JPWO2021201288A1 - - Google Patents
Info
- Publication number
- JPWO2021201288A1 JPWO2021201288A1 JP2022511165A JP2022511165A JPWO2021201288A1 JP WO2021201288 A1 JPWO2021201288 A1 JP WO2021201288A1 JP 2022511165 A JP2022511165 A JP 2022511165A JP 2022511165 A JP2022511165 A JP 2022511165A JP WO2021201288 A1 JPWO2021201288 A1 JP WO2021201288A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Materials For Photolithography (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020067927 | 2020-04-03 | ||
| JP2020067927 | 2020-04-03 | ||
| PCT/JP2021/014369 WO2021201288A1 (en) | 2020-04-03 | 2021-04-02 | Photosensitive element, and method for forming resist pattern |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021201288A1 true JPWO2021201288A1 (en) | 2021-10-07 |
| JP7377343B2 JP7377343B2 (en) | 2023-11-09 |
Family
ID=77930396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022511165A Active JP7377343B2 (en) | 2020-04-03 | 2021-04-02 | Photosensitive element and resist pattern formation method |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7377343B2 (en) |
| KR (1) | KR102660157B1 (en) |
| CN (1) | CN115398337A (en) |
| TW (1) | TWI780648B (en) |
| WO (1) | WO2021201288A1 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019188612A (en) * | 2018-04-18 | 2019-10-31 | 三菱ケミカル株式会社 | Polyester film for dry film resist |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4000544B2 (en) * | 1998-09-30 | 2007-10-31 | 東レフィルム加工株式会社 | Photoresist cover film for photosensitive plates |
| JP2002229200A (en) * | 2001-02-02 | 2002-08-14 | Hitachi Chem Co Ltd | Photosensitive film |
| JP2004191648A (en) | 2002-12-11 | 2004-07-08 | Hitachi Chem Co Ltd | Photosensitive element, method of forming resist pattern using the same, and method of manufacturing printed wiring board |
| JP2006201546A (en) * | 2005-01-21 | 2006-08-03 | Showa Denko Kk | Photoresist film |
| JP2008103622A (en) * | 2006-10-20 | 2008-05-01 | Fujifilm Corp | Laminate for fabricating printed wiring board and method for fabricating printed wiring board using it |
| JP5573961B2 (en) * | 2010-12-16 | 2014-08-20 | 日立化成株式会社 | Photosensitive element, resist pattern forming method, and printed wiring board manufacturing method |
| WO2014021590A1 (en) * | 2012-08-01 | 2014-02-06 | 주식회사 엘지화학 | Resin composition having photocurable property and thermosetting property, and dry film solder resist |
| KR101734425B1 (en) * | 2013-09-24 | 2017-05-11 | 주식회사 엘지화학 | Preparation method for dry film solder resist and film laminate used therein |
| WO2015045349A1 (en) * | 2013-09-27 | 2015-04-02 | パナソニックＩｐマネジメント株式会社 | Optical waveguide dry film, and optical waveguide manufacturing method and optical waveguide using optical waveguide dry film |
| JP6432283B2 (en) * | 2014-10-31 | 2018-12-05 | 東レ株式会社 | Biaxially oriented polyester film for dry film resist support |
| JP2017122818A (en) * | 2016-01-06 | 2017-07-13 | 旭化成株式会社 | Photosensitive resin laminate |
| JP2018077426A (en) * | 2016-11-11 | 2018-05-17 | ニッコー・マテリアルズ株式会社 | Photoresist film, method for forming resist pattern, and method for forming conductor pattern |
| CN109690404B (en) * | 2016-12-07 | 2023-04-04 | 旭化成株式会社 | Photosensitive resin composition and photosensitive resin laminate |
| WO2019142790A1 (en) * | 2018-01-18 | 2019-07-25 | Ａｇｃ株式会社 | Long laminate, method for producing same, and printed wiring board |
| KR102605003B1 (en) * | 2018-06-22 | 2023-11-22 | 아사히 가세이 가부시키가이샤 | Photosensitive resin composition and method of forming resist pattern |
| KR102509152B1 (en) * | 2018-08-09 | 2023-03-10 | 아사히 가세이 가부시키가이샤 | Photosensitive resin composition and method for forming resist pattern |
-
2021
- 2021-04-01 TW TW110112219A patent/TWI780648B/en active
- 2021-04-02 JP JP2022511165A patent/JP7377343B2/en active Active
- 2021-04-02 WO PCT/JP2021/014369 patent/WO2021201288A1/en active Application Filing
- 2021-04-02 CN CN202180025576.1A patent/CN115398337A/en active Pending
- 2021-04-02 KR KR1020227019356A patent/KR102660157B1/en active IP Right Grant
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019188612A (en) * | 2018-04-18 | 2019-10-31 | 三菱ケミカル株式会社 | Polyester film for dry film resist |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI780648B (en) | 2022-10-11 |
| JP7377343B2 (en) | 2023-11-09 |
| TW202142962A (en) | 2021-11-16 |
| CN115398337A (en) | 2022-11-25 |
| KR20220099114A (en) | 2022-07-12 |
| WO2021201288A1 (en) | 2021-10-07 |
| KR102660157B1 (en) | 2024-04-23 |
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