JPWO2021199421A1 - - Google Patents

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Publication number
JPWO2021199421A1
JPWO2021199421A1 JP2022511478A JP2022511478A JPWO2021199421A1 JP WO2021199421 A1 JPWO2021199421 A1 JP WO2021199421A1 JP 2022511478 A JP2022511478 A JP 2022511478A JP 2022511478 A JP2022511478 A JP 2022511478A JP WO2021199421 A1 JPWO2021199421 A1 JP WO2021199421A1
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JP
Japan
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Application number
JP2022511478A
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JP7230276B2 (ja
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Publication of JPWO2021199421A1 publication Critical patent/JPWO2021199421A1/ja
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Publication of JP7230276B2 publication Critical patent/JP7230276B2/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2022511478A 2020-04-03 2020-04-03 回路形成方法および回路形成装置 Active JP7230276B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/015298 WO2021199421A1 (ja) 2020-04-03 2020-04-03 回路形成方法および回路形成装置

Publications (2)

Publication Number Publication Date
JPWO2021199421A1 true JPWO2021199421A1 (ja) 2021-10-07
JP7230276B2 JP7230276B2 (ja) 2023-02-28

Family

ID=77929946

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022511478A Active JP7230276B2 (ja) 2020-04-03 2020-04-03 回路形成方法および回路形成装置

Country Status (2)

Country Link
JP (1) JP7230276B2 (ja)
WO (1) WO2021199421A1 (ja)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004087551A (ja) * 2002-08-23 2004-03-18 Toppan Printing Co Ltd 多層配線基板の製造方法およびこれを用いた多層配線基板
JP2008034719A (ja) * 2006-07-31 2008-02-14 Fujifilm Corp 電気配線構造、液体吐出ヘッド、液体吐出装置、及び画像形成装置
JP2010067897A (ja) * 2008-09-12 2010-03-25 Hitachi Chem Co Ltd プリント配線板の製造方法
JP2012209460A (ja) * 2011-03-30 2012-10-25 Fujifilm Corp パターン形成方法およびパターン形成装置
WO2017009922A1 (ja) * 2015-07-13 2017-01-19 富士機械製造株式会社 配線形成方法および配線形成装置
WO2018142577A1 (ja) * 2017-02-03 2018-08-09 株式会社Ｆｕｊｉ 回路形成方法、および回路形成装置
WO2019123629A1 (ja) * 2017-12-22 2019-06-27 株式会社Ｆｕｊｉ ３次元積層電子デバイスの製造方法及び製造装置
WO2020012626A1 (ja) * 2018-07-13 2020-01-16 株式会社Ｆｕｊｉ 回路形成方法、および回路形成装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004087551A (ja) * 2002-08-23 2004-03-18 Toppan Printing Co Ltd 多層配線基板の製造方法およびこれを用いた多層配線基板
JP2008034719A (ja) * 2006-07-31 2008-02-14 Fujifilm Corp 電気配線構造、液体吐出ヘッド、液体吐出装置、及び画像形成装置
JP2010067897A (ja) * 2008-09-12 2010-03-25 Hitachi Chem Co Ltd プリント配線板の製造方法
JP2012209460A (ja) * 2011-03-30 2012-10-25 Fujifilm Corp パターン形成方法およびパターン形成装置
WO2017009922A1 (ja) * 2015-07-13 2017-01-19 富士機械製造株式会社 配線形成方法および配線形成装置
WO2018142577A1 (ja) * 2017-02-03 2018-08-09 株式会社Ｆｕｊｉ 回路形成方法、および回路形成装置
WO2019123629A1 (ja) * 2017-12-22 2019-06-27 株式会社Ｆｕｊｉ ３次元積層電子デバイスの製造方法及び製造装置
WO2020012626A1 (ja) * 2018-07-13 2020-01-16 株式会社Ｆｕｊｉ 回路形成方法、および回路形成装置

Also Published As

Publication number Publication date
JP7230276B2 (ja) 2023-02-28
WO2021199421A1 (ja) 2021-10-07

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