JPWO2021182276A1 - - Google Patents
Info
- Publication number
- JPWO2021182276A1 JPWO2021182276A1 JP2022505992A JP2022505992A JPWO2021182276A1 JP WO2021182276 A1 JPWO2021182276 A1 JP WO2021182276A1 JP 2022505992 A JP2022505992 A JP 2022505992A JP 2022505992 A JP2022505992 A JP 2022505992A JP WO2021182276 A1 JPWO2021182276 A1 JP WO2021182276A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020044111 | 2020-03-13 | ||
PCT/JP2021/008366 WO2021182276A1 (ja) | 2020-03-13 | 2021-03-04 | 研磨用組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2021182276A1 true JPWO2021182276A1 (ko) | 2021-09-16 |
Family
ID=77672325
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022505992A Pending JPWO2021182276A1 (ko) | 2020-03-13 | 2021-03-04 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2021182276A1 (ko) |
TW (1) | TW202138534A (ko) |
WO (1) | WO2021182276A1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023189812A1 (ja) * | 2022-03-31 | 2023-10-05 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102239045B1 (ko) * | 2013-06-07 | 2021-04-12 | 가부시키가이샤 후지미인코퍼레이티드 | 실리콘 웨이퍼 연마용 조성물 |
JP6129336B2 (ja) * | 2013-11-08 | 2017-05-17 | 東亞合成株式会社 | 半導体用濡れ剤及び研磨用組成物 |
JP6797796B2 (ja) * | 2015-07-01 | 2020-12-09 | 東亞合成株式会社 | 研磨用濡れ剤及び研磨液組成物 |
KR20190045249A (ko) * | 2016-08-31 | 2019-05-02 | 가부시키가이샤 후지미인코퍼레이티드 | 연마용 조성물 및 연마용 조성물 세트 |
-
2021
- 2021-03-04 WO PCT/JP2021/008366 patent/WO2021182276A1/ja active Application Filing
- 2021-03-04 JP JP2022505992A patent/JPWO2021182276A1/ja active Pending
- 2021-03-12 TW TW110108839A patent/TW202138534A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2021182276A1 (ja) | 2021-09-16 |
TW202138534A (zh) | 2021-10-16 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240119 |