JPWO2021200032A1 - - Google Patents

Info

Publication number
JPWO2021200032A1
JPWO2021200032A1 JP2022511766A JP2022511766A JPWO2021200032A1 JP WO2021200032 A1 JPWO2021200032 A1 JP WO2021200032A1 JP 2022511766 A JP2022511766 A JP 2022511766A JP 2022511766 A JP2022511766 A JP 2022511766A JP WO2021200032 A1 JPWO2021200032 A1 JP WO2021200032A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022511766A
Other versions
JP7371321B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021200032A1 publication Critical patent/JPWO2021200032A1/ja
Application granted granted Critical
Publication of JP7371321B2 publication Critical patent/JP7371321B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/08—Epoxidised polymerised polyenes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Epoxy Resins (AREA)
JP2022511766A 2020-03-31 2021-03-12 硬化性樹脂組成物、硬化物、およびプリント配線板 Active JP7371321B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020062179 2020-03-31
JP2020062179 2020-03-31
PCT/JP2021/010035 WO2021200032A1 (ja) 2020-03-31 2021-03-12 硬化性樹脂組成物、硬化物、およびプリント配線板

Publications (2)

Publication Number Publication Date
JPWO2021200032A1 true JPWO2021200032A1 (ja) 2021-10-07
JP7371321B2 JP7371321B2 (ja) 2023-10-31

Family

ID=77929226

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022511766A Active JP7371321B2 (ja) 2020-03-31 2021-03-12 硬化性樹脂組成物、硬化物、およびプリント配線板

Country Status (5)

Country Link
JP (1) JP7371321B2 (ja)
KR (1) KR20220140810A (ja)
CN (1) CN115380074B (ja)
TW (1) TW202202940A (ja)
WO (1) WO2021200032A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023067910A1 (ja) * 2021-10-22 2023-04-27 東洋紡株式会社 導電性組成物

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002293882A (ja) * 2001-03-30 2002-10-09 Taiyo Ink Mfg Ltd 光硬化性・熱硬化性樹脂組成物及びプリント配線板
JP2008214413A (ja) * 2007-03-01 2008-09-18 Toray Ind Inc 熱硬化性樹脂組成物
JP2015121775A (ja) * 2013-11-20 2015-07-02 四国化成工業株式会社 光硬化性・熱硬化性樹脂組成物およびプリント配線板
WO2016117237A1 (ja) * 2015-01-21 2016-07-28 太陽インキ製造株式会社 熱硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PL344397A1 (en) 1998-06-02 2001-11-05 Bayer Ag Polyurethane ureas, polyurethane urea fibres and method for the production thereof
JP4343367B2 (ja) 1999-12-17 2009-10-14 旭化成せんい株式会社 耐熱性に優れたポリウレタンウレア弾性繊維
ATE348849T1 (de) 2002-02-23 2007-01-15 Bayer Materialscience Ag Verfahren zur herstellung von weichen, gut entformbaren thermoplastischen polyurethanelastomeren mit geringer schwindung
JP5209888B2 (ja) * 2006-03-09 2013-06-12 昭和電工株式会社 熱硬化性樹脂組成物及びその用途
TW200908839A (en) 2007-08-09 2009-02-16 Nichigo Morton Co Ltd Solder mask, photoresist pattern forming method and the light-emitting device thereof
WO2013089137A1 (ja) 2011-12-16 2013-06-20 東レ・オペロンテックス株式会社 ポリウレタン弾性繊維およびその製造方法
US10000622B2 (en) * 2013-11-25 2018-06-19 Shikoku Chemicals Corporation Glycolurils having functional groups and use thereof
JP7454906B2 (ja) 2016-10-14 2024-03-25 株式会社レゾナック アンダーフィル材、電子部品装置及び電子部品装置の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002293882A (ja) * 2001-03-30 2002-10-09 Taiyo Ink Mfg Ltd 光硬化性・熱硬化性樹脂組成物及びプリント配線板
JP2008214413A (ja) * 2007-03-01 2008-09-18 Toray Ind Inc 熱硬化性樹脂組成物
JP2015121775A (ja) * 2013-11-20 2015-07-02 四国化成工業株式会社 光硬化性・熱硬化性樹脂組成物およびプリント配線板
WO2016117237A1 (ja) * 2015-01-21 2016-07-28 太陽インキ製造株式会社 熱硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板

Also Published As

Publication number Publication date
TW202202940A (zh) 2022-01-16
KR20220140810A (ko) 2022-10-18
CN115380074B (zh) 2024-03-08
CN115380074A (zh) 2022-11-22
WO2021200032A1 (ja) 2021-10-07
JP7371321B2 (ja) 2023-10-31

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