CN115039197A - 用于冷却变压器耦合等离子体窗的充气室组件 - Google Patents

用于冷却变压器耦合等离子体窗的充气室组件 Download PDF

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Publication number
CN115039197A
CN115039197A CN202180012139.6A CN202180012139A CN115039197A CN 115039197 A CN115039197 A CN 115039197A CN 202180012139 A CN202180012139 A CN 202180012139A CN 115039197 A CN115039197 A CN 115039197A
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CN
China
Prior art keywords
coolant
plenum
dielectric window
channel
recessed area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180012139.6A
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English (en)
Chinese (zh)
Inventor
汉瑞·伊萨维
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of CN115039197A publication Critical patent/CN115039197A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32522—Temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H01J37/3211—Antennas, e.g. particular shapes of coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H01J37/32119—Windows
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/002—Cooling arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332—Coating
    • H01J2237/3321—CVD [Chemical Vapor Deposition]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
CN202180012139.6A 2020-01-31 2021-01-22 用于冷却变压器耦合等离子体窗的充气室组件 Pending CN115039197A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202062968305P 2020-01-31 2020-01-31
US62/968,305 2020-01-31
PCT/US2021/014505 WO2021154590A1 (en) 2020-01-31 2021-01-22 Plenum assemblies for cooling transformer coupled plasma windows

Publications (1)

Publication Number Publication Date
CN115039197A true CN115039197A (zh) 2022-09-09

Family

ID=77078296

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180012139.6A Pending CN115039197A (zh) 2020-01-31 2021-01-22 用于冷却变压器耦合等离子体窗的充气室组件

Country Status (5)

Country Link
US (2) US12261018B2 (https=)
JP (2) JP7706459B2 (https=)
KR (2) KR20260019675A (https=)
CN (1) CN115039197A (https=)
WO (1) WO2021154590A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026045861A1 (zh) * 2024-08-30 2026-03-05 北京北方华创微电子装备有限公司 半导体工艺腔室、半导体工艺设备及介质窗的温控方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240297017A1 (en) * 2023-03-01 2024-09-05 Shine Technologies, Llc Jet impingement cooling assembly for plasma windows positioned in a beam accelerator system
US20250087505A1 (en) * 2023-09-12 2025-03-13 Applied Materials, Inc. Microwave annealing for low thermal budget applications
WO2025122269A1 (en) * 2023-12-04 2025-06-12 Lam Research Corporation Assembled window for processing chamber

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8741097B2 (en) 2009-10-27 2014-06-03 Tokyo Electron Limited Plasma processing apparatus and plasma processing method
US9313872B2 (en) 2009-10-27 2016-04-12 Tokyo Electron Limited Plasma processing apparatus and plasma processing method
JP5851681B2 (ja) 2009-10-27 2016-02-03 東京エレクトロン株式会社 プラズマ処理装置
US8608903B2 (en) 2009-10-27 2013-12-17 Tokyo Electron Limited Plasma processing apparatus and plasma processing method
US9530656B2 (en) * 2011-10-07 2016-12-27 Lam Research Corporation Temperature control in RF chamber with heater and air amplifier
US9978565B2 (en) * 2011-10-07 2018-05-22 Lam Research Corporation Systems for cooling RF heated chamber components
US9745663B2 (en) 2012-07-20 2017-08-29 Applied Materials, Inc. Symmetrical inductively coupled plasma source with symmetrical flow chamber
TWI623960B (zh) * 2013-03-27 2018-05-11 Lam Research Corporation 半導體製造設備及其處理方法
US9885493B2 (en) * 2013-07-17 2018-02-06 Lam Research Corporation Air cooled faraday shield and methods for using the same
US9484214B2 (en) * 2014-02-19 2016-11-01 Lam Research Corporation Systems and methods for improving wafer etch non-uniformity when using transformer-coupled plasma
US11538666B2 (en) 2017-11-15 2022-12-27 Lam Research Corporation Multi-zone cooling of plasma heated window

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026045861A1 (zh) * 2024-08-30 2026-03-05 北京北方华创微电子装备有限公司 半导体工艺腔室、半导体工艺设备及介质窗的温控方法

Also Published As

Publication number Publication date
KR102925154B1 (ko) 2026-02-06
WO2021154590A1 (en) 2021-08-05
JP2023511745A (ja) 2023-03-22
KR20260019675A (ko) 2026-02-10
US20230065203A1 (en) 2023-03-02
US20250218724A1 (en) 2025-07-03
JP2025148377A (ja) 2025-10-07
KR20220134680A (ko) 2022-10-05
US12261018B2 (en) 2025-03-25
JP7706459B2 (ja) 2025-07-11

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