JPWO2021200337A1 - - Google Patents
Info
- Publication number
- JPWO2021200337A1 JPWO2021200337A1 JP2022511956A JP2022511956A JPWO2021200337A1 JP WO2021200337 A1 JPWO2021200337 A1 JP WO2021200337A1 JP 2022511956 A JP2022511956 A JP 2022511956A JP 2022511956 A JP2022511956 A JP 2022511956A JP WO2021200337 A1 JPWO2021200337 A1 JP WO2021200337A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Geometry (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2020065761 | 2020-04-01 | ||
PCT/JP2021/011712 WO2021200337A1 (ja) | 2020-04-01 | 2021-03-22 | 電子装置 |
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JPWO2021200337A1 true JPWO2021200337A1 (ja) | 2021-10-07 |
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JP2022511956A Pending JPWO2021200337A1 (ja) | 2020-04-01 | 2021-03-22 |
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US (1) | US20230109471A1 (ja) |
JP (1) | JPWO2021200337A1 (ja) |
CN (1) | CN115335991A (ja) |
DE (2) | DE112021000681T5 (ja) |
WO (1) | WO2021200337A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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USD1022932S1 (en) * | 2021-03-16 | 2024-04-16 | Rohm Co., Ltd. | Semiconductor module |
USD1021829S1 (en) * | 2021-03-16 | 2024-04-09 | Rohm Co., Ltd. | Semiconductor module |
USD1021830S1 (en) * | 2021-03-16 | 2024-04-09 | Rohm Co., Ltd. | Semiconductor module |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2014103270A (ja) * | 2012-11-20 | 2014-06-05 | Sanken Electric Co Ltd | 半導体モジュール |
WO2016125363A1 (ja) * | 2015-02-06 | 2016-08-11 | 株式会社 村田製作所 | パワー半導体モジュール |
WO2019244372A1 (ja) * | 2018-06-20 | 2019-12-26 | ローム株式会社 | 半導体装置 |
JP7199167B2 (ja) | 2018-06-29 | 2023-01-05 | 三菱電機株式会社 | パワー半導体モジュール、電力変換装置、およびパワー半導体モジュールの製造方法 |
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2021
- 2021-03-22 CN CN202180024844.8A patent/CN115335991A/zh active Pending
- 2021-03-22 DE DE112021000681.9T patent/DE112021000681T5/de active Pending
- 2021-03-22 US US17/913,527 patent/US20230109471A1/en active Pending
- 2021-03-22 WO PCT/JP2021/011712 patent/WO2021200337A1/ja active Application Filing
- 2021-03-22 JP JP2022511956A patent/JPWO2021200337A1/ja active Pending
- 2021-03-22 DE DE212021000219.6U patent/DE212021000219U1/de active Active
Also Published As
Publication number | Publication date |
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DE112021000681T5 (de) | 2023-01-05 |
CN115335991A (zh) | 2022-11-11 |
DE212021000219U1 (de) | 2022-03-03 |
WO2021200337A1 (ja) | 2021-10-07 |
US20230109471A1 (en) | 2023-04-06 |
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