JPWO2021205674A1 - - Google Patents

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Publication number
JPWO2021205674A1
JPWO2021205674A1 JP2022514302A JP2022514302A JPWO2021205674A1 JP WO2021205674 A1 JPWO2021205674 A1 JP WO2021205674A1 JP 2022514302 A JP2022514302 A JP 2022514302A JP 2022514302 A JP2022514302 A JP 2022514302A JP WO2021205674 A1 JPWO2021205674 A1 JP WO2021205674A1
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Japan
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JP2022514302A
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Japanese (ja)
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JP7383798B2 (en
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/0651—Wire or wire-like electrical connections from device to substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06555—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
    • H01L2225/06562—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking at least one device in the stack being rotated or offset
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
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JP2003133361A (en) * 2001-10-23 2003-05-09 Sumiden Magnet Wire Kk Bonding wire
JP2013258324A (en) * 2012-06-13 2013-12-26 Tanaka Electronics Ind Co Ltd Aluminum alloy thin wire for semiconductor device connection
WO2016135993A1 (en) * 2015-02-26 2016-09-01 日鉄住金マイクロメタル株式会社 Bonding wire for semiconductor devices
JP2019504472A (en) * 2015-11-23 2019-02-14 ヘレウス ドイチェラント ゲーエムベーハー ウント カンパニー カーゲー Coated wire

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JP4722671B2 (en) 2005-10-28 2011-07-13 新日鉄マテリアルズ株式会社 Bonding wires for semiconductor devices
TW201250013A (en) * 2011-06-15 2012-12-16 Tanaka Electronics Ind High strength and high elongation ratio of Au alloy bonding wire
EP2822029A4 (en) 2012-02-27 2015-12-23 Nippon Micrometal Corp Power semiconductor device, method for manufacturing same, and bonding wire
JP6869920B2 (en) * 2018-04-02 2021-05-12 田中電子工業株式会社 Precious metal-coated silver wire for ball bonding and its manufacturing method, and semiconductor device using precious metal-coated silver wire for ball bonding and its manufacturing method

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JPH05198931A (en) * 1992-01-20 1993-08-06 Fujitsu Ltd Wire bonding method
JP2003133361A (en) * 2001-10-23 2003-05-09 Sumiden Magnet Wire Kk Bonding wire
JP2013258324A (en) * 2012-06-13 2013-12-26 Tanaka Electronics Ind Co Ltd Aluminum alloy thin wire for semiconductor device connection
WO2016135993A1 (en) * 2015-02-26 2016-09-01 日鉄住金マイクロメタル株式会社 Bonding wire for semiconductor devices
JP2019504472A (en) * 2015-11-23 2019-02-14 ヘレウス ドイチェラント ゲーエムベーハー ウント カンパニー カーゲー Coated wire

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