JPWO2021140857A5 - - Google Patents
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- JPWO2021140857A5 JPWO2021140857A5 JP2021569797A JP2021569797A JPWO2021140857A5 JP WO2021140857 A5 JPWO2021140857 A5 JP WO2021140857A5 JP 2021569797 A JP2021569797 A JP 2021569797A JP 2021569797 A JP2021569797 A JP 2021569797A JP WO2021140857 A5 JPWO2021140857 A5 JP WO2021140857A5
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- Prior art keywords
- tank
- work
- treatment
- liquid
- main surface
- Prior art date
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- 239000007788 liquid Substances 0.000 claims 53
- 238000004381 surface treatment Methods 0.000 claims 25
- 230000002093 peripheral effect Effects 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
Claims (9)
表面処理槽と、
前記表面処理槽の上部から供給され、前記表面処理槽の下部から排出される処理液を循環させる処理液循環部と、
を有し、
前記表面処理槽は、
前記ワークを垂直状態で保持する前記治具を着脱自在に支持する支持部と、
前記ワークの前記第１主面及び前記第２主面とそれぞれ対向する第１壁部及び第２壁部と、
を含み、
前記ワークの前記第１主面と前記第１壁部との間に、前記処理液が流れる第１流路が形成され、前記ワークの前記第２主面と前記第２壁部との間に、前記処理液が流れる第２流路が形成され、
前記処理液循環部は、前記第１流路に沿って前記処理液の第１液流を形成し、かつ、前記第１液流の単位時間当たりの流量が可変である第１循環部と、前記第２流路に沿って前記処理液の第２液流を形成し、かつ、前記第２液流の単位時間当たりの流量が可変である第２循環部と、を含む表面処理装置において、
前記支持部と、前記支持部に支持される前記治具と、前記治具に保持される前記ワークとにより、前記表面処理槽が第１槽及び第２槽に区画され、
前記表面処理装置は、
前記第１槽内で一定液位を超えた前記処理液を、前記処理液循環部に戻す第１オーバーフロー槽と、
前記第２槽内で前記一定液位を超えた前記処理液を、前記処理液循環部に戻す第２オーバーフロー槽と、
をさらに有し、
前記第１循環部は、前記第１槽が前記一定液位となるように、前記第１液流の前記流量を調整し、前記第２循環部は、前記第２槽が前記一定液位より低い液位となるように、前記第２液流の前記流量を調整する、表面処理装置。 A jig that surrounds and holds the peripheral edge of the work whose front and back surfaces are the first main surface and the second main surface as the surface to be processed.
Surface treatment tank and
A treatment liquid circulation unit that circulates the treatment liquid supplied from the upper part of the surface treatment tank and discharged from the lower part of the surface treatment tank.
Have,
The surface treatment tank is
A support portion that detachably supports the jig that holds the work in a vertical state, and
The first wall portion and the second wall portion facing the first main surface and the second main surface of the work, respectively,
Including
A first flow path through which the treatment liquid flows is formed between the first main surface of the work and the first wall portion, and between the second main surface of the work and the second wall portion. , A second flow path through which the treatment liquid flows is formed.
The treatment liquid circulation unit is a first circulation unit in which a first liquid flow of the treatment liquid is formed along the first flow path and the flow rate of the first liquid flow per unit time is variable. A surface treatment apparatus including a second circulation portion that forms a second liquid flow of the treatment liquid along the second flow path and has a variable flow rate of the second liquid flow per unit time. In
The surface treatment tank is divided into a first tank and a second tank by the support portion, the jig supported by the support portion, and the work held by the jig.
The surface treatment device is
A first overflow tank that returns the treatment liquid that exceeds a certain liquid level in the first tank to the treatment liquid circulation section.
A second overflow tank that returns the treatment liquid that exceeds the constant liquid level in the second tank to the treatment liquid circulation section.
Have more
The first circulation section adjusts the flow rate of the first liquid flow so that the first tank has the constant liquid level, and the second circulation section has the second tank from the constant liquid level. A surface treatment device that adjusts the flow rate of the second liquid flow so as to have a low liquid level .
前記処理液循環部は、
前記表面処理槽から排出される前記処理液を調整する調整タンクと、
前記調整タンク内の前記処理液を圧送するポンプと、
を含み、
前記調整タンクは、
前記第１槽から排出される前記処理液を調整する第１調整タンクと、
前記第２槽から排出される前記処理液を調整する第２調整タンクと、
を含み、
前記ポンプは、
前記第１調整タンク内の前記処理液を圧送する第１ポンプと、
前記第２調整タンク内の前記処理液を圧送する第２ポンプと、
を含む表面処理装置。 In claim 1 ,
The treatment liquid circulation part is
An adjustment tank that adjusts the treatment liquid discharged from the surface treatment tank, and
A pump that pumps the treatment liquid in the adjustment tank,
Including
The adjustment tank is
A first adjustment tank that adjusts the treatment liquid discharged from the first tank, and
A second adjusting tank that adjusts the treatment liquid discharged from the second tank, and
Including
The pump
A first pump that pumps the treatment liquid in the first adjustment tank, and
A second pump that pumps the treatment liquid in the second adjustment tank, and
Surface treatment equipment including.
前記処理液循環部は、
前記表面処理槽から排出される前記処理液を調整する調整タンクと、
前記調整タンク内の前記処理液を圧送するポンプと、
を含み、
前記調整タンク及び前記ポンプは、前記第１循環部及び前記第２循環部で共用される表面処理装置。 In claim 1 or 2 ,
The treatment liquid circulation part is
An adjustment tank that adjusts the treatment liquid discharged from the surface treatment tank, and
A pump that pumps the treatment liquid in the adjustment tank,
Including
The adjustment tank and the pump are surface treatment devices shared by the first circulation section and the second circulation section.
前記第１循環部及び前記第２循環部の各々は、
前記表面処理槽の前記下部から排液される前記処理液の単位時間当たりの流量を可変する排液流量制御バルブと、
前記表面処理槽の前記上部から給液される前記処理液の単位時間当たりの流量を可変する給液流量制御バルブと、
前記ポンプで圧送される前記処理液の一部を前記調整タンクに戻す一部戻しバルブと、を含む表面処理装置。 In claim 2 or 3 ,
Each of the first circulation part and the second circulation part
A drainage flow rate control valve that changes the flow rate of the treatment liquid discharged from the lower portion of the surface treatment tank per unit time, and
A liquid supply flow rate control valve that changes the flow rate of the treatment liquid supplied from the upper part of the surface treatment tank per unit time, and
A surface treatment apparatus including a partial return valve for returning a part of the treatment liquid pumped by the pump to the adjustment tank.
前記第１循環部及び前記第２循環部の各々は、
前記表面処理槽の前記下部からの前記処理液の排液を遮断する遮断バルブと、
前記ポンプで圧送される前記処理液の全てを前記調整タンクに戻す全量戻しバルブと、を含む表面処理装置。 In any one of claims 2 to 4 ,
Each of the first circulation part and the second circulation part
A shutoff valve that shuts off the drainage of the treatment liquid from the lower part of the surface treatment tank,
A surface treatment apparatus including a total amount return valve for returning all of the treatment liquid pumped by the pump to the adjustment tank.
少なくとも一つの整流器をさらに含み、
前記第１壁部は、前記ワークの前記第１主面と対向する第１陽極を保持し、
前記第２壁部は、前記ワークの前記第２主面と対向する第２陽極を保持し、
前記少なくとも一つの整流器は、前記第１陽極及前記第２陽極に接続され、かつ、前記治具を介して前記ワークを陰極に設定する表面処理装置。 In any one of claims 1 to 5 ,
Including at least one rectifier,
The first wall portion holds a first anode facing the first main surface of the work.
The second wall portion holds a second anode facing the second main surface of the work.
The at least one rectifier is a surface treatment device connected to the first anode and the second anode, and the work is set as a cathode via the jig.
前記治具は、前記ワークの前記第１主面と導通する第１導通部と、前記ワークの前記第２主面と導通する第２導通部と、を含み、
前記少なくとも一つの整流器は、前記治具の前記第１導通部と前記第１陽極とに接続される第１整流器と、前記治具の前記第２導通部と前記第２陽極とに接続される第２整流器と、を含む表面処理装置。 In claim 6 ,
The jig includes a first conductive portion that conducts with the first main surface of the work and a second conductive portion that conducts with the second main surface of the work.
The at least one rectifier is connected to a first rectifier connected to the first conductive portion of the jig and the first anode, and to the second conductive portion and the second anode of the jig. A second rectifier and a surface treatment device including.
前記治具は、
前記ワークの前記第１主面の第１分割領域と導通する第１導通部と、
前記ワークの前記第１主面の第２分割領域と導通する第２導通部と、
前記ワークの前記第２主面の第１分割領域と導通する第３導通部と、
前記ワークの前記第２主面の第２分割領域と導通する第４導通部と、
を含み、
前記少なくとも一つの整流器は、第１～第４整流器を含み、
前記第１整流器は、前記ワークの前記第１主面の前記第１分割領域と対向する前記第１陽極の第１分割領域と、前記治具の前記第１導通部とに接続され、
前記第２整流器は、前記ワークの前記第１主面の前記第２分割領域と対向する前記第１陽極の第２分割領域と、前記治具の前記第２導通部とに接続され、
前記第３整流器は、前記ワークの前記第２主面の前記第１分割領域と対向する前記第２陽極の第１分割領域と、前記治具の前記第３導通部とに接続され、
前記第４整流器は、前記ワークの前記第２主面の前記第２分割領域と対向する前記第２陽極の第２分割領域と、前記治具の前記第４導通部とに接続される表面処理装置。 In claim 6 ,
The jig is
A first conductive portion that conducts with the first divided region of the first main surface of the work,
A second conductive portion that conducts with the second divided region of the first main surface of the work,
A third conductive portion that conducts with the first divided region of the second main surface of the work,
A fourth conductive portion that conducts with the second divided region of the second main surface of the work,
Including
The at least one rectifier includes first to fourth rectifiers.
The first rectifier is connected to the first division region of the first anode facing the first division region of the first main surface of the work and the first conduction portion of the jig.
The second rectifier is connected to the second division region of the first anode facing the second division region of the first main surface of the work and the second conduction portion of the jig.
The third rectifier is connected to the first division region of the second anode facing the first division region of the second main surface of the work and the third conduction portion of the jig.
The fourth rectifier is surface-treated to be connected to the second division region of the second anode facing the second division region of the second main surface of the work and the fourth conduction portion of the jig. Device.
前記ワークの前記第１主面と前記第１壁部との間に配置される第１流路に沿って上から下に向かう、単位時間当たりの流量が可変である処理液の第１液流を形成するように、前記表面処理槽の内外で前記処理液を第１循環部により循環させ、前記ワークの前記第２主面と前記第２壁部との間に配置される第２流路に沿って上から下に向かう、単位時間当たりの流量が可変である前記処理液の第２液流を形成するように、前記表面処理槽の内外で前記処理液を第２循環部により循環させて、前記ワークの前記第１主面及び前記第２主面を表面処理する工程と、
を有する表面処理方法において、
前記支持部と、前記支持部に支持される前記治具と、前記治具に保持される前記ワークとにより、前記表面処理槽が第１槽及び第２槽に区画され、
前記第１槽内で一定液位を超える前記処理液が流入される第１オーバーフロー槽と、前記第２槽内で前記一定液位を超える前記処理液が流入される第２オーバーフロー槽と、を用意し、
前記第１循環部は、前記第１槽が前記一定液位となるように、前記第１液流の前記流量を調整し、前記第２循環部は、前記第２槽が前記一定液位より低い液位となるように、前記第２液流の前記流量を調整する、表面処理装置。 A flat plate-shaped jig that surrounds and holds the peripheral edge of the work whose front and back surfaces are the first main surface and the second main surface as the surface to be treated is supported by a support portion provided in the surface treatment tank, and the surface is said. A step of vertically supporting the work between the first wall portion and the second wall portion provided in the treatment tank, and
A first liquid of a treatment liquid having a variable flow rate per unit time, from top to bottom along a first flow path arranged between the first main surface of the work and the first wall portion. A second flow in which the treatment liquid is circulated by the first circulation portion inside and outside the surface treatment tank so as to form a flow, and is arranged between the second main surface and the second wall portion of the work. The treatment liquid is mixed by the second circulation portion inside and outside the surface treatment tank so as to form a second liquid flow of the treatment liquid having a variable flow rate per unit time from top to bottom along the path. A step of surface-treating the first main surface and the second main surface of the work by circulating the work.
In the surface treatment method having
The surface treatment tank is divided into a first tank and a second tank by the support portion, the jig supported by the support portion, and the work held by the jig.
A first overflow tank into which the treatment liquid exceeding a certain liquid level flows into the first tank and a second overflow tank into which the treatment liquid exceeding the constant liquid level flows into the second tank. Prepare and
The first circulation section adjusts the flow rate of the first liquid flow so that the first tank has the constant liquid level, and the second circulation section has the second tank from the constant liquid level. A surface treatment device that adjusts the flow rate of the second liquid flow so as to have a low liquid level .
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020002932 | 2020-01-10 | ||
| JP2020002932 | 2020-01-10 | ||
| PCT/JP2020/046991 WO2021140857A1 (en) | 2020-01-10 | 2020-12-16 | Surface treatment device and method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021140857A1 JPWO2021140857A1 (en) | 2021-07-15 |
| JPWO2021140857A5 true JPWO2021140857A5 (en) | 2022-06-23 |
| JP7142982B2 JP7142982B2 (en) | 2022-09-28 |
Family
ID=76787902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021569797A Active JP7142982B2 (en) | 2020-01-10 | 2020-12-16 | Surface treatment apparatus and method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7142982B2 (en) |
| CN (1) | CN114929945A (en) |
| TW (1) | TW202134485A (en) |
| WO (1) | WO2021140857A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023023068A (en) * | 2021-08-04 | 2023-02-16 | 株式会社アルメックステクノロジーズ | Workpiece holding jig and surface treatment apparatus |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0835099A (en) * | 1994-07-21 | 1996-02-06 | Matsushita Electric Works Ltd | Electroplating method of substrate |
| JP3411103B2 (en) * | 1994-09-14 | 2003-05-26 | イビデン株式会社 | Electroplating method, electroplating equipment, rack for electroplating |
| JP5105172B2 (en) * | 2008-02-13 | 2012-12-19 | 日立化成工業株式会社 | Fixing jig for printed circuit board plating |
| JP2016108598A (en) * | 2014-12-04 | 2016-06-20 | イビデン株式会社 | Surface treatment apparatus, and surface treatment method |
| CN205821497U (en) * | 2016-06-22 | 2016-12-21 | 广州明毅电子机械有限公司 | There is the electroplating device electroplating bath of suction pipe device |
-
2020
- 2020-12-16 WO PCT/JP2020/046991 patent/WO2021140857A1/en active Application Filing
- 2020-12-16 JP JP2021569797A patent/JP7142982B2/en active Active
- 2020-12-16 CN CN202080091690.XA patent/CN114929945A/en active Pending
-
2021
- 2021-01-05 TW TW110100220A patent/TW202134485A/en unknown
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