JPWO2021150904A5 - - Google Patents
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- Publication number
- JPWO2021150904A5 JPWO2021150904A5 JP2022545069A JP2022545069A JPWO2021150904A5 JP WO2021150904 A5 JPWO2021150904 A5 JP WO2021150904A5 JP 2022545069 A JP2022545069 A JP 2022545069A JP 2022545069 A JP2022545069 A JP 2022545069A JP WO2021150904 A5 JPWO2021150904 A5 JP WO2021150904A5
- Authority
- JP
- Japan
- Prior art keywords
- positioning system
- controller
- scanner
- galvo
- laser processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000012545 processing Methods 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 16
- 230000001133 acceleration Effects 0.000 claims description 11
- 238000005259 measurement Methods 0.000 claims description 8
- 230000004044 response Effects 0.000 claims description 6
- 230000003111 delayed effect Effects 0.000 claims description 5
- 230000001360 synchronised effect Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 230000001934 delay Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000010330 laser marking Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005459 micromachining Methods 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US202062965491P | 2020-01-24 | 2020-01-24 | |
US62/965,491 | 2020-01-24 | ||
PCT/US2021/014632 WO2021150904A1 (fr) | 2020-01-24 | 2021-01-22 | Systèmes et procédés pour améliorer la précision dans un traitement au laser de grande surface à l'aide d'une compensation amont de position |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2023513442A JP2023513442A (ja) | 2023-03-31 |
JPWO2021150904A5 true JPWO2021150904A5 (fr) | 2024-04-03 |
JP7520129B2 JP7520129B2 (ja) | 2024-07-22 |
Family
ID=74595455
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022545069A Active JP7520129B2 (ja) | 2020-01-24 | 2021-01-22 | 大面積レーザ加工の正確度を、位置フィードフォワード補償を使用して改善するためのシステムと方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20210229216A1 (fr) |
EP (1) | EP4093574A1 (fr) |
JP (1) | JP7520129B2 (fr) |
CN (1) | CN115243823A (fr) |
IL (1) | IL294976A (fr) |
WO (1) | WO2021150904A1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109890553B (zh) * | 2016-08-28 | 2022-05-17 | Acs 运动控制有限公司 | 用于激光机械加工多个相对较大工件的方法及系统 |
AT526120B1 (de) * | 2022-04-08 | 2024-07-15 | Trotec Laser Gmbh | Verfahren zum Betreiben eines Laserplotters zum Schneiden, Gravieren, Markieren und/oder Beschriften eines Werkstückes, sowie einen Laserplotter zum Gravieren, Markieren und/oder Beschriften eines Werkstückes |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5751585A (en) | 1995-03-20 | 1998-05-12 | Electro Scientific Industries, Inc. | High speed, high accuracy multi-stage tool positioning system |
EP1374139B1 (fr) * | 2001-03-29 | 2011-05-04 | LASX Industries, Inc. | Controleur d'un laser utilisant des modeles predictifs du systeme de déplacement du rayon laser |
US8392002B2 (en) * | 2010-10-14 | 2013-03-05 | Delta Tau Data Systems, Inc. | Hybrid machine control incorporating fast-tool servos |
JP5847291B2 (ja) * | 2012-03-23 | 2016-01-20 | 三菱電機株式会社 | レーザ加工装置 |
WO2015046926A1 (fr) * | 2013-09-30 | 2015-04-02 | 주식회사 이오테크닉스 | Procédé de traitement au laser continu utilisant une commande de positionnement multiple, et système l'appliquant |
CN109890553B (zh) * | 2016-08-28 | 2022-05-17 | Acs 运动控制有限公司 | 用于激光机械加工多个相对较大工件的方法及系统 |
JP7144457B2 (ja) * | 2017-03-03 | 2022-09-29 | アプトン バイオシステムズ インコーポレイテッド | 加速度追跡による高速走査システム |
KR20200017394A (ko) | 2017-05-29 | 2020-02-18 | 에이씨에스 모션 컨트롤 리미티드 | 비교적 큰 워크피스의 가공을 위한 시스템 및 방법 |
JP6795565B2 (ja) * | 2018-10-11 | 2020-12-02 | ファナック株式会社 | レーザ加工システム |
-
2021
- 2021-01-22 IL IL294976A patent/IL294976A/en unknown
- 2021-01-22 US US17/155,854 patent/US20210229216A1/en active Pending
- 2021-01-22 WO PCT/US2021/014632 patent/WO2021150904A1/fr unknown
- 2021-01-22 JP JP2022545069A patent/JP7520129B2/ja active Active
- 2021-01-22 CN CN202180010606.1A patent/CN115243823A/zh active Pending
- 2021-01-22 EP EP21705383.4A patent/EP4093574A1/fr active Pending
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