JPWO2021144851A1 - - Google Patents
Info
- Publication number
- JPWO2021144851A1 JPWO2021144851A1 JP2021571084A JP2021571084A JPWO2021144851A1 JP WO2021144851 A1 JPWO2021144851 A1 JP WO2021144851A1 JP 2021571084 A JP2021571084 A JP 2021571084A JP 2021571084 A JP2021571084 A JP 2021571084A JP WO2021144851 A1 JPWO2021144851 A1 JP WO2021144851A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/64—Electrodes comprising a Schottky barrier to a semiconductor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
- H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
- H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]
- H10D62/106—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] having supplementary regions doped oppositely to or in rectifying contact with regions of the semiconductor bodies, e.g. guard rings with PN or Schottky junctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/113—Isolations within a component, i.e. internal isolations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/113—Isolations within a component, i.e. internal isolations
- H10D62/114—PN junction isolations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/50—Physical imperfections
- H10D62/53—Physical imperfections the imperfections being within the semiconductor body
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/01—Manufacture or treatment
- H10D8/051—Manufacture or treatment of Schottky diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/60—Schottky-barrier diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
- H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
- H10D62/8325—Silicon carbide
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/111—Field plates
Landscapes
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2020/000900 WO2021144851A1 (ja) | 2020-01-14 | 2020-01-14 | ショットキーバリアダイオード |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021144851A1 true JPWO2021144851A1 (https=) | 2021-07-22 |
| JP7367777B2 JP7367777B2 (ja) | 2023-10-24 |
Family
ID=76863985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021571084A Active JP7367777B2 (ja) | 2020-01-14 | 2020-01-14 | ショットキーバリアダイオード |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7367777B2 (https=) |
| CN (1) | CN114930546B (https=) |
| DE (1) | DE112020006511T5 (https=) |
| WO (1) | WO2021144851A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2024005153A1 (https=) * | 2022-06-29 | 2024-01-04 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59232467A (ja) * | 1983-06-16 | 1984-12-27 | Toshiba Corp | ガ−ドリング付きシヨツトキ−バリヤ−ダイオ−ド |
| JP2004022743A (ja) * | 2002-06-14 | 2004-01-22 | Sanken Electric Co Ltd | ショットキバリアを有する半導体装置 |
| JP2006228772A (ja) * | 2005-02-15 | 2006-08-31 | Matsushita Electric Ind Co Ltd | ショットキバリアダイオードとその製造方法 |
| WO2014192444A1 (ja) * | 2013-05-29 | 2014-12-04 | 住友電気工業株式会社 | 半導体装置 |
| JP2015065469A (ja) * | 2010-03-08 | 2015-04-09 | クリー インコーポレイテッドCree Inc. | ヘテロ接合障壁領域を含む半導体デバイス及びその製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4942255B2 (ja) * | 2001-05-08 | 2012-05-30 | 三菱電機株式会社 | 炭化珪素半導体装置およびその製造方法 |
| JP5827020B2 (ja) * | 2011-03-14 | 2015-12-02 | 新電元工業株式会社 | 高耐圧半導体装置 |
-
2020
- 2020-01-14 WO PCT/JP2020/000900 patent/WO2021144851A1/ja not_active Ceased
- 2020-01-14 CN CN202080092316.1A patent/CN114930546B/zh active Active
- 2020-01-14 JP JP2021571084A patent/JP7367777B2/ja active Active
- 2020-01-14 DE DE112020006511.1T patent/DE112020006511T5/de active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59232467A (ja) * | 1983-06-16 | 1984-12-27 | Toshiba Corp | ガ−ドリング付きシヨツトキ−バリヤ−ダイオ−ド |
| JP2004022743A (ja) * | 2002-06-14 | 2004-01-22 | Sanken Electric Co Ltd | ショットキバリアを有する半導体装置 |
| JP2006228772A (ja) * | 2005-02-15 | 2006-08-31 | Matsushita Electric Ind Co Ltd | ショットキバリアダイオードとその製造方法 |
| JP2015065469A (ja) * | 2010-03-08 | 2015-04-09 | クリー インコーポレイテッドCree Inc. | ヘテロ接合障壁領域を含む半導体デバイス及びその製造方法 |
| WO2014192444A1 (ja) * | 2013-05-29 | 2014-12-04 | 住友電気工業株式会社 | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20220376073A1 (en) | 2022-11-24 |
| JP7367777B2 (ja) | 2023-10-24 |
| CN114930546B (zh) | 2025-08-22 |
| CN114930546A (zh) | 2022-08-19 |
| WO2021144851A1 (ja) | 2021-07-22 |
| DE112020006511T5 (de) | 2022-11-17 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220414 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230516 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230607 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230912 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230925 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7367777 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |