式会社デンソー | 半導体装置 |
| JP2020077678A (ja) | 2018-11-06 | 2020-05-21 | ローム株式会社 | 半導体発光装置 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001255660A (ja) * | 2000-03-10 | 2001-09-21 | Ricoh Opt Ind Co Ltd | 特殊表面形状の創成方法及び光学素子 |
| JP4629473B2 (ja) * | 2005-03-25 | 2011-02-09 | 大日本印刷株式会社 | 固体撮像素子の製造方法 |
| KR101078812B1 (ko) * | 2010-03-03 | 2011-11-02 | 재단법인대구경북과학기술원 | 비구면 형태의 실리콘 몰드, 마이크로 렌즈 어레이 및 상기 실리콘 몰드와 마이크로 렌즈 어레이를 제조하는 방법 |
| JPWO2014021232A1 (ja) * | 2012-07-31 | 2016-07-21 | 旭硝子株式会社 | マイクロレンズアレイ、撮像素子パッケージおよびマイクロレンズアレイの製造方法 |
| EP3165873B1 (en) * | 2015-11-04 | 2020-03-04 | Hexagon Technology Center GmbH | Laser module comprising a micro-lens array |
| WO2020100890A1 (ja) * | 2018-11-13 | 2020-05-22 | 株式会社ダイセル | 光学部材、該光学部材を含むレーザーモジュール及びレーザーデバイス |
| JP7363053B2 (ja) * | 2019-02-27 | 2023-10-18 | 富士フイルムビジネスイノベーション株式会社 | 発光装置、発光デバイス、光学装置及び情報処理装置 |
| JP6813042B2 (ja) * | 2019-02-27 | 2021-01-13 | 富士ゼロックス株式会社 | 発光装置、発光デバイス、光学装置及び情報処理装置 |
| WO2020217943A1 (ja) * | 2019-04-22 | 2020-10-29 | 日本板硝子株式会社 | 放射角度変換素子および発光装置 |
-
2021
- 2021-04-05 JP JP2022515315A patent/JPWO2021210440A1/ja active Pending
- 2021-04-05 US US17/802,050 patent/US20230101361A1/en not_active Abandoned
- 2021-04-05 DE DE112021001354.8T patent/DE112021001354T5/de active Pending
- 2021-04-05 WO PCT/JP2021/014512 patent/WO2021210440A1/ja not_active Ceased
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012074451A (ja) | 2010-09-28 | 2012-04-12 | Stanley Electric Co Ltd | 配線基板及びその製造方法 |
| JP2019110278A (ja) | 2017-12-20 | 2019-07-04 | 株式会社デンソー | 半導体装置 |
| JP2020077678A (ja) | 2018-11-06 | 2020-05-21 | ローム株式会社 | 半導体発光装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2021210440A1 (https=) | 2021-10-21 |
| WO2021210440A1 (ja) | 2021-10-21 |
| US20230101361A1 (en) | 2023-03-30 |
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| R012 | Request for examination validly filed |