JPWO2021193354A5 - - Google Patents

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JPWO2021193354A5
JPWO2021193354A5 JP2021516506A JP2021516506A JPWO2021193354A5 JP WO2021193354 A5 JPWO2021193354 A5 JP WO2021193354A5 JP 2021516506 A JP2021516506 A JP 2021516506A JP 2021516506 A JP2021516506 A JP 2021516506A JP WO2021193354 A5 JPWO2021193354 A5 JP WO2021193354A5
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group
resin composition
composition according
film
particles
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JP2021516506A
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JPWO2021193354A1 (en
JP7095803B2 (en
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Priority claimed from PCT/JP2021/011087 external-priority patent/WO2021193354A1/en
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微粒子、一般式（１）で表される構造及び熱によりアミノ基を生じる官能基を有する化合物（Ｂ）、並びにバインダー樹脂（Ｃ）を含有し、
前記微粒子が、炭素を含む被覆層を有する無機粒子（Ｇ）である、樹脂組成物。
Figure 2021193354000001
 （一般式（１）中、ＸはＳｉ、Ｔｉ又はＺｒ原子を示す。Ｒ１～Ｒ３はそれぞれ独立に、ヒドロキシ基、メトキシ基、エトキシ基、プロポキシ基、イソプロポキシ基、ブトキシ基、イソブトキシ基又は炭素数１～６の炭化水素基を示す。Ｒ１～Ｒ３はそれぞれ同じであっても異なっていてもよいが、少なくとも一つはヒドロキシ基、メトキシ基、エトキシ基、プロポキシ基、イソプロポキシ基、ブトキシ基又はイソブトキシ基である。） It contains fine particles, a compound (B) having a structure represented by the general formula (1) and a functional group that produces an amino group by heat, and a binder resin (C).
A resin composition in which the fine particles are inorganic particles (G) having a coating layer containing carbon .
Figure 2021193354000001
 (In the general formula (1), X represents a Si, Ti or Zr atom. R 1 to R 3 independently represent a hydroxy group, a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, a butoxy group and an isobutoxy group. Alternatively, it indicates a hydrocarbon group having 1 to 6 carbon atoms. R 1 to R 3 may be the same or different, but at least one is a hydroxy group, a methoxy group, an ethoxy group, a propoxy group, or an isopropoxy. Group, butoxy group or isobutoxy group.) 前記無機粒子（Ｇ）が導電性粒子（Ａ）である、請求項１記載の樹脂組成物。 The resin composition according to claim 1, wherein the inorganic particles (G) are conductive particles (A). 前記導電性粒子（Ａ）の、濃度１質量％の水の懸濁液のｐＨが４．０～１０．０である、請求項２記載の樹脂組成物。 The resin composition according to claim 2, wherein the pH of the suspension of the conductive particles (A) in water having a concentration of 1% by mass is 4.0 to 10.0. 前記微粒子の平均１次粒子径が１～７００ｎｍである、請求項１記載の樹脂組成物。 The resin composition according to claim 1, wherein the fine particles have an average primary particle diameter of 1 to 700 nm. 前記微粒子１００質量部に対し、前記化合物（Ｂ）を０．１～２．５質量部含有する、請求項１記載の樹脂組成物。 The resin composition according to claim 1, wherein the compound (B) is contained in an amount of 0.1 to 2.5 parts by mass with respect to 100 parts by mass of the fine particles. 前記無機粒子（Ｇ）が無機顔料である、請求項１記載の樹脂組成物。 The resin composition according to claim 1, wherein the inorganic particles (G) are inorganic pigments. 前記熱によりアミノ基を生じる官能基が、ウレイド基である、請求項１～６のいずれか一項に記載の樹脂組成物。 The resin composition according to any one of claims 1 to 6, wherein the functional group that produces an amino group by heat is a ureido group. 前記バインダー樹脂（Ｃ）が酸解離性基を有する、請求項１～７のいずれか一項に記載の樹脂組成物。 The resin composition according to any one of claims 1 to 7 , wherein the binder resin (C) has an acid dissociative group. 請求項１～８のいずれか一項に記載の樹脂組成物の硬化物からなる導電性パターンを具備する配線基板。 A wiring board provided with a conductive pattern made of a cured product of the resin composition according to any one of claims 1 to 8 . さらに黒色層を有する、請求項９に記載の配線基板。 The wiring board according to claim 9 , further comprising a black layer. 前記導電性パターンの幅が１～６μｍである、請求項９または１０に記載の配線基板。 The wiring board according to claim 9 or 10, wherein the width of the conductive pattern is 1 to 6 μm. 請求項９～１１のいずれか一項に記載の配線基板を有する、タッチパネル。 A touch panel having the wiring board according to any one of claims 9 to 11 . 請求項１～８のいずれか一項に記載の樹脂組成物を、基板上に塗布して塗布膜を得る塗布工程と、
前記塗布膜を乾燥して乾燥膜を得る乾燥工程と、
前記乾燥膜を露光して露光膜を得る露光工程と、
前記露光膜を現像してパターンを形成する現像工程と、
前記パターンを加熱して導電膜を得る加熱工程と、
を備える導電性パターンの製造方法。 A coating step of applying the resin composition according to any one of claims 1 to 8 onto a substrate to obtain a coating film, and a coating step.
The drying step of drying the coating film to obtain a dry film, and
An exposure step of exposing the dry film to obtain an exposure film, and
A developing step of developing the exposure film to form a pattern, and
A heating step of heating the pattern to obtain a conductive film,
A method for manufacturing a conductive pattern.
JP2021516506A 2020-03-27 2021-03-18 Method for manufacturing resin composition, wiring board and conductive pattern Active JP7095803B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020057218 2020-03-27
JP2020057218 2020-03-27
PCT/JP2021/011087 WO2021193354A1 (en) 2020-03-27 2021-03-18 Resin composition, wiring board and method for producing conductive pattern

Publications (3)

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JPWO2021193354A1 JPWO2021193354A1 (en) 2021-09-30
JPWO2021193354A5 true JPWO2021193354A5 (en) 2022-03-04
JP7095803B2 JP7095803B2 (en) 2022-07-05

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JP2021516506A Active JP7095803B2 (en) 2020-03-27 2021-03-18 Method for manufacturing resin composition, wiring board and conductive pattern

Country Status (5)

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JP (1) JP7095803B2 (en)
KR (1) KR20220158678A (en)
CN (1) CN115210322B (en)
TW (1) TW202204501A (en)
WO (1) WO2021193354A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115478436B (en) * 2022-09-30 2023-05-30 建滔(清远)电子材料有限公司 Electronic grade glass fiber cloth produced by ultra-low twist glass fiber yarn

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4062805B2 (en) 1999-01-06 2008-03-19 東レ株式会社 Photosensitive conductive paste for firing and method for forming fine electrode pattern
JP2007091825A (en) * 2005-09-27 2007-04-12 Mitsubishi Rayon Co Ltd Curable composition
JP5281357B2 (en) * 2008-10-23 2013-09-04 新日鉄住金化学株式会社 Photosensitive resin composition for black resist and color filter light-shielding film
JP2013196997A (en) 2012-03-22 2013-09-30 Toray Ind Inc Conductive composition
JP5934533B2 (en) * 2012-03-23 2016-06-15 富士フイルム株式会社 Multi-layer film and optical sheet
JP2015193758A (en) * 2014-03-31 2015-11-05 東洋インキＳｃホールディングス株式会社 Photosensitive resin composition for overcoat and coating film using the same
JP6476660B2 (en) * 2014-08-29 2019-03-06 日立化成株式会社 Photocurable resin composition, photocurable light-shielding coating material using the same, liquid crystal display panel, and liquid crystal display device
JP6841233B2 (en) * 2016-09-30 2021-03-10 東レ株式会社 Photosensitive resin composition, method for manufacturing conductive patterns, substrates, touch panels and displays
JP6699691B2 (en) * 2018-08-06 2020-05-27 東洋インキＳｃホールディングス株式会社 Black composition, black coating film, and laminate

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