JPWO2021157506A1 - - Google Patents

Info

Publication number
JPWO2021157506A1
JPWO2021157506A1 JP2021575773A JP2021575773A JPWO2021157506A1 JP WO2021157506 A1 JPWO2021157506 A1 JP WO2021157506A1 JP 2021575773 A JP2021575773 A JP 2021575773A JP 2021575773 A JP2021575773 A JP 2021575773A JP WO2021157506 A1 JPWO2021157506 A1 JP WO2021157506A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021575773A
Other versions
JP7111266B2 (ja
JPWO2021157506A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021157506A1 publication Critical patent/JPWO2021157506A1/ja
Publication of JPWO2021157506A5 publication Critical patent/JPWO2021157506A5/ja
Application granted granted Critical
Publication of JP7111266B2 publication Critical patent/JP7111266B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2021575773A 2020-02-07 2021-02-01 ベーパーチャンバー Active JP7111266B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020019583 2020-02-07
JP2020019583 2020-02-07
PCT/JP2021/003475 WO2021157506A1 (ja) 2020-02-07 2021-02-01 ベーパーチャンバー

Publications (3)

Publication Number Publication Date
JPWO2021157506A1 true JPWO2021157506A1 (ja) 2021-08-12
JPWO2021157506A5 JPWO2021157506A5 (ja) 2022-04-13
JP7111266B2 JP7111266B2 (ja) 2022-08-02

Family

ID=77200645

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021575773A Active JP7111266B2 (ja) 2020-02-07 2021-02-01 ベーパーチャンバー

Country Status (3)

Country Link
JP (1) JP7111266B2 (ja)
CN (1) CN218583848U (ja)
WO (1) WO2021157506A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114510135B (zh) * 2022-02-16 2024-04-05 苏州生益兴热传科技有限公司 一种导热散热效果好的均温板
US20240118036A1 (en) * 2022-10-07 2024-04-11 Samsung Display Co., Ltd. Vapor chamber and display device including the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108119881A (zh) * 2017-12-19 2018-06-05 苏州亿拓光电科技有限公司 具有异形毛细液流通路的led器件用均热板和led器件
JP2018189349A (ja) * 2017-04-28 2018-11-29 株式会社村田製作所 ベーパーチャンバー

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101900507B (zh) * 2010-01-15 2011-12-21 富瑞精密组件（昆山）有限公司 扁平薄型热导管
JP6741142B2 (ja) * 2017-04-28 2020-08-19 株式会社村田製作所 ベーパーチャンバー

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018189349A (ja) * 2017-04-28 2018-11-29 株式会社村田製作所 ベーパーチャンバー
CN108119881A (zh) * 2017-12-19 2018-06-05 苏州亿拓光电科技有限公司 具有异形毛细液流通路的led器件用均热板和led器件

Also Published As

Publication number Publication date
WO2021157506A1 (ja) 2021-08-12
JP7111266B2 (ja) 2022-08-02
CN218583848U (zh) 2023-03-07

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