JPWO2021181830A1 - - Google Patents

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Publication number
JPWO2021181830A1
JPWO2021181830A1 JP2022505784A JP2022505784A JPWO2021181830A1 JP WO2021181830 A1 JPWO2021181830 A1 JP WO2021181830A1 JP 2022505784 A JP2022505784 A JP 2022505784A JP 2022505784 A JP2022505784 A JP 2022505784A JP WO2021181830 A1 JPWO2021181830 A1 JP WO2021181830A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2022505784A
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JP7354409B2 (ja
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Publication of JPWO2021181830A1 publication Critical patent/JPWO2021181830A1/ja
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/696—Circuits therefor, e.g. constant-current flow meters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Fluid Mechanics (AREA)
  • Testing Or Calibration Of Command Recording Devices (AREA)
  • Arrangements For Transmission Of Measured Signals (AREA)
JP2022505784A 2020-03-09 2020-12-25 物理量測定装置 Active JP7354409B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020039784 2020-03-09
JP2020039784 2020-03-09
PCT/JP2020/048706 WO2021181830A1 (ja) 2020-03-09 2020-12-25 物理量測定装置

Publications (2)

Publication Number Publication Date
JPWO2021181830A1 true JPWO2021181830A1 (ja) 2021-09-16
JP7354409B2 JP7354409B2 (ja) 2023-10-02

Family

ID=77671610

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022505784A Active JP7354409B2 (ja) 2020-03-09 2020-12-25 物理量測定装置

Country Status (2)

Country Link
JP (1) JP7354409B2 (ja)
WO (1) WO2021181830A1 (ja)

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001236797A (ja) * 1999-12-17 2001-08-31 Fujitsu Ltd 自己試験回路及びそれを内蔵するメモリデバイス
WO2006025140A1 (ja) * 2004-09-02 2006-03-09 Matsushita Electric Industrial Co., Ltd. 半導体集積回路装置およびその検査方法、半導体ウエハ、およびバーンイン検査装置
WO2006080111A1 (ja) * 2005-01-27 2006-08-03 Matsushita Electric Industrial Co., Ltd. 半導体集積回路及びシステムｌｓｉ
JP2007024659A (ja) * 2005-07-15 2007-02-01 Fujitsu Ltd 集積回路及び回路ボード
JP2007309773A (ja) * 2006-05-18 2007-11-29 Renesas Technology Corp 半導体集積回路およびその診断方法
JP2009047557A (ja) * 2007-08-20 2009-03-05 Fujitsu Ltd 半導体装置
US20100271064A1 (en) * 2009-04-28 2010-10-28 Kohler Ross A Integrated Circuit Self-Monitored Burn-In
JP2014046730A (ja) * 2012-08-30 2014-03-17 Hitachi Automotive Systems Ltd 車載用電子制御装置
JP2014086876A (ja) * 2012-10-23 2014-05-12 Seiko Epson Corp シリアル通信回路、集積回路装置、物理量測定装置、電子機器、移動体およびシリアル通信方法
JP2014238348A (ja) * 2013-06-10 2014-12-18 三菱電機株式会社 集積回路素子を有する電子制御装置及びその集積回路素子の単品検査装置
JP2018055571A (ja) * 2016-09-30 2018-04-05 横河電機株式会社 アプリケーション開発環境提供システム、アプリケーション開発環境提供方法、アプリケーション開発環境提供プログラム、及び端末装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113711065B (zh) * 2019-04-23 2024-07-30 日立安斯泰莫株式会社 半导体集成电路装置和半导体集成电路装置的检查方法

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001236797A (ja) * 1999-12-17 2001-08-31 Fujitsu Ltd 自己試験回路及びそれを内蔵するメモリデバイス
WO2006025140A1 (ja) * 2004-09-02 2006-03-09 Matsushita Electric Industrial Co., Ltd. 半導体集積回路装置およびその検査方法、半導体ウエハ、およびバーンイン検査装置
WO2006080111A1 (ja) * 2005-01-27 2006-08-03 Matsushita Electric Industrial Co., Ltd. 半導体集積回路及びシステムｌｓｉ
JP2007024659A (ja) * 2005-07-15 2007-02-01 Fujitsu Ltd 集積回路及び回路ボード
JP2007309773A (ja) * 2006-05-18 2007-11-29 Renesas Technology Corp 半導体集積回路およびその診断方法
JP2009047557A (ja) * 2007-08-20 2009-03-05 Fujitsu Ltd 半導体装置
US20100271064A1 (en) * 2009-04-28 2010-10-28 Kohler Ross A Integrated Circuit Self-Monitored Burn-In
JP2014046730A (ja) * 2012-08-30 2014-03-17 Hitachi Automotive Systems Ltd 車載用電子制御装置
JP2014086876A (ja) * 2012-10-23 2014-05-12 Seiko Epson Corp シリアル通信回路、集積回路装置、物理量測定装置、電子機器、移動体およびシリアル通信方法
JP2014238348A (ja) * 2013-06-10 2014-12-18 三菱電機株式会社 集積回路素子を有する電子制御装置及びその集積回路素子の単品検査装置
JP2018055571A (ja) * 2016-09-30 2018-04-05 横河電機株式会社 アプリケーション開発環境提供システム、アプリケーション開発環境提供方法、アプリケーション開発環境提供プログラム、及び端末装置

Also Published As

Publication number Publication date
JP7354409B2 (ja) 2023-10-02
WO2021181830A1 (ja) 2021-09-16

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