JPWO2021199355A1 - - Google Patents

Info

Publication number
JPWO2021199355A1
JPWO2021199355A1 JP2022511418A JP2022511418A JPWO2021199355A1 JP WO2021199355 A1 JPWO2021199355 A1 JP WO2021199355A1 JP 2022511418 A JP2022511418 A JP 2022511418A JP 2022511418 A JP2022511418 A JP 2022511418A JP WO2021199355 A1 JPWO2021199355 A1 JP WO2021199355A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022511418A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021199355A1 publication Critical patent/JPWO2021199355A1/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/20Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/14Peroxides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2022511418A 2020-03-31 2020-03-31 Pending JPWO2021199355A1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/014952 WO2021199355A1 (ja) 2020-03-31 2020-03-31 樹脂組成物及び粘着テープ

Publications (1)

Publication Number Publication Date
JPWO2021199355A1 true JPWO2021199355A1 (ko) 2021-10-07

Family

ID=77929805

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022511418A Pending JPWO2021199355A1 (ko) 2020-03-31 2020-03-31

Country Status (5)

Country Link
JP (1) JPWO2021199355A1 (ko)
KR (1) KR20230004554A (ko)
CN (1) CN115362218B (ko)
TW (1) TW202144504A (ko)
WO (1) WO2021199355A1 (ko)

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2962570B2 (ja) 1990-11-14 1999-10-12 ジャパンゴアテックス株式会社 ホットプレス積層用離型保護シート
US5308887A (en) * 1991-05-23 1994-05-03 Minnesota Mining & Manufacturing Company Pressure-sensitive adhesives
JP4809988B2 (ja) * 2001-03-21 2011-11-09 日東電工株式会社 シリコーン系感圧接着剤組成物およびそれを用いた感圧接着テープ
JP2004091703A (ja) * 2002-09-02 2004-03-25 Shin Etsu Chem Co Ltd 導電性シリコーン粘着剤組成物および粘着テープ
JP2006028311A (ja) * 2004-07-14 2006-02-02 Shin Etsu Chem Co Ltd 耐熱性に優れるシリコーン粘着剤組成物および製造方法
JP2008133433A (ja) * 2006-10-24 2008-06-12 Oji Paper Co Ltd 粘着シートおよび再剥離性の粘着シート
JP5872798B2 (ja) * 2011-06-14 2016-03-01 日東電工株式会社 再剥離用粘着テープおよびその製造方法
US8653190B2 (en) * 2011-08-08 2014-02-18 3M Innovative Properties Company Curable cyclic anhydride copolymer/silicone composition
WO2016174713A1 (ja) 2015-04-27 2016-11-03 株式会社寺岡製作所 離型用粘着テープ
CN109196070B (zh) * 2016-05-16 2021-09-14 株式会社寺冈制作所 粘着剂组合物和粘着带
KR102422197B1 (ko) * 2016-07-29 2022-07-20 가부시키가이샤 데라오카 세이사쿠쇼 감압 점착 시트
EP3504003B1 (en) * 2016-08-26 2023-01-25 Avery Dennison Corporation Silicone based pressure sensitive adhesive tapes
JP6799067B2 (ja) * 2016-09-26 2020-12-09 ダウ・東レ株式会社 硬化反応性シリコーンゲルおよびその用途
US20200164613A1 (en) * 2016-09-26 2020-05-28 Dow Corning Toray Co., Ltd. Laminate, method of manufacturing the same, and method of manufacturing electronic component
JP6884208B2 (ja) * 2017-06-28 2021-06-09 旭化成株式会社 樹脂組成物、樹脂組成物の製造方法及び成形体
JP6974479B2 (ja) * 2017-09-05 2021-12-01 株式会社寺岡製作所 シリコーン系粘着剤組成物及び粘着テープ

Also Published As

Publication number Publication date
CN115362218A (zh) 2022-11-18
WO2021199355A1 (ja) 2021-10-07
TW202144504A (zh) 2021-12-01
CN115362218B (zh) 2023-09-19
KR20230004554A (ko) 2023-01-06

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