JPWO2021166211A1 - - Google Patents
Info
- Publication number
- JPWO2021166211A1 JPWO2021166211A1 JP2022501546A JP2022501546A JPWO2021166211A1 JP WO2021166211 A1 JPWO2021166211 A1 JP WO2021166211A1 JP 2022501546 A JP2022501546 A JP 2022501546A JP 2022501546 A JP2022501546 A JP 2022501546A JP WO2021166211 A1 JPWO2021166211 A1 JP WO2021166211A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/043—Feeding one by one by other means than belts
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/40—Extraction of image or video features
- G06V10/60—Extraction of image or video features relating to illumination properties, e.g. using a reflectance or lighting model
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/041—Incorporating a pick-up tool having multiple pick-up tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/086—Supply management, e.g. supply of components or of substrates
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2020/006997 WO2021166211A1 (ja) | 2020-02-21 | 2020-02-21 | 部品装着機 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2021166211A1 true JPWO2021166211A1 (ja) | 2021-08-26 |
JP7228075B2 JP7228075B2 (ja) | 2023-02-22 |
Family
ID=77390537
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022501546A Active JP7228075B2 (ja) | 2020-02-21 | 2020-02-21 | 部品装着機 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20230106149A1 (ja) |
EP (1) | EP4110032A4 (ja) |
JP (1) | JP7228075B2 (ja) |
CN (1) | CN115088402B (ja) |
WO (1) | WO2021166211A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024062597A1 (ja) * | 2022-09-22 | 2024-03-28 | 株式会社Fuji | 部品認識装置および部品認識方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6245092A (ja) * | 1985-08-23 | 1987-02-27 | 株式会社日立製作所 | 部品位置及び姿勢認識方法及び同認識装置 |
WO2017208325A1 (ja) * | 2016-05-31 | 2017-12-07 | 富士機械製造株式会社 | 部品供給システム |
JP2018170513A (ja) * | 2018-06-07 | 2018-11-01 | 株式会社Fuji | ばら部品供給装置、部品実装装置およびばら部品供給方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2554431B2 (ja) * | 1992-11-05 | 1996-11-13 | ヤマハ発動機株式会社 | 実装機の部品吸着状態検出装置 |
US6584683B2 (en) * | 1996-04-18 | 2003-07-01 | Matsushita Electric Industrial Co., Ltd. | Mounting electronic component method and apparatus |
JP4561562B2 (ja) * | 2005-09-27 | 2010-10-13 | パナソニック株式会社 | 画像認識用データ作成装置および画像認識用データ作成方法 |
JP5457665B2 (ja) * | 2008-12-22 | 2014-04-02 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
JP5406682B2 (ja) | 2009-11-25 | 2014-02-05 | 日東工業株式会社 | 電子部品供給装置 |
JP2013026385A (ja) * | 2011-07-20 | 2013-02-04 | Hitachi High-Tech Instruments Co Ltd | 電子部品実装装置及び電子部品実装方法 |
JP5988839B2 (ja) * | 2012-11-15 | 2016-09-07 | 富士機械製造株式会社 | 部品実装機 |
JP6450923B2 (ja) * | 2013-12-20 | 2019-01-16 | パナソニックIpマネジメント株式会社 | 電子部品実装システムおよび電子部品実装方法ならびに電子部品実装装置 |
CN110719729A (zh) * | 2014-06-03 | 2020-01-21 | 株式会社富士 | 元件安装装置及散装元件供给方法 |
JP6245092B2 (ja) | 2014-06-27 | 2017-12-13 | 株式会社オートネットワーク技術研究所 | 電流制御装置 |
US10314217B2 (en) * | 2015-03-18 | 2019-06-04 | Fuji Corporation | Component supply device |
WO2018096577A1 (ja) * | 2016-11-22 | 2018-05-31 | 株式会社Fuji | 画像処理システム及び画像処理方法 |
JP6974101B2 (ja) * | 2017-10-02 | 2021-12-01 | ヤマハ発動機株式会社 | 設定装置、及び、表面実装機 |
WO2020031366A1 (ja) * | 2018-08-10 | 2020-02-13 | 株式会社Fuji | 部品装着機の管理装置 |
CN114788436B (zh) * | 2019-12-16 | 2023-11-10 | 株式会社富士 | 元件安装机 |
-
2020
- 2020-02-21 CN CN202080096469.3A patent/CN115088402B/zh active Active
- 2020-02-21 JP JP2022501546A patent/JP7228075B2/ja active Active
- 2020-02-21 US US17/904,489 patent/US20230106149A1/en active Pending
- 2020-02-21 WO PCT/JP2020/006997 patent/WO2021166211A1/ja unknown
- 2020-02-21 EP EP20920458.5A patent/EP4110032A4/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6245092A (ja) * | 1985-08-23 | 1987-02-27 | 株式会社日立製作所 | 部品位置及び姿勢認識方法及び同認識装置 |
WO2017208325A1 (ja) * | 2016-05-31 | 2017-12-07 | 富士機械製造株式会社 | 部品供給システム |
JP2018170513A (ja) * | 2018-06-07 | 2018-11-01 | 株式会社Fuji | ばら部品供給装置、部品実装装置およびばら部品供給方法 |
Also Published As
Publication number | Publication date |
---|---|
JP7228075B2 (ja) | 2023-02-22 |
CN115088402A (zh) | 2022-09-20 |
WO2021166211A1 (ja) | 2021-08-26 |
EP4110032A1 (en) | 2022-12-28 |
EP4110032A4 (en) | 2023-03-08 |
CN115088402B (zh) | 2023-06-27 |
US20230106149A1 (en) | 2023-04-06 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220608 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230207 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230210 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7228075 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |