JPWO2021182277A1 - - Google Patents

Info

Publication number
JPWO2021182277A1
JPWO2021182277A1 JP2022505993A JP2022505993A JPWO2021182277A1 JP WO2021182277 A1 JPWO2021182277 A1 JP WO2021182277A1 JP 2022505993 A JP2022505993 A JP 2022505993A JP 2022505993 A JP2022505993 A JP 2022505993A JP WO2021182277 A1 JPWO2021182277 A1 JP WO2021182277A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022505993A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021182277A1 publication Critical patent/JPWO2021182277A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2022505993A 2020-03-13 2021-03-04 Pending JPWO2021182277A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020044714 2020-03-13
PCT/JP2021/008368 WO2021182277A1 (ja) 2020-03-13 2021-03-04 研磨用組成物および研磨方法

Publications (1)

Publication Number Publication Date
JPWO2021182277A1 true JPWO2021182277A1 (ja) 2021-09-16

Family

ID=77670994

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022505993A Pending JPWO2021182277A1 (ja) 2020-03-13 2021-03-04

Country Status (7)

Country Link
US (1) US20230174821A1 (ja)
EP (1) EP4120323A4 (ja)
JP (1) JPWO2021182277A1 (ja)
KR (1) KR20220150962A (ja)
CN (1) CN115244657A (ja)
TW (1) TW202138533A (ja)
WO (1) WO2021182277A1 (ja)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100497412B1 (ko) * 2002-12-12 2005-06-28 제일모직주식회사 실리콘 웨이퍼의 최종 연마용 슬러리 조성물
JP5196819B2 (ja) 2007-03-19 2013-05-15 ニッタ・ハース株式会社 研磨用組成物
JP5297695B2 (ja) * 2008-05-30 2013-09-25 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 スラリー供給装置及び同装置を用いる半導体ウェーハの研磨方法
JP7087870B2 (ja) 2018-09-19 2022-06-21 大日本印刷株式会社 包装材料
JP6761554B1 (ja) * 2020-01-22 2020-09-23 日本酢ビ・ポバール株式会社 研磨用組成物

Also Published As

Publication number Publication date
US20230174821A1 (en) 2023-06-08
WO2021182277A1 (ja) 2021-09-16
CN115244657A (zh) 2022-10-25
EP4120323A1 (en) 2023-01-18
EP4120323A4 (en) 2024-03-27
TW202138533A (zh) 2021-10-16
KR20220150962A (ko) 2022-11-11

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240119