JPWO2021150904A5 - - Google Patents
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- Publication number
- JPWO2021150904A5 JPWO2021150904A5 JP2022545069A JP2022545069A JPWO2021150904A5 JP WO2021150904 A5 JPWO2021150904 A5 JP WO2021150904A5 JP 2022545069 A JP2022545069 A JP 2022545069A JP 2022545069 A JP2022545069 A JP 2022545069A JP WO2021150904 A5 JPWO2021150904 A5 JP WO2021150904A5
- Authority
- JP
- Japan
- Prior art keywords
- positioning system
- controller
- scanner
- galvo
- laser processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012545 processing Methods 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 16
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- 238000005259 measurement Methods 0.000 claims description 8
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- 230000003111 delayed effect Effects 0.000 claims description 5
- 230000001360 synchronised effect Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
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- 230000001934 delay Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000010330 laser marking Methods 0.000 description 3
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- 238000012546 transfer Methods 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005459 micromachining Methods 0.000 description 2
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- 238000004458 analytical method Methods 0.000 description 1
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- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
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- 238000003698 laser cutting Methods 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- 239000004065 semiconductor Substances 0.000 description 1
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202062965491P | 2020-01-24 | 2020-01-24 | |
| US62/965,491 | 2020-01-24 | ||
| PCT/US2021/014632 WO2021150904A1 (en) | 2020-01-24 | 2021-01-22 | Systems and methods for improving accuracy in large area laser processing using position feedforward compensation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2023513442A JP2023513442A (ja) | 2023-03-31 |
| JPWO2021150904A5 true JPWO2021150904A5 (zh) | 2024-04-03 |
Family
ID=74595455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022545069A Pending JP2023513442A (ja) | 2020-01-24 | 2021-01-22 | 大面積レーザ加工の正確度を、位置フィードフォワード補償を使用して改善するためのシステムと方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20210229216A1 (zh) |
| EP (1) | EP4093574A1 (zh) |
| JP (1) | JP2023513442A (zh) |
| KR (1) | KR20220141792A (zh) |
| CN (1) | CN115243823A (zh) |
| IL (1) | IL294976A (zh) |
| WO (1) | WO2021150904A1 (zh) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102384586B1 (ko) * | 2016-08-28 | 2022-04-11 | 에이씨에스 모션 컨트롤 리미티드 | 비교적 큰 가공물을 가공하는 레이저를 위한 방법 및 시스템 |
| AT526120A1 (de) * | 2022-04-08 | 2023-11-15 | Trotec Laser Gmbh | Verfahren zum Betreiben eines Laserplotters zum Schneiden, Gravieren, Markieren und/oder Beschriften eines Werkstückes, sowie einen Laserplotter zum Gravieren, Markieren und/oder Beschriften eines Werkstückes |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5751585A (en) | 1995-03-20 | 1998-05-12 | Electro Scientific Industries, Inc. | High speed, high accuracy multi-stage tool positioning system |
| ATE508398T1 (de) * | 2001-03-29 | 2011-05-15 | Lasx Ind Inc | Steuerung für einen laser mit prädiktiven modellen des bewegungssystems des laserstrahls |
| US8392002B2 (en) * | 2010-10-14 | 2013-03-05 | Delta Tau Data Systems, Inc. | Hybrid machine control incorporating fast-tool servos |
| WO2013140993A1 (ja) * | 2012-03-23 | 2013-09-26 | 三菱電機株式会社 | レーザ加工装置 |
| WO2015046926A1 (ko) * | 2013-09-30 | 2015-04-02 | 주식회사 이오테크닉스 | 다중 위치 제어를 이용한 연속적 레이저 가공 방법 및 이를 적용하는 시스템 |
| KR102384586B1 (ko) * | 2016-08-28 | 2022-04-11 | 에이씨에스 모션 컨트롤 리미티드 | 비교적 큰 가공물을 가공하는 레이저를 위한 방법 및 시스템 |
| CA3055249A1 (en) * | 2017-03-03 | 2018-09-07 | Apton Biosystems, Inc. | High speed scanning system with acceleration tracking |
| EP3630408A4 (en) | 2017-05-29 | 2021-04-07 | ACS Motion Control Ltd. | SYSTEM AND PROCESS FOR MACHINING RELATIVELY LARGE WORKPIECES |
| JP6795565B2 (ja) * | 2018-10-11 | 2020-12-02 | ファナック株式会社 | レーザ加工システム |
-
2021
- 2021-01-22 US US17/155,854 patent/US20210229216A1/en active Pending
- 2021-01-22 CN CN202180010606.1A patent/CN115243823A/zh active Pending
- 2021-01-22 EP EP21705383.4A patent/EP4093574A1/en active Pending
- 2021-01-22 WO PCT/US2021/014632 patent/WO2021150904A1/en unknown
- 2021-01-22 IL IL294976A patent/IL294976A/en unknown
- 2021-01-22 KR KR1020227025603A patent/KR20220141792A/ko not_active Application Discontinuation
- 2021-01-22 JP JP2022545069A patent/JP2023513442A/ja active Pending
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