JPWO2021177436A1 - - Google Patents

Info

Publication number
JPWO2021177436A1
JPWO2021177436A1 JP2022504473A JP2022504473A JPWO2021177436A1 JP WO2021177436 A1 JPWO2021177436 A1 JP WO2021177436A1 JP 2022504473 A JP2022504473 A JP 2022504473A JP 2022504473 A JP2022504473 A JP 2022504473A JP WO2021177436 A1 JPWO2021177436 A1 JP WO2021177436A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022504473A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021177436A1 publication Critical patent/JPWO2021177436A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
    • B23K31/125—Weld quality monitoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K9/00—Arc welding or cutting
    • B23K9/02—Seam welding; Backing means; Inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K9/00—Arc welding or cutting
    • B23K9/095—Monitoring or automatic control of welding parameters
    • B23K9/0953—Monitoring or automatic control of welding parameters using computing means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/005—Manipulators for mechanical processing tasks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1679—Programme controls characterised by the tasks executed
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32189—Compare between original solid model and measured manufactured object
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32222—Fault, defect detection of origin of fault, defect of product
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32228—Repair, rework of manufactured article
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45066—Inspection robot
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45104—Lasrobot, welding robot

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Robotics (AREA)
  • Software Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Data Mining & Analysis (AREA)
  • Evolutionary Computation (AREA)
  • Medical Informatics (AREA)
  • Artificial Intelligence (AREA)
  • Computing Systems (AREA)
  • Mathematical Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Manipulator (AREA)
JP2022504473A 2020-03-05 2021-03-05 Pending JPWO2021177436A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020038203 2020-03-05
PCT/JP2021/008627 WO2021177436A1 (ja) 2020-03-05 2021-03-05 ビード外観検査装置、ビード外観検査方法、プログラムおよびビード外観検査システム

Publications (1)

Publication Number Publication Date
JPWO2021177436A1 true JPWO2021177436A1 (ja) 2021-09-10

Family

ID=77614076

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022504473A Pending JPWO2021177436A1 (ja) 2020-03-05 2021-03-05

Country Status (4)

Country Link
US (1) US20220410323A1 (ja)
JP (1) JPWO2021177436A1 (ja)
CN (1) CN115210035A (ja)
WO (1) WO2021177436A1 (ja)

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6016673B2 (ja) * 1978-12-25 1985-04-26 川崎重工業株式会社 サ−ボ系における被検体認識装置
US5542600A (en) * 1991-11-07 1996-08-06 Omron Corporation Automatic soldering apparatus, apparatus and method for teaching same, soldering inspection apparatus and method, and apparatus and method for automatically correcting soldering
JP3223414B2 (ja) * 1995-10-03 2001-10-29 株式会社日立製作所 物体形状検出方法および装置並びに自動加工システム
JP4267789B2 (ja) * 2000-01-24 2009-05-27 日立建機株式会社 溶接ビード形状の検出方法および装置
JP2005014026A (ja) * 2003-06-24 2005-01-20 Enshu Ltd 溶接部の検査方法及び溶接支援システム
JP4724663B2 (ja) * 2003-09-30 2011-07-13 パナソニック株式会社 光学部品用型
JP3998642B2 (ja) * 2004-01-23 2007-10-31 アンリツ株式会社 印刷はんだ検査サービス方法及び印刷はんだ検査装置
US8274013B2 (en) * 2009-03-09 2012-09-25 Lincoln Global, Inc. System for tracking and analyzing welding activity
MX346755B (es) * 2012-04-23 2017-03-28 Lincoln Global Inc Sistema y método para monitorear calidad de soldadura.
CN103134809B (zh) * 2013-03-14 2015-04-29 苏州华源包装股份有限公司 焊缝缺陷检测方法
CN103817406B (zh) * 2014-02-21 2016-03-30 唐山松下产业机器有限公司 焊接电源管理系统及其管理方法
JP6418005B2 (ja) * 2015-02-26 2018-11-07 新日鐵住金株式会社 アンダーカット欠陥の検出方法、アンダーカット欠陥の検出装置、及び、隅肉アーク溶接方法
CA2993824A1 (en) * 2015-07-29 2017-02-02 Illinois Tool Works Inc. System and method to facilitate welding software as a service
CN105364266B (zh) * 2015-12-18 2017-11-28 广东省自动化研究所 一种机械臂运动轨迹调整系统及方法
JP2017181263A (ja) * 2016-03-30 2017-10-05 アイシン精機株式会社 欠陥検出装置
JP7053366B2 (ja) * 2018-05-10 2022-04-12 株式会社荏原製作所 検査装置及び検査方法
CN108637435B (zh) * 2018-05-16 2020-07-28 华南理工大学 一种基于视觉与弧压传感的三维焊缝跟踪系统及方法

Also Published As

Publication number Publication date
WO2021177436A1 (ja) 2021-09-10
CN115210035A (zh) 2022-10-18
US20220410323A1 (en) 2022-12-29

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Effective date: 20230921