JPWO2021157396A1 - - Google Patents
Info
- Publication number
- JPWO2021157396A1 JPWO2021157396A1 JP2021575727A JP2021575727A JPWO2021157396A1 JP WO2021157396 A1 JPWO2021157396 A1 JP WO2021157396A1 JP 2021575727 A JP2021575727 A JP 2021575727A JP 2021575727 A JP2021575727 A JP 2021575727A JP WO2021157396 A1 JPWO2021157396 A1 JP WO2021157396A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02253—Out-coupling of light using lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
- H01S5/4062—Edge-emitting structures with an external cavity or using internal filters, e.g. Talbot filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
- H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/02365—Fixing laser chips on mounts by clamping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/14—External cavity lasers
- H01S5/141—External cavity lasers using a wavelength selective device, e.g. a grating or etalon
- H01S5/143—Littman-Metcalf configuration, e.g. laser - grating - mirror
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
- H01S5/4068—Edge-emitting structures with lateral coupling by axially offset or by merging waveguides, e.g. Y-couplers
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020016225 | 2020-02-03 | ||
| PCT/JP2021/002329 WO2021157396A1 (ja) | 2020-02-03 | 2021-01-22 | 半導体レーザ装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2021157396A1 true JPWO2021157396A1 (https=) | 2021-08-12 |
Family
ID=77200470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021575727A Ceased JPWO2021157396A1 (https=) | 2020-02-03 | 2021-01-22 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20230110167A1 (https=) |
| JP (1) | JPWO2021157396A1 (https=) |
| CN (1) | CN115053417A (https=) |
| DE (1) | DE112021000855T5 (https=) |
| WO (1) | WO2021157396A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7659183B2 (ja) * | 2021-06-25 | 2025-04-09 | 日亜化学工業株式会社 | レーザ光源 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5420722A (en) * | 1993-10-25 | 1995-05-30 | Creo Products Inc. | Self-registering microlens for laser diodes |
| JPH09269439A (ja) * | 1996-03-29 | 1997-10-14 | Nec Corp | 半導体レーザモジュール |
| JP2004200634A (ja) * | 2002-12-13 | 2004-07-15 | Hentze-Lissotschenko Patentverwaltungs Gmbh & Co Kg | 半導体レーザ装置、および半導体レーザ装置のための半導体レーザモジュール、ならびに半導体レーザ装置を製造するための方法 |
| US20130084039A1 (en) * | 2011-08-16 | 2013-04-04 | International Business Machines Corporation | Lens array optical coupling to photonic chip |
| WO2019009086A1 (ja) * | 2017-07-07 | 2019-01-10 | パナソニックIpマネジメント株式会社 | 半導体レーザ装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE68920011T2 (de) * | 1988-03-22 | 1995-06-01 | Fujitsu Ltd | Optische halbleiteranordung und deren herstellung. |
| US6078437A (en) * | 1998-09-28 | 2000-06-20 | Blue Sky Research | Micro-optic lens with integral alignment member |
| EP1006382B1 (de) | 1998-10-30 | 2002-09-18 | Lissotschenko, Vitalij | Anordnung und Vorrichtung zur optischen Strahltransformation |
| JP2002232064A (ja) * | 2001-02-05 | 2002-08-16 | Hamamatsu Photonics Kk | 半導体レーザ装置、及び、半導体レーザ装置のレンズ位置固定方法 |
| JP6964469B2 (ja) * | 2017-08-30 | 2021-11-10 | シャープ株式会社 | 光源装置およびその製造方法 |
-
2021
- 2021-01-22 US US17/796,163 patent/US20230110167A1/en not_active Abandoned
- 2021-01-22 WO PCT/JP2021/002329 patent/WO2021157396A1/ja not_active Ceased
- 2021-01-22 CN CN202180011715.5A patent/CN115053417A/zh active Pending
- 2021-01-22 DE DE112021000855.2T patent/DE112021000855T5/de active Pending
- 2021-01-22 JP JP2021575727A patent/JPWO2021157396A1/ja not_active Ceased
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5420722A (en) * | 1993-10-25 | 1995-05-30 | Creo Products Inc. | Self-registering microlens for laser diodes |
| JPH09269439A (ja) * | 1996-03-29 | 1997-10-14 | Nec Corp | 半導体レーザモジュール |
| JP2004200634A (ja) * | 2002-12-13 | 2004-07-15 | Hentze-Lissotschenko Patentverwaltungs Gmbh & Co Kg | 半導体レーザ装置、および半導体レーザ装置のための半導体レーザモジュール、ならびに半導体レーザ装置を製造するための方法 |
| US20130084039A1 (en) * | 2011-08-16 | 2013-04-04 | International Business Machines Corporation | Lens array optical coupling to photonic chip |
| WO2019009086A1 (ja) * | 2017-07-07 | 2019-01-10 | パナソニックIpマネジメント株式会社 | 半導体レーザ装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115053417A (zh) | 2022-09-13 |
| WO2021157396A1 (ja) | 2021-08-12 |
| US20230110167A1 (en) | 2023-04-13 |
| DE112021000855T5 (de) | 2022-12-08 |
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