JPWO2021201288A1 - - Google Patents

Info

Publication number
JPWO2021201288A1
JPWO2021201288A1 JP2022511165A JP2022511165A JPWO2021201288A1 JP WO2021201288 A1 JPWO2021201288 A1 JP WO2021201288A1 JP 2022511165 A JP2022511165 A JP 2022511165A JP 2022511165 A JP2022511165 A JP 2022511165A JP WO2021201288 A1 JPWO2021201288 A1 JP WO2021201288A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022511165A
Other languages
Japanese (ja)
Other versions
JP7377343B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021201288A1 publication Critical patent/JPWO2021201288A1/ja
Application granted granted Critical
Publication of JP7377343B2 publication Critical patent/JP7377343B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2022511165A 2020-04-03 2021-04-02 Photosensitive element and resist pattern formation method Active JP7377343B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020067927 2020-04-03
JP2020067927 2020-04-03
PCT/JP2021/014369 WO2021201288A1 (en) 2020-04-03 2021-04-02 Photosensitive element, and method for forming resist pattern

Publications (2)

Publication Number Publication Date
JPWO2021201288A1 true JPWO2021201288A1 (en) 2021-10-07
JP7377343B2 JP7377343B2 (en) 2023-11-09

Family

ID=77930396

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022511165A Active JP7377343B2 (en) 2020-04-03 2021-04-02 Photosensitive element and resist pattern formation method

Country Status (5)

Country Link
JP (1) JP7377343B2 (en)
KR (1) KR102660157B1 (en)
CN (1) CN115398337A (en)
TW (1) TWI780648B (en)
WO (1) WO2021201288A1 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019188612A (en) * 2018-04-18 2019-10-31 三菱ケミカル株式会社 Polyester film for dry film resist

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4000544B2 (en) * 1998-09-30 2007-10-31 東レフィルム加工株式会社 Photoresist cover film for photosensitive plates
JP2002229200A (en) * 2001-02-02 2002-08-14 Hitachi Chem Co Ltd Photosensitive film
JP2004191648A (en) 2002-12-11 2004-07-08 Hitachi Chem Co Ltd Photosensitive element, method of forming resist pattern using the same, and method of manufacturing printed wiring board
JP2006201546A (en) * 2005-01-21 2006-08-03 Showa Denko Kk Photoresist film
JP2008103622A (en) * 2006-10-20 2008-05-01 Fujifilm Corp Laminate for fabricating printed wiring board and method for fabricating printed wiring board using it
KR101444044B1 (en) * 2010-12-16 2014-09-23 히타치가세이가부시끼가이샤 Photosensitive element, method for forming resist pattern, and method for producing printed circuit board
WO2014021590A1 (en) * 2012-08-01 2014-02-06 주식회사 엘지화학 Resin composition having photocurable property and thermosetting property, and dry film solder resist
KR101734425B1 (en) * 2013-09-24 2017-05-11 주식회사 엘지화학 Preparation method for dry film solder resist and film laminate used therein
JP6558736B2 (en) * 2013-09-27 2019-08-14 パナソニックＩｐマネジメント株式会社 Dry film for optical waveguide, optical waveguide manufacturing method using the same, and optical waveguide
JP6432283B2 (en) * 2014-10-31 2018-12-05 東レ株式会社 Biaxially oriented polyester film for dry film resist support
JP2017122818A (en) * 2016-01-06 2017-07-13 旭化成株式会社 Photosensitive resin laminate
JP2018077426A (en) * 2016-11-11 2018-05-17 ニッコー・マテリアルズ株式会社 Photoresist film, method for forming resist pattern, and method for forming conductor pattern
MY192472A (en) * 2016-12-07 2022-08-22 Asahi Chemical Ind Photosensitive resin composition and photosensitive resin laminate
KR102660542B1 (en) * 2018-01-18 2024-04-24 에이지씨 가부시키가이샤 Long-length laminate, manufacturing method and printed wiring board
KR102605003B1 (en) * 2018-06-22 2023-11-22 아사히 가세이 가부시키가이샤 Photosensitive resin composition and method of forming resist pattern
JP7422664B2 (en) * 2018-08-09 2024-01-26 旭化成株式会社 Photosensitive resin composition and resist pattern formation method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019188612A (en) * 2018-04-18 2019-10-31 三菱ケミカル株式会社 Polyester film for dry film resist

Also Published As

Publication number Publication date
TW202142962A (en) 2021-11-16
KR20220099114A (en) 2022-07-12
TWI780648B (en) 2022-10-11
KR102660157B1 (en) 2024-04-23
JP7377343B2 (en) 2023-11-09
CN115398337A (en) 2022-11-25
WO2021201288A1 (en) 2021-10-07

Similar Documents

Publication Publication Date Title
BR112023005462A2 (en)
BR112023012656A2 (en)
BR112021014123A2 (en)
BR112022009896A2 (en)
BR112023009656A2 (en)
BR112022024743A2 (en)
BR112023006729A2 (en)
BR102021018859A2 (en)
BR102021015500A2 (en)
JPWO2021192608A1 (en)
BR112023008622A2 (en)
BR112023011738A2 (en)
BR112023016292A2 (en)
JPWO2022163652A1 (en)
BR112023004146A2 (en)
BR112023011539A2 (en)
BR112023011610A2 (en)
BR112023008976A2 (en)
BR102021020147A2 (en)
BR102021018926A2 (en)
BR102021018167A2 (en)
BR102021016837A2 (en)
BR102021016551A2 (en)
BR102021016375A2 (en)
BR102021016200A2 (en)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220510

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230228

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20230428

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230629

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20231003

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20231027

R150 Certificate of patent or registration of utility model

Ref document number: 7377343

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150