JPWO2021193622A1 - - Google Patents

Info

Publication number
JPWO2021193622A1
JPWO2021193622A1 JP2022510540A JP2022510540A JPWO2021193622A1 JP WO2021193622 A1 JPWO2021193622 A1 JP WO2021193622A1 JP 2022510540 A JP2022510540 A JP 2022510540A JP 2022510540 A JP2022510540 A JP 2022510540A JP WO2021193622 A1 JPWO2021193622 A1 JP WO2021193622A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022510540A
Other languages
Japanese (ja)
Other versions
JPWO2021193622A5 (https=
JP7358625B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021193622A1 publication Critical patent/JPWO2021193622A1/ja
Publication of JPWO2021193622A5 publication Critical patent/JPWO2021193622A5/ja
Application granted granted Critical
Publication of JP7358625B2 publication Critical patent/JP7358625B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for supporting printed circuit boards
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for supporting printed circuit boards
    • G06F1/187—Mounting of fixed or removable disk drives
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10159—Memory
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP2022510540A 2020-03-27 2021-03-23 電子機器 Active JP7358625B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020059186 2020-03-27
JP2020059186 2020-03-27
PCT/JP2021/011968 WO2021193622A1 (ja) 2020-03-27 2021-03-23 電子機器

Publications (3)

Publication Number Publication Date
JPWO2021193622A1 true JPWO2021193622A1 (https=) 2021-09-30
JPWO2021193622A5 JPWO2021193622A5 (https=) 2022-12-06
JP7358625B2 JP7358625B2 (ja) 2023-10-10

Family

ID=77892181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022510540A Active JP7358625B2 (ja) 2020-03-27 2021-03-23 電子機器

Country Status (5)

Country Link
US (1) US11985766B2 (https=)
EP (1) EP4132247A4 (https=)
JP (1) JP7358625B2 (https=)
CN (1) CN115299192B (https=)
WO (1) WO2021193622A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118872398A (zh) 2022-04-11 2024-10-29 索尼互动娱乐股份有限公司 电子设备
JP7824406B2 (ja) 2022-04-11 2026-03-04 株式会社ソニー・インタラクティブエンタテインメント 電子機器
JP1762685S (ja) * 2023-05-31 2024-01-31 電子計算機用演算制御機のカバー部品
JP1762686S (ja) * 2023-05-31 2024-01-31 電子計算機用演算制御機のカバー部品
JP1762722S (ja) * 2023-05-31 2024-01-31 電子計算機用演算制御機のカバー部品
JP1762721S (ja) * 2023-05-31 2024-01-31 電子計算機用演算制御機のカバー部品
JP1758957S (ja) * 2023-06-23 2023-12-06 電子計算機用演算制御機のカバー部品
CN120071979A (zh) * 2023-11-28 2025-05-30 上海宝存信息科技有限公司 电子装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0784673A (ja) * 1993-09-09 1995-03-31 Toshiba Corp 携帯型電子機器およびその組み立て方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01273392A (ja) 1988-04-26 1989-11-01 Canon Inc 電子機器
JP2553438Y2 (ja) 1989-04-27 1997-11-05 日本エー・エム・ピー 株式会社 メモリカードコネクタ
US5715139A (en) * 1993-09-09 1998-02-03 Kabushiki Kaisha Toshiba Portable electronic apparatus having a frame supporting functional components, and method of assembling the portable electronic apparatus
US5880930A (en) * 1997-06-18 1999-03-09 Silicon Graphics, Inc. Electromagnetic interference shielding enclosure and heat sink with compression coupling mechanism
TWM286969U (en) * 2005-10-18 2006-02-01 Datafab Sys Inc Card reader of memory card type
US20080266807A1 (en) * 2007-04-27 2008-10-30 Cray Inc. Electronic assembly with emi shielding heat sink
US20110255250A1 (en) * 2010-04-19 2011-10-20 Richard Hung Minh Dinh Printed circuit board components for electronic devices
KR20120131530A (ko) * 2011-05-25 2012-12-05 삼성전자주식회사 반도체 장치 및 그 제조 방법
KR20130010359A (ko) * 2011-07-18 2013-01-28 삼성전자주식회사 반도체 장치용 기판 및 그를 포함한 반도체 장치
KR101992596B1 (ko) * 2011-08-16 2019-06-25 삼성전자 주식회사 반도체 장치
KR102437673B1 (ko) * 2015-09-09 2022-08-26 삼성전자주식회사 반도체 장치
KR102583890B1 (ko) * 2016-02-18 2023-10-05 삼성전자주식회사 열 수집/확산 구조를 가진 전자 장치
JP6466373B2 (ja) 2016-07-29 2019-02-06 株式会社ソニー・インタラクティブエンタテインメント 電子機器及びハードディスク装置のホルダー
US10490511B2 (en) * 2017-06-01 2019-11-26 Mediatek Inc. Microelectronic assembly with electromagnetic shielding

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0784673A (ja) * 1993-09-09 1995-03-31 Toshiba Corp 携帯型電子機器およびその組み立て方法

Also Published As

Publication number Publication date
US20230116950A1 (en) 2023-04-20
CN115299192B (zh) 2025-07-04
CN115299192A (zh) 2022-11-04
JP7358625B2 (ja) 2023-10-10
EP4132247A1 (en) 2023-02-08
EP4132247A4 (en) 2024-04-24
US11985766B2 (en) 2024-05-14
WO2021193622A1 (ja) 2021-09-30

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