JPWO2021154590A5 - - Google Patents

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Publication number
JPWO2021154590A5
JPWO2021154590A5 JP2022546345A JP2022546345A JPWO2021154590A5 JP WO2021154590 A5 JPWO2021154590 A5 JP WO2021154590A5 JP 2022546345 A JP2022546345 A JP 2022546345A JP 2022546345 A JP2022546345 A JP 2022546345A JP WO2021154590 A5 JPWO2021154590 A5 JP WO2021154590A5
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JP
Japan
Prior art keywords
coolant
plenum
dielectric window
region
channel
Prior art date
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Application number
JP2022546345A
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English (en)
Japanese (ja)
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JP2023511745A5 (https=
JP2023511745A (ja
JP7706459B2 (ja
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Priority claimed from PCT/US2021/014505 external-priority patent/WO2021154590A1/en
Publication of JP2023511745A publication Critical patent/JP2023511745A/ja
Publication of JP2023511745A5 publication Critical patent/JP2023511745A5/ja
Publication of JPWO2021154590A5 publication Critical patent/JPWO2021154590A5/ja
Priority to JP2025111185A priority Critical patent/JP2025148377A/ja
Application granted granted Critical
Publication of JP7706459B2 publication Critical patent/JP7706459B2/ja
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JP2022546345A 2020-01-31 2021-01-22 トランス結合型プラズマウィンドウ冷却用プレナムアセンブリ Active JP7706459B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025111185A JP2025148377A (ja) 2020-01-31 2025-07-01 トランス結合型プラズマウィンドウ冷却用プレナムアセンブリ

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202062968305P 2020-01-31 2020-01-31
US62/968,305 2020-01-31
PCT/US2021/014505 WO2021154590A1 (en) 2020-01-31 2021-01-22 Plenum assemblies for cooling transformer coupled plasma windows

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025111185A Division JP2025148377A (ja) 2020-01-31 2025-07-01 トランス結合型プラズマウィンドウ冷却用プレナムアセンブリ

Publications (4)

Publication Number Publication Date
JP2023511745A JP2023511745A (ja) 2023-03-22
JP2023511745A5 JP2023511745A5 (https=) 2024-11-19
JPWO2021154590A5 true JPWO2021154590A5 (https=) 2024-11-19
JP7706459B2 JP7706459B2 (ja) 2025-07-11

Family

ID=77078296

Family Applications (2)

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JP2022546345A Active JP7706459B2 (ja) 2020-01-31 2021-01-22 トランス結合型プラズマウィンドウ冷却用プレナムアセンブリ
JP2025111185A Pending JP2025148377A (ja) 2020-01-31 2025-07-01 トランス結合型プラズマウィンドウ冷却用プレナムアセンブリ

Family Applications After (1)

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JP2025111185A Pending JP2025148377A (ja) 2020-01-31 2025-07-01 トランス結合型プラズマウィンドウ冷却用プレナムアセンブリ

Country Status (5)

Country Link
US (2) US12261018B2 (https=)
JP (2) JP7706459B2 (https=)
KR (2) KR20260019675A (https=)
CN (1) CN115039197A (https=)
WO (1) WO2021154590A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240297017A1 (en) * 2023-03-01 2024-09-05 Shine Technologies, Llc Jet impingement cooling assembly for plasma windows positioned in a beam accelerator system
US20250087505A1 (en) * 2023-09-12 2025-03-13 Applied Materials, Inc. Microwave annealing for low thermal budget applications
WO2025122269A1 (en) * 2023-12-04 2025-06-12 Lam Research Corporation Assembled window for processing chamber
CN121662693A (zh) * 2024-08-30 2026-03-13 北京北方华创微电子装备有限公司 半导体工艺腔室、半导体工艺设备及介质窗的温控方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8741097B2 (en) 2009-10-27 2014-06-03 Tokyo Electron Limited Plasma processing apparatus and plasma processing method
US9313872B2 (en) 2009-10-27 2016-04-12 Tokyo Electron Limited Plasma processing apparatus and plasma processing method
JP5851681B2 (ja) 2009-10-27 2016-02-03 東京エレクトロン株式会社 プラズマ処理装置
US8608903B2 (en) 2009-10-27 2013-12-17 Tokyo Electron Limited Plasma processing apparatus and plasma processing method
US9530656B2 (en) * 2011-10-07 2016-12-27 Lam Research Corporation Temperature control in RF chamber with heater and air amplifier
US9978565B2 (en) * 2011-10-07 2018-05-22 Lam Research Corporation Systems for cooling RF heated chamber components
US9745663B2 (en) 2012-07-20 2017-08-29 Applied Materials, Inc. Symmetrical inductively coupled plasma source with symmetrical flow chamber
TWI623960B (zh) * 2013-03-27 2018-05-11 Lam Research Corporation 半導體製造設備及其處理方法
US9885493B2 (en) * 2013-07-17 2018-02-06 Lam Research Corporation Air cooled faraday shield and methods for using the same
US9484214B2 (en) * 2014-02-19 2016-11-01 Lam Research Corporation Systems and methods for improving wafer etch non-uniformity when using transformer-coupled plasma
US11538666B2 (en) 2017-11-15 2022-12-27 Lam Research Corporation Multi-zone cooling of plasma heated window

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