JP7358625B2 - 電子機器 - Google Patents

電子機器 Download PDF

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Publication number
JP7358625B2
JP7358625B2 JP2022510540A JP2022510540A JP7358625B2 JP 7358625 B2 JP7358625 B2 JP 7358625B2 JP 2022510540 A JP2022510540 A JP 2022510540A JP 2022510540 A JP2022510540 A JP 2022510540A JP 7358625 B2 JP7358625 B2 JP 7358625B2
Authority
JP
Japan
Prior art keywords
electronic device
heat
exterior panel
wall
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022510540A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2021193622A1 (https=
JPWO2021193622A5 (https=
Inventor
勝志 伊藤
康宏 鳳
信之 菅原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Interactive Entertainment Inc
Original Assignee
Sony Interactive Entertainment Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Interactive Entertainment Inc filed Critical Sony Interactive Entertainment Inc
Publication of JPWO2021193622A1 publication Critical patent/JPWO2021193622A1/ja
Publication of JPWO2021193622A5 publication Critical patent/JPWO2021193622A5/ja
Application granted granted Critical
Publication of JP7358625B2 publication Critical patent/JP7358625B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for supporting printed circuit boards
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for supporting printed circuit boards
    • G06F1/187—Mounting of fixed or removable disk drives
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10159—Memory
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP2022510540A 2020-03-27 2021-03-23 電子機器 Active JP7358625B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020059186 2020-03-27
JP2020059186 2020-03-27
PCT/JP2021/011968 WO2021193622A1 (ja) 2020-03-27 2021-03-23 電子機器

Publications (3)

Publication Number Publication Date
JPWO2021193622A1 JPWO2021193622A1 (https=) 2021-09-30
JPWO2021193622A5 JPWO2021193622A5 (https=) 2022-12-06
JP7358625B2 true JP7358625B2 (ja) 2023-10-10

Family

ID=77892181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022510540A Active JP7358625B2 (ja) 2020-03-27 2021-03-23 電子機器

Country Status (5)

Country Link
US (1) US11985766B2 (https=)
EP (1) EP4132247A4 (https=)
JP (1) JP7358625B2 (https=)
CN (1) CN115299192B (https=)
WO (1) WO2021193622A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118872398A (zh) 2022-04-11 2024-10-29 索尼互动娱乐股份有限公司 电子设备
JP7824406B2 (ja) 2022-04-11 2026-03-04 株式会社ソニー・インタラクティブエンタテインメント 電子機器
JP1762685S (ja) * 2023-05-31 2024-01-31 電子計算機用演算制御機のカバー部品
JP1762686S (ja) * 2023-05-31 2024-01-31 電子計算機用演算制御機のカバー部品
JP1762722S (ja) * 2023-05-31 2024-01-31 電子計算機用演算制御機のカバー部品
JP1762721S (ja) * 2023-05-31 2024-01-31 電子計算機用演算制御機のカバー部品
JP1758957S (ja) * 2023-06-23 2023-12-06 電子計算機用演算制御機のカバー部品
CN120071979A (zh) * 2023-11-28 2025-05-30 上海宝存信息科技有限公司 电子装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01273392A (ja) 1988-04-26 1989-11-01 Canon Inc 電子機器
JP2553438Y2 (ja) 1989-04-27 1997-11-05 日本エー・エム・ピー 株式会社 メモリカードコネクタ
US5715139A (en) * 1993-09-09 1998-02-03 Kabushiki Kaisha Toshiba Portable electronic apparatus having a frame supporting functional components, and method of assembling the portable electronic apparatus
JPH0784673A (ja) 1993-09-09 1995-03-31 Toshiba Corp 携帯型電子機器およびその組み立て方法
US5880930A (en) * 1997-06-18 1999-03-09 Silicon Graphics, Inc. Electromagnetic interference shielding enclosure and heat sink with compression coupling mechanism
TWM286969U (en) * 2005-10-18 2006-02-01 Datafab Sys Inc Card reader of memory card type
US20080266807A1 (en) * 2007-04-27 2008-10-30 Cray Inc. Electronic assembly with emi shielding heat sink
US20110255250A1 (en) * 2010-04-19 2011-10-20 Richard Hung Minh Dinh Printed circuit board components for electronic devices
KR20120131530A (ko) * 2011-05-25 2012-12-05 삼성전자주식회사 반도체 장치 및 그 제조 방법
KR20130010359A (ko) * 2011-07-18 2013-01-28 삼성전자주식회사 반도체 장치용 기판 및 그를 포함한 반도체 장치
KR101992596B1 (ko) * 2011-08-16 2019-06-25 삼성전자 주식회사 반도체 장치
KR102437673B1 (ko) * 2015-09-09 2022-08-26 삼성전자주식회사 반도체 장치
KR102583890B1 (ko) * 2016-02-18 2023-10-05 삼성전자주식회사 열 수집/확산 구조를 가진 전자 장치
JP6466373B2 (ja) 2016-07-29 2019-02-06 株式会社ソニー・インタラクティブエンタテインメント 電子機器及びハードディスク装置のホルダー
US10490511B2 (en) * 2017-06-01 2019-11-26 Mediatek Inc. Microelectronic assembly with electromagnetic shielding

Also Published As

Publication number Publication date
US20230116950A1 (en) 2023-04-20
CN115299192B (zh) 2025-07-04
CN115299192A (zh) 2022-11-04
JPWO2021193622A1 (https=) 2021-09-30
EP4132247A1 (en) 2023-02-08
EP4132247A4 (en) 2024-04-24
US11985766B2 (en) 2024-05-14
WO2021193622A1 (ja) 2021-09-30

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