CN114929945A

CN114929945A - Surface treatment device and method thereof

Info

Publication number: CN114929945A
Application number: CN202080091690.XA
Authority: CN
Inventors: 石井胜己
Original assignee: Almex Technologies Inc
Current assignee: Almex Technologies Inc
Priority date: 2020-01-10
Filing date: 2020-12-16
Publication date: 2022-08-19
Also published as: JP7142982B2; JPWO2021140857A1; WO2021140857A1; TW202134485A

Abstract

The surface treatment device (1) has: a jig (10) that surrounds and holds the periphery of a workpiece (W) having a first main surface (W _F ) and a second main surface (W _B ) as surfaces to be treated; a surface treatment tank (W F ) 100); and a treatment liquid circulation part (200) for circulating the treatment liquid (2) supplied from the upper part of the surface treatment tank and discharged from the lower part. The surface treatment tank includes a support portion (110, 120) for supporting a jig holding a workpiece, and first and second wall portions (140, 150) facing the workpiece. The processing liquid circulation part includes: a first circulation part (210) that forms a first liquid flow (LF1) of the processing liquid along the first flow path (FP1) on the first main surface side; and a first circulation part (210) along the second main surface side The second flow path (FP2) forms a second circulation part (220) of the second liquid flow (LF2) of the processing liquid.

Description

Surface treatment device and method thereof

Technical Field

The present invention relates to a surface treatment apparatus for electroless plating, electrolytic plating, or the like, a method thereof, and the like.

Background

There is known a continuous plating apparatus in which a workpiece is suspended and conveyed in a surface treatment tank containing a treatment liquid, and the treatment liquid is sprayed to the front surface and the back surface of the workpiece by 2 or more nozzles provided in the treatment tank (patent document 1).

Further, as an electroless or electrolytic plating apparatus, the following apparatus has been proposed: the treatment liquid is supplied from top to bottom along the front and back surfaces of the workpiece, and the treatment liquid is plated on the front and back surfaces of the workpiece (patent document 2).

Documents of the prior art

Patent literature

Patent document 1: japanese patent laid-open publication No. 2018-115367

Patent document 2: japanese patent laid-open publication No. 2016 & 108598 & gt-

Disclosure of Invention

Problems to be solved by the invention

For example, in a substrate for a smartphone used in the 5 th generation mobile communication system (5G), a difference in residual copper ratio between the front surface and the back surface of the substrate may be significantly different when 95% of the front surface of the substrate is copper-plated area and 5% of the back surface of the substrate is copper-plated area, for example. It is known that when a substrate having a large difference in residual copper content between the front surface and the back surface is plated using the conventional apparatus, the plating quality may be impaired.

The invention aims to provide a surface treatment device and a surface treatment method which can make surface treatment conditions different on the front surface and the back surface of a workpiece.

Means for solving the problems

(1) One embodiment of the present invention relates to a surface treatment apparatus including:

a jig which surrounds and holds a periphery of the workpiece having the 1 st main surface and the 2 nd main surface in a front-back relationship as a surface to be processed;

a surface treatment tank; and

a treatment liquid circulating unit for circulating a treatment liquid supplied from an upper portion of the surface treatment tank and discharged from a lower portion of the surface treatment tank,

the surface treatment tank includes:

a support portion configured to detachably support the jig for holding the workpiece in a vertical state; and

a1 st wall portion and a2 nd wall portion which are opposed to the 1 st main surface and the 2 nd main surface of the workpiece, respectively,

a1 st channel through which the treatment liquid flows is formed between the 1 st main surface and the 1 st wall portion of the workpiece, a2 nd channel through which the treatment liquid flows is formed between the 2 nd main surface and the 2 nd wall portion of the workpiece,

the treatment liquid circulation unit includes a1 st circulation unit that forms a1 st flow of the treatment liquid along the 1 st flow path, and a2 nd circulation unit that forms a2 nd flow of the treatment liquid along the 2 nd flow path.

According to one embodiment of the present invention, since the first circulation unit that forms the 1 st fluid flow in contact with the 1 st main surface of the workpiece and the 2 nd circulation unit that forms the 2 nd fluid flow in contact with the 2 nd main surface of the workpiece are provided, at least one of the surface treatment conditions (flow rate, pressure, temperature, additive amount, and the like) can be set independently by the 1 st fluid flow and the 2 nd fluid flow. This makes it possible to make the surface treatment conditions different between the 1 st main surface and the 2 nd main surface of the workpiece.

(2) In one aspect (1) of the present invention, the 1 st circulation unit may have a variable flow rate per unit time of the 1 st liquid stream, and the 2 nd circulation unit may have a variable flow rate per unit time of the 2 nd liquid stream. By independently setting the flow rates of the 1 st and 2 nd flows per unit time, the processing conditions for processing the 1 st and 2 nd main surfaces of the workpiece can be independently set.

(3) In one aspect (1) or (2) of the present invention, the surface treatment tank may be divided into a1 st tank and a2 nd tank by the support portion, the jig supported by the support portion, and the workpiece held by the jig, and the surface treatment apparatus may further include: a1 st overflow tank for returning the treatment liquid exceeding a predetermined level in the 1 st tank to the 1 st circulation unit; and a2 nd overflow tank for returning the treatment liquid exceeding a predetermined level in the 2 nd tank to the 2 nd circulation unit. Thus, as long as the flow rate per unit time supplied from the 1 st and 2 nd circulation units is equal to or greater than a predetermined flow rate (equal to or greater than the lower discharge rate), the surface heights (liquid levels) of the treatment liquids in the 1 st and 2 nd tanks become equal to the respective overflow liquid levels. For example, when the flow rate per unit time supplied from the 2 nd circulation unit is decreased, the overflow level is reached in the 1 st tank, while the level of the treatment liquid in the 1 st and 2 nd tanks can be made different by making the level of the 2 nd tank lower than the level of the 1 st tank. Thus, the difference in the level between the 1 st and 2 nd tanks allows the 1 st and 2 nd tanks to make the pressure of the processing liquid applied to the processing surface of the workpiece different. When the workpiece has the through hole penetrating through the 1 st main surface and the 2 nd main surface, the treatment liquid can be replaced from the higher pressure side to the lower pressure side in the through hole, and the surface treatment in the through hole can be improved. Further, the 1 st overflow level of the 1 st tank and the 2 nd overflow level of the 2 nd tank may be different from each other, and thus the pressures of the processing liquid acting on the processing surface of the workpiece may be different between the 1 st tank and the 2 nd tank.

(4) In the aspect (3) of the present invention, at least one of the 1 st and 2 nd overflow tanks may be capable of adjusting an overflow liquid level. In this way, the pressure of the processing liquid acting on the processing surface of the workpiece can be changed by the 1 st groove and the 2 nd groove according to the surface processing areas of the 1 st and 2 nd main surfaces and the like.

(5) In one aspect (3) or (4) of the present invention, the treatment liquid circulation unit may include: an adjustment tank for adjusting the treatment liquid discharged from the surface treatment tank; and a pump for pumping the treatment liquid in the adjustment tank, wherein the adjustment tank includes: a1 st conditioning tank for conditioning the treatment liquid discharged from the 1 st tank; and a2 nd adjustment tank for adjusting the processing liquid discharged from the 2 nd tank, wherein the pump includes: a1 st pump for pumping the treatment liquid in the 1 st adjustment tank; and a2 nd pump for pumping the treatment liquid in the 2 nd adjustment tank. Thus, the flow rate, temperature, amount of additive, and the like of the treatment liquid can be independently set in the 1 st and 2 nd tanks.

(6) In one aspect (1) to (4) of the present invention, the treatment liquid circulating unit may include: an adjustment tank for adjusting the treatment liquid discharged from the surface treatment tank; and a pump for pumping the treatment liquid in the adjustment tank, wherein the adjustment tank and the pump are shared by the 1 st circulation unit and the 2 nd circulation unit. Thus, even if the 1 st and 2 nd circulation units are provided, the surface treatment apparatus can be kept compact. In the 1 st and 2 nd circulation units, filters for removing impurities in the treatment liquid may be used in common. The circulation units 1 and 2 are separated from each other except for the adjustment tank and the pump, or in addition to the filter. Thus, the 1 st and 2 nd circulation units are controlled by valves provided in the respective independent circulation units, whereby the flow rates of the 1 st and 2 nd liquid flows per unit time are variable.

(7) In one aspect (5) or (6) of the present invention, the 1 st cycle and the 2 nd cycle may include: a discharged liquid flow control valve for varying a flow rate per unit time of the treatment liquid discharged from the lower portion of the surface treatment tank; a liquid supply flow rate control valve for varying a flow rate per unit time of the treatment liquid supplied from the upper portion of the surface treatment tank; and a partial return valve that returns a part of the treatment liquid pumped by the pump to the adjustment tank. Thus, the 1 st and 2 nd circulation units can independently set the flow rates of the 1 st and 2 nd flows while sharing the pump.

(8) In one aspect (5) to (7) of the present invention, the 1 st cycle and the 2 nd cycle may include: a shut-off valve for shutting off the drainage of the treatment liquid from the lower part of the surface treatment tank; and a total amount return valve that returns all of the treatment liquid pumped by the pump to the adjustment tank. The 1 st cycle part and the 2 nd cycle part can open a shut-off valve respectively, and all the treatment liquid pumped by the pump can be returned to the adjustment tank by the total amount return valve. This can stop either of the 1 st and 2 nd flows. This enables the treatment liquid to be displaced from the side having the liquid flow to the side having no liquid flow in the through-hole, thereby improving the surface treatment in the through-hole. Alternatively, both the 1 st and 2 nd flows can be stopped, and the operation stop mode or the cleaning mode can be set. Further, by shutting off the liquid discharge by the shut-off valve, the operation start mode in which the treatment liquid reaches a certain level in the surface treatment tank can be set.

(9) In one aspect (1) to (8) of the present invention, the workpiece may further include at least one rectifier, the 1 st wall portion may hold a1 st anode facing the 1 st main surface of the workpiece, the 2 nd wall portion may hold a2 nd anode facing the 2 nd main surface of the workpiece, and the at least one rectifier may be connected to the 1 st anode and the 2 nd anode, and the workpiece may be set to the cathode by the jig. In this way, the processing conditions for performing the electrolytic processing on the 1 st main surface and the 2 nd main surface of the workpiece can be independently set.

(10) In one aspect (9) of the present invention, the jig may include a1 st conduction part that conducts with the 1 st main surface of the workpiece and a2 nd conduction part that conducts with the 2 nd main surface of the workpiece, and the at least one rectifier may include a1 st rectifier connected to the 1 st conduction part and the 1 st anode of the jig and a2 nd rectifier connected to the 2 nd conduction part and the 2 nd anode of the jig. In this way, the current flowing through the 1 st main surface of the workpiece and the current flowing through the 2 nd main surface of the workpiece can be independently set by the 1 st and 2 nd rectifiers. Thereby, the current conditions for performing the electrolytic processing on the 1 st main surface and the 2 nd main surface of the workpiece can be independently set.

(11) In one aspect (9) of the present invention, the jig may include: a1 st conduction part which is conducted to a1 st divided region of the 1 st main surface of the workpiece; a2 nd conduction part which is conducted with a2 nd divided region of the 1 st main surface of the workpiece; a 3 rd conduction part which is conducted with the 1 st divided region of the 2 nd main surface of the workpiece; and a 4 th conduction part which is conducted to a2 nd divided region of the 2 nd main surface of the workpiece, wherein the at least one rectifier includes 1 st to 4 th rectifiers, and the 1 st rectifier is connected to a1 st divided region of the 1 st anode opposed to the 1 st divided region of the 1 st main surface of the workpiece and the 1 st conduction part of the jig; the 2 nd rectifier is connected to the 2 nd divided region of the 1 st anode and the 2 nd conduction part of the jig, which are opposed to the 2 nd divided region of the 1 st main surface of the workpiece; the 3 rd rectifier is connected to the 1 st divided region of the 2 nd anode opposed to the 1 st divided region of the 2 nd main surface of the workpiece and the 3 rd conduction part of the jig; the 4 th rectifier is connected to the 2 nd divided region of the 2 nd anode facing the 2 nd divided region of the 2 nd main surface of the workpiece and the 4 th conduction part of the jig. In this way, the current flowing through the 1 st divided region of the 1 st main surface of the workpiece, the current flowing through the 2 nd divided region of the 1 st main surface of the workpiece, the current flowing through the 1 st divided region of the 2 nd main surface of the workpiece, and the current flowing through the 2 nd divided region of the 2 nd main surface of the workpiece can be independently set by the 1 st to 4 th rectifiers. Thus, the current conditions for performing the electrolytic treatment on each of the 1 st and 2 nd divided regions can be set independently on the 1 st and 2 nd main surfaces of the workpiece.

(12) Another aspect of the present invention relates to a surface treatment method including the steps of: a step of supporting a flat-plate-shaped jig, which surrounds and holds the periphery of a workpiece having front and back main surfaces 1 and 2 as surfaces to be processed, on a support portion provided in a surface processing bath, and vertically supporting the workpiece between a1 st wall portion and a2 nd wall portion provided in the surface processing bath; and

and circulating the treatment liquid inside and outside the surface treatment tank by a1 st circulation unit so as to form a1 st flow of the treatment liquid from top to bottom along a1 st flow path arranged between the 1 st main surface and the 1 st wall portion of the workpiece, and circulating the treatment liquid inside and outside the surface treatment tank by a2 nd circulation unit so as to form a2 nd flow of the treatment liquid from top to bottom along a2 nd flow path arranged between the 2 nd main surface and the 2 nd wall portion of the workpiece, thereby performing surface treatment on the 1 st main surface and the 2 nd main surface of the workpiece.

In another embodiment of the present invention, at least one of the surface treatment conditions (flow rate, pressure, temperature, amount of additive, etc.) can be set independently by the 1 st liquid flow and the 2 nd liquid flow. This makes it possible to make the surface treatment conditions different between the 1 st main surface and the 2 nd main surface of the workpiece.

Drawings

Fig. 1 is a schematic view of a surface treatment apparatus according to an embodiment of the present invention.

Fig. 2 is a front view of the clamp.

Fig. 3 is a rear view of the clip.

Fig. 4 is a plan view of the surface treatment tank provided with the jig.

Fig. 5 (a) to 5 (C) are diagrams showing the relationship between the rectifier and the clip.

Fig. 6 is an explanatory diagram of the operation start mode.

Fig. 7 is an explanatory diagram of the normal operation modes 1 and 2.

Fig. 8 is an explanatory diagram of through-hole processing pattern 1 based on the pressure difference in the double-sided cycle.

Fig. 9 is an explanatory diagram of the through-hole processing mode 2 based on the pressure difference in the single-sided circulation mode.

Fig. 10 is an explanatory diagram of the through-hole processing mode 3 based on the pressure difference in the single-side liquid discharge mode.

Fig. 11 is an explanatory diagram of the double-side circulation stop mode.

Detailed Description

In the following disclosure, a number of different implementations and embodiments are provided for implementing different features of the claimed subject matter. Of course, these are merely examples and are not intended to be limiting. Further, in the present disclosure, reference numbers and/or letters are sometimes repeated in various examples. Such repetition is for the sake of brevity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. Further, when the 1 st element is described as being "connected" or "coupled" to the 2 nd element, such description includes an embodiment in which the 1 st element and the 2 nd element are directly connected or coupled to each other, and also includes an embodiment in which the 1 st element and the 2 nd element are indirectly connected or coupled to each other with 1 or more other elements interposed therebetween. In addition, when a1 st element is described as "moving" relative to a2 nd element, such description includes embodiments in which at least one of the 1 st element and the 2 nd element moves relative to the other.

1. Outline of surface treatment apparatus

FIG. 1 is a schematic view of a surface treatment apparatus of the present embodiment, for example, an electrolytic plating apparatus. The electrolytic plating device 1 includes: a plate-like jig 10 for holding a workpiece W, a surface treatment tank 100, and a treatment liquid circulating unit 200 for circulating a plating liquid as a treatment liquid 2 through the surface treatment tank 100. In the workpiece W, the 1 st main surface (e.g., front surface) W to be in a relationship of front and back surfaces _F And a2 nd main surface (e.g., back surface) W _B As the processed surface.

1.1. Workpiece

The workpiece W is, for example, a rectangular circuit board, and is subjected to, for example, copper plating by the electrolytic plating apparatus 1. However, the plating may be of any kind. The circuit substrate W may be on the surface W _F And/or the back surface W _B Has a via hole (via hole) and may have a through surface W _F And a back surface W _B Through hole(s) of (a). In this case, the inner walls of the via hole and the through hole are also plated. In addition, in the work W, the surface W _F And a back surface W _B May be significantly different, for example the surface W _F 95% of the area of the back surface W is the plating area _B Only 5% may be the plated area.

1.2. Clamp apparatus

The jig 10 holding the workpiece W will be described with reference to fig. 2 as a front view of the jig 10 and fig. 3 as a rear view of the jig 10. On the clamp 10The workpiece W in (2) can be loaded and unloaded by an automatic machine, for example. The jig 10 has a jig main body 12 formed of, for example, a flat plate (the flat plate is made of, for example, an insulating material). The jig main body 12 has a rectangular hole 14 having an area slightly larger than that of the rectangular workpiece W. The workpiece W is disposed in the hole 14, and the periphery of the workpiece W is surrounded by the jig 10. The jig 10 has electrodes 15A to 15D shown in fig. 2 and electrodes 15E to 15H shown in fig. 3 along the periphery 4 side of the rectangular hole 14. These electrodes 15A to 15H are insulated from each other. Each of the electrodes 15A to 15H holds at least 2 clips 20. The clamp 20 clamps the workpiece W from the front and back surfaces thereof. The clamps 20 may include a clamp 21 that clamps an upper edge portion of the workpiece W, a clamp 22 shown in fig. 2 that clamps a left edge portion of the workpiece W, a clamp 23 that clamps a lower edge portion of the workpiece W, and a clamp 24 shown in fig. 2 that clamps a right edge portion of the workpiece W. Here, the clamp 21 includes a surface W which contacts the workpiece W _F A clamping piece 31 (figure 2) contacted with the back surface W of the workpiece W _B The clip 41 (fig. 3) in contact. In the present embodiment, clip 31 is electrically insulated from clip 41. Likewise, clip 22 includes electrically isolated jaws 32, 42, clip 23 includes electrically

isolated jaws

33, 43, and clip 24 includes electrically

isolated jaws

34, 44. Clip 31 is electrically connected to electrode 15A, clip 32 is electrically connected to electrode 15B, clip 33 is electrically connected to electrode 15C, clip 34 is electrically connected to electrode 15D, clip 41 is electrically connected to electrode 15E, clip 42 is electrically connected to electrode 15F, clip 43 is electrically connected to electrode 15G, and clip 44 is electrically connected to electrode 15H. By insulating clip 31 to 34 and 41 to 44 from each other in this way, different currents can be passed through the front and back surfaces of workpiece W, and different currents can be passed through the respective 4 sides of the front and back surfaces.

As shown in fig. 2 and 3, conductive patterns 31A, 32a1, 32a2, 33A, 31B, 33B, 34B1, 34B2 electrically connected to the clip 20 are formed on the clip main body 12 of an insulating material. As shown in fig. 2, in the left region of the surface of the jig main body 12, the clip pieces 31L of the clips 21L located in the left region among the 2 or more clips 21 and the conductive patterns 31A are connected by the electrodes 15A. The clip pieces 32U of the clip 22U located in the upper region among the 2 or more clips 22 are connected to the conductive patterns 32a1 by the electrodes 15B. The clip piece 32L of the clip 22L located in the lower region among the 2 or more clips 22 and the conductive pattern 32a2 are connected by the electrode 15B. The clip piece 33L of the clip 23L located in the left area among the 2 or more clips 23 is connected to the conductive pattern 33A by the electrode 15C. These conductive patterns 31A, 32a1, 32a2, 33A are connected to a terminal group 35A formed on, for example, a projection 16A (the projection projects in the width direction on the upper portion of the jig main body 12) via, for example, a wire 36A.

As shown in fig. 2, in the right region of the surface of the jig main body 12, the clip pieces 31R of the clip 21R located in the right region among the 2 or more clips 21 and the conductive pattern 31B are connected by the electrode 15A. The clip piece 34U of the clip 24U located in the upper region among the 2 or more clips 24 is connected to the conductive pattern 34B1 by the electrode 15D. The clip piece 34L of the clip 24L located in the lower region among the 2 or more clips 24 and the conductive pattern 34B2 are connected by the electrode 15D. The clip pieces 33R of the clip 23R located in the right region among the 2 or more clips 23 are connected to the conductive pattern 33B by the electrode 15C. These

conductive patterns

31B, 33B, 34B1, 34B2 are connected to a terminal group 35B formed on, for example, a projection 16B (which projects in the width direction above the jig main body 12) via, for example, a wire 36B. Thus, on the surface W of the rectangular workpiece W _F The current control can be independently performed in 4 parts divided into up, down, left, and right parts at most. Here, the

electrodes

15B and 15D may be electrically insulated in the upper region and the lower region, respectively, for precise independent control in the up-down direction. Similarly, the electrodes 15A and 15C may be electrically insulated in the left and right regions, respectively, for precise independent control in the left and right.

On the other hand, as shown in fig. 3, in the right region of the back surface of the jig main body 12, the clip pieces 41R of the clips 21R located in the right region (left region as viewed from the front surface) among the 2 or more clips 21 are connected to the conductive pattern 41A by the electrodes 15E. The clip 42U of the clip 22U located in the upper region among the 2 or more clips 22 is connected to the conductive pattern 42a1 by the electrode 15F. The clip pieces 42L of the clips 22L located in the lower region among the 2 or more clips 22 are connected to the conductive patterns 42a2 by the electrode 15F. The clip piece 43R of the clip 23R located in the right region (left region as viewed from the surface) of the 2 or more clips 23 and the conductive pattern 43A are connected by the electrode 15G. These conductive patterns 41A, 42a1, 42a2, 43A are connected to a terminal group 45A formed on the protrusion 16A of the jig main body 12 by, for example, a wire 37A.

As shown in fig. 3, in the left region of the back surface of the jig main body 12, the clip pieces 41L of the clips 21L located in the left region among the 2 or more clips 21 and the conductive patterns 41B are connected by the electrodes 15E. The clip 44U and the conductive pattern 44B1 of the clip 24U located in the upper region among the 2 or more clips 24 are connected by the electrode 15H. The clip 44L of the clip 24L located in the lower region among the 2 or more clips 24 and the conductive pattern 44B2 are connected by the electrode 15H. The clip piece 43L of the clip 23 located in the left area among the 2 or more clips 23 and the conductive pattern 43B are connected by the electrode 15G. These

conductive patterns

41B, 43B, 44B1, 44B2 are connected to a terminal group 45B formed on the protrusion 16B of the jig main body 12 by, for example, a wire 37B. Thus, on the back surface W of the rectangular workpiece W _B The current control may be performed independently by dividing the current into 4 parts at most, i.e., up, down, left, and right. Here, the

electrodes

15F and 15H may be electrically insulated in the upper region and the lower region, respectively, for precise independent control in the up-down direction. Similarly, the

electrodes

15E and 15G may be electrically insulated in the left and right regions, respectively, for precise left and right independent control.

The

conductive patterns

41A, 41B, 42a1, 42a2, 43A, 43B, 44B1, 44B2 formed on the front and back surfaces of the jig 10 can be prevented from being plated by insulating coating. The electrodes 15A to 15D shown in fig. 2 and the electrodes 15E to 15H shown in fig. 3 are disposed in the vicinity of the periphery of the workpiece W, and can function as dummy electrodes for eliminating so-called dog-bone phenomenon in which the plating thickness is abnormal due to electric field concentration occurring at the periphery of the workpiece W. The electrodes 15A to 15D shown in fig. 2 and the electrodes 15E to 15H shown in fig. 3 may be covered with position-adjustable insulators 17A to 17H for preventing plating adhesion and adjusting the amount of electrode exposure, which make the electrode exposed portion variable, in the region between the electrodes (see japanese patent application No. 2019-15827 of the present applicant).

1.3. Surface treatment tank

In fig. 1, the surface treatment tank 100 includes

support portions

110 and 120 for detachably supporting the jig 10 holding the workpiece W in a vertical state. The lower support portion 110 has a slit into which the lower end portion of the jig 10 is inserted. The upper support portion 120 also has a slit into which the upper end portion of the jig 10 is inserted. The jig 10 is lowered from above the surface treatment tank 100 and held in a vertical state by the

support portions

110 and 120 as shown in fig. 4. The upper support portion 120 includes a terminal group (not shown) that contacts the

terminal groups

35A,35B,45A, and 45B of the jig 10. Thus, by lowering the jig 10 from above and supporting the jig on the upper support portion 120, the

terminal groups

35A,35B,45A, and 45B of the jig 10 can be connected to the rectifier located outside the surface treatment tank 100. Here, the jig 10 has a bottom side 13A and two

side edges

13B,13C as shown in FIGS. 2 and 3. The support portion may further include a partition wall 130 (see fig. 1 and 4) surrounding the bottom side 13A and the two

side edges

13B,13C of the jig 10 and supported by the lower and

upper support portions

110, 120. Thus, the surface treatment tank 100 is divided into the 1 st tank 101 and the 2 nd tank 102 by the

support portions

110 and 120 and the partition walls 130, the jig 10 supported by the support portions, and the workpiece W held by the jig 10, as shown in fig. 4. It should be noted that the 1 st and 2

nd grooves

101 and 102 do not necessarily have to be liquid-tightly sealed, but may be sealed. Further, the periphery of the jig main body 12 can be liquid-tightly sealed by driving the

support portions

110 and 120, the partition 130, and the like by sandwiching the periphery of the jig main body 12.

As shown in FIGS. 1 and 4, the surface treatment bath 100 has a surface W corresponding to a workpiece W _F And a back surface W _B A1 st wall portion 140 and a2 nd wall portion 150, which are opposed to each other. On the surface W of the workpiece W _F A1 st flow path FP1 for allowing the treatment liquid 2 to flow is formed between the first wall part 140 and the second wall part 1, and the rear surface W of the workpiece W _B The 2 nd flow path FP2 is formed between the 2 nd wall part 150 and the processing liquid 2.

As shown in FIG. 1, the 1 st wall part 140 can hold the surface W of the workpiece W _F The 1 st anode 142 and the 2 nd wall part 150 facing each other can hold the back surface W of the workpiece W _B An opposing 2 nd anode 152. For carrying out the electrolytic plating, at least one rectifier is provided. At least one rectifier is connected to the 1 st anode 142 and the 2 nd anode 152, and sets the work W at the cathode by the jig 10.

This embodimentWherein at least the surface W of the workpiece W is independently set _F And a back surface W _B As shown in fig. 5 (a) to 5 (C), it is preferable to provide 2 or more rectifiers for the current to flow. FIG. 5A is provided with 2 rectifiers 300A, 300B, the rectifiers 300A and the clips 31 to 34 (these clips and the surface W of the workpiece W) _F Contacts) electrically connected to the commutator 300B and the clips 41 to 44 (these clips are connected to the back surface W of the workpiece W) _B Contacts) are electrically connected. By independently controlling the 2 rectifiers 300A, 300B, the setting on the surface W of the workpiece W can be independently performed _F And a back surface W _B The current flowing. Thus, in the work W, i.e., the surface W _F And a back surface W _B The plating areas are significantly different from each other, and the current can be adjusted according to the plating area and the plating site. In this case, the respective contacts of the 2 rectifiers 300A and 300B electrically connected to the 1 st anode 142 and the 2 nd anode 152 are disposed at the respective centers of the 1 st anode 142 and the 2 nd anode 152, for example.

In fig. 5 (B), 4 rectifiers 310A to 310D, a rectifier 310A and

clip pieces

31,32U, and 34U (these clip pieces and the surface W of the work W) are provided _F Upper region contact of) and the commutator 310B is electrically connected to the

clips

33,32L,34L (which are in contact with the surface W of the workpiece W) _F Lower region contact) of the commutator 310C with the

clips

41,42U,44U (which are in contact with the back surface W of the workpiece W) _B Upper region contact of) and commutator 310D is electrically connected to

clips

43,42L,44L (which are attached to back surface W of workpiece W) _B Lower area contact) electrical connections. Thus, on the surface W of the workpiece W _F And a back surface W _B The current flowing in 2 regions of the upper region and the lower region of the workpiece W and 4 regions of the front surface and the back surface can be controlled independently for each surface. In this case, the contacts of the 4 rectifiers 310A to 310D electrically connected to the 1 st anode 142 and the 2 nd anode 152 are arranged to correspond to 4 regions in total, i.e., the upper region of the 1 st anode 142, the lower region of the 1 st anode 142, the upper region of the 2 nd anode 152, and the lower region of the 2 nd anode 152.

In fig. 5C, 8 rectifiers 320A to 320H, a rectifier 320A and clip pieces 31L and 32U (these clip pieces and the surface W of the workpiece W) are provided _F Upper left region contact) of the commutator 320B with the clips 32L,33L (which are in contact with the surface W of the workpiece W) _F Lower left area contact) of the commutator 320C with the clip pieces 31R,34U (which are in contact with the surface W of the workpiece W) _F Upper right region contact) of the commutator 320D with the clips 33R,34L (which are in contact with the surface W of the workpiece W) _F Lower right area contact) and the commutator 320E is electrically connected to the clips 41L,44U (which are attached to the back surface W of the workpiece W) _B Upper left area contact) and commutator 320F is electrically connected to clips 43L,44L (which are attached to back side W of workpiece W) _B Contact the lower left area of the workpiece W), and the commutator 320G is electrically connected to the clips 41R,42U (which are attached to the back surface W of the workpiece W) _B Upper right region contact) of the commutator 320H and the clips 42L,43R (which are in contact with the back surface W of the workpiece W) _B The lower right area of the contact) are electrically connected. Thus, on the surface W of the workpiece W _F And a back surface W _B The current flowing in 4 regions, i.e., the upper left region, the lower left region, the upper right region, and the lower right region, of the workpiece W and the total of 8 regions, i.e., the front surface and the rear surface, can be independently controlled for each surface of the workpiece W. In this case, the 8 respective contacts of the rectifiers 320A to 320H electrically connected to the 1 st anode 142 and the 2 nd anode 152 are arranged so as to correspond to 8 regions in total, i.e., the upper left region, the lower left region, the upper right region, and the lower right region of the 1 st anode 142, and the upper left region, the upper 1 st anode 142, the lower 1 st anode 142, the upper 2 nd anode 152, and the lower 2 nd anode 152. However, the front and back surfaces may be divided into more than 8 parts in total.

The surface treatment tank 100 may have

ejection tanks

160 and 170 in the upper part thereof, as shown in FIG. 1. The

ejection tanks

160, 170 store the processing liquid 2 supplied from the processing liquid circulating portion 200, and have

liquid ejection portions

162, 172 for ejecting into the surface treatment tank 100 in a first-in first-out manner. The discharge tank 160 supplies the processing liquid 2 to the 1 st tank 101, and the discharge tank 170 supplies the processing liquid 2 to the 2 nd tank 102. The

liquid ejecting portions

162 and 172 eject the processing liquid uniformly over the entire width of the workpiece W. The discharge ports of the

liquid discharge portions

162 and 172 may be opened at a position lower than the liquid level of the processing liquid in the normal operation mode. This allows the treatment liquid to be discharged without involving air. As shown in fig. 1 and 4, the surface treatment tank 100 has

liquid discharge ports

103 and 104 in the lower portion thereof. The drain port 103 opens into the 1 st tank 101, and the drain port 104 opens into the 2 nd tank 102. The shape of the

liquid discharge ports

103 and 104 is not limited to a circular shape, and may be a rectangular slit or the like.

As shown in fig. 1 and 4, the surface treatment tank 100 may have 1 st and 2

nd overflow tanks

180A, 180B. The 1 st and 2

nd overflow tanks

180A,180B may be disposed adjacent to the sides of the 1 st tank 101 and the 2 nd tank 102. In the present embodiment, the 1 st overflow tank 180A is provided adjacent to the 1 st tank 101, and the 2 nd overflow tank 180B is provided adjacent to the 2 nd tank 102. Here, as shown in fig. 4, a notch 101A is provided at an upper portion of a wall of the 1 st groove 101, and a notch 181A is also provided at an upper portion of a wall of the overflow groove 180. The processing liquid 2 that has passed through the notch portions 104A and 181 overflows from the 1 st tank 101 and flows into the overflow tank 180. By overflowing the treatment liquid 2 in the 1 st tank 101 in this manner, the liquid level of the treatment liquid 2 in the 1 st tank 101 can be maintained at a fixed liquid level that is the 1 st overflow liquid level. Similarly, a notch 102A is provided in the 2 nd groove 102, and a notch 181B is provided in an upper portion of a wall of the 2 nd overflow groove 180B. Thus, by overflowing the treatment liquid 2 in the 2 nd tank 102, the liquid level of the treatment liquid 2 in the 2 nd tank 102 can be constantly maintained at the 2 nd overflow liquid level. Note that the 1 st and 2 nd overflow levels may be set to be the same, or may be different from each other, or at least one of the 1 st and 2 nd overflow levels may be changed by adjusting the weir height. Further, a liquid level meter for the treatment liquid may be provided in each of the 1 st tank 101 and the 2 nd tank 102. The action with respect to the level gauge is as follows.

1.4. Treatment liquid circulating part

Next, the processing liquid circulation unit 200 will be described with reference to fig. 1. In fig. 1, the processing liquid circulation unit 200 includes: the 1 st circulating part 210 for the 1 st flow LF1 of the processing liquid 2 flowing from the upper portion of the surface treatment tank 100 to the lower portion thereof is formed along the 1 st flow path FP1, and the 2 nd circulating part 220 for the 2 nd flow LF2 of the processing liquid 2 flowing from the upper portion of the surface treatment tank 100 to the lower portion thereof is formed along the 2 nd flow path F2. Due to the 1 st liquid flow LF1 andthe 2 nd liquid stream LF2 flows from top to bottom so that impurities do not stagnate. Thus, even when plating conductive patterns, particularly conductive patterns having a small line width and a small pitch, it is possible to eliminate a defect that the conductive patterns are short-circuited by adhesion of impurities. The flow rate per unit time of the 1 st flow LF1 may be variable in the 1 st cycle 210 and the flow rate per unit time of the 2 nd flow LF2 may be variable in the 2 nd cycle 220. Thereby, the surface W of the workpiece W can be independently set _F And a back surface W _B The treatment conditions were set to be the respective conditions.

The treatment liquid circulation unit 200 includes: a conditioning tank CT for conditioning the treatment liquid 2 discharged from the surface treatment tank 100, and a pump P for pumping the treatment liquid 2 in the conditioning tank CT. In the present embodiment, the adjustment tank CT and the pump P are shared by the 1 st circulation unit 210 and the 2 nd circulation unit 220. Thus, even if the 1 st and 2

nd circulating units

210 and 220 are provided, the surface treatment device 1 can be kept compact. In the present embodiment, the filter F for removing impurities in the treatment liquid 2 may be shared by the 1 st circulation unit 210 and the 2 nd circulation unit 220. The conditioning tank CT can supply additives or plating components (for example, copper oxide in the case of copper plating) to the recovered processing liquid 2, and can perform temperature conditioning at a specific temperature.

Unlike the present embodiment, the 1 st circulating unit 210 includes a1 st adjustment tank for adjusting the processing liquid 2 discharged from the 1 st tank 101 and a1 st pump for pumping the processing liquid 2 in the 1 st adjustment tank, and the 2 nd circulating unit 220 includes a2 nd adjustment tank for adjusting the processing liquid 2 discharged from the 2 nd tank 102 and a2 nd pump for pumping the processing liquid 2 in the 2 nd adjustment tank. In this way, the temperature, the amount of the additive, and the like of the treatment liquid 2 can be independently set in the 1 st tank 101 and the 2 nd tank 102 in addition to the flow rate of the treatment liquid 2.

The 1 st circulation unit 210 includes a liquid discharge flow control valve FCVF1 and a shutoff valve (e.g., solenoid valve) SVF between the liquid discharge port 103 of the surface treatment tank 100 and the conditioning tank CT, and the 2 nd circulation unit 220 includes a liquid discharge flow control valve FCVB1 and a shutoff valve (e.g., solenoid valve) SVB between the liquid discharge port 104 of the surface treatment tank 100 and the conditioning tank CT. The overflow tank 180 may discharge the liquid directly into the adjustment tank CT without passing through a valve or the like.

The 1 st cycle 210 has a flow meter FMF1, a feed flow control valve FCVF2, and a three-way valve TCVF1 between the discharge tank 160 and the filter F of the surface treating tank 100. The 1 st outlet of the three-way valve TCVF1 is connected to the discharge tank 160, and the 1 st feed flow SFF1 is formed in the 1 st circulation unit 210. The 2 nd outlet of the three-way valve TCVF1 is connected to the inlet of the three-way valve TCVF 2. The 1 st outlet of the three-way valve TCVF2 is connected to the adjustment tank CT. By selecting the 1 st outlet of the three-way valve TCVF2, the total amount of process liquid 2 flowing through the 1 st circulation 210 is returned to the conditioning tank CT, forming a 3 rd feed flow SFF3 in the 1 st circulation 210. In this sense, the three-way valve TCVF2 functions as a bulk return valve. The 2 nd outlet of the three-way valve TCVF2 is connected to the inlet of the feed flow control valve FCVF 3. The outlet of the feed flow control valve FCVF3 is connected to the adjustment tank CT. The feed flow control valve FCVF3 returns a portion of the process fluid 2 flowing through the 1 st cycle 210 to the conditioning tank CT. In this sense, feed flow control valve FCVF3 functions as a partial return valve. The 2 nd outlet of the three way valve TCVF2 is also connected to a flow meter FMF 2. A liquid supply flow control valve FCVF4 and a check valve CVF1 are provided between the flow meter FMF2 and the discharge tank 160 of the surface treatment tank 100. Thereby, the 2 nd feed flow SFF2 is formed in the 1 st cycle part 210.

Similarly, the 2 nd circulation unit 220 includes a flow meter FMB1, a liquid supply flow control valve FCVB2, and a three-way valve TCVB1 between the spray tank 170 and the filter F of the surface treatment tank 100. The 1 st outlet of the three-way valve TCVB1 is connected to the ejection tank 170, and the 1 st feed flow SFB1 is formed in the 2 nd circulation unit 220. The 2 nd outlet of three-way valve TCVB1 is connected to the inlet of three-way valve TCVB 2. The 1 st outlet of three-way valve TCVB2 is connected to the adjustment tank CT. By selecting the 1 st outlet of the three-way valve TCVB2, the total amount of process liquid 2 flowing through the 2 nd circulation section 220 is returned to the adjustment tank CT, forming the 3 rd feed flow SFB3 in the 2 nd circulation section 220. In this sense, three-way valve TCVB2 functions as a total volume return valve. The 2 nd outlet of three-way valve TCVB2 is connected to the inlet of liquid supply flow control valve FCVB 3. The outlet of the liquid supply flow control valve FCVB3 is connected to the adjustment tank CT. The liquid supply flow control valve FCVB3 returns a part of the processing liquid 2 flowing through the 2 nd circulation unit 220 to the adjustment tank CT. In this sense, liquid supply flow control valve FCVB3 functions as a partial return valve. The 2 nd outlet of three way valve TCVB2 is also connected to flow meter FMB 2. A liquid supply flow control valve FCVB4 and a check valve CVB1 are provided between the flow meter FMB2 and the spray tank 170 of the surface treatment tank 100. Thereby, the 2 nd feed flow SFB2 is formed in the 2 nd circulation unit 220.

2. Surface treatment method

Next, a surface treatment method performed by the surface treatment apparatus 1 shown in fig. 1 will be described with reference to fig. 6 to 11.

2.1. Operation start mode

Fig. 6 shows an operation start mode before the jig 10 is set in the surface treatment tank 100. First, the pump P is opened with the shutoff valves SVF and SVB of fig. 1 fully closed. At this time, the valve control is performed such that the 1 st feed flow SFF1 is selected in the 1 st cycle 210 and the 1 st feed flow SFB1 is selected in the 2 nd cycle 220 in fig. 1. Thereby, the surface treatment tank 100 in an empty state is filled with the treatment liquid 2.

2.2. Normal mode of operation 1

Fig. 7 shows the normal operating mode 1. After the operation start mode is set, the shutoff valves SVF and SVB of fig. 1 are fully opened. Thereafter, the jig 10 is set in the surface treatment tank 100. The flow rate Q1/s of the treatment liquid 2 supplied to the 1 st tank 101 and the 2 nd tank 102 of the surface treatment tank 100 is the sum of the flow rate Q11/s of the treatment liquid 2 from each of the

drain ports

103 and 104 of the surface treatment tank 100 and the flow rate Q12/s of drain from the overflow tank 180 (Q1/s is Q11/s + Q12/s).

In the normal operation mode 1, the levels L0 of the treatment liquid 2 in the 1 st tank 101 and the 2 nd tank 102 of the surface treatment tank 100 are equal, and the flow rates of the 1 st liquid flow LF1 in the 1 st tank 101 and the 2 nd liquid flow LF2 in the 2 nd tank 102 are equal to Q1/s. Thus, in the normal mode 1, the workpiece W has the surface W _F And a back surface W _B The process conditions relating to the flow rate and pressure of the process liquid 2 in contact with the process surface can be set to be equal.

2.3. Normal mode of operation 2

In FIG. 7, the shut-off valves SVF and SVB of FIG. 1 are fully closed, discharging the low flow Q2/s (Q2/s < Q1 >s) are supplied from the 1 st and 2

nd circulation units

210 and 220 to the 1 st and 2

nd tanks

101 and 102. At this time, the valve control is performed such that the 2 nd supply flow SFF2 is selected in the 1 st cycle 210 and the 2 nd supply flow SFB2 is selected in the 2 nd cycle 220 in fig. 1. In the normal operation mode 2, the levels L0 of the treatment liquid 2 in the 1 st tank 101 and the 2 nd tank 102 of the surface treatment tank 100 are equal, and the flow rates of the 1 st liquid flow LF1 in the 1 st tank 101 and the 2 nd liquid flow LF2 in the 2 nd tank 102 are equal to Q2/s. In the normal operation mode 2, the flow rate flowing per unit time is lower than that in the normal operation mode 1, and the difference between the two modes is that the flow rate is set to be lower than that in the surface W of the workpiece W _F And a back surface W _B The process conditions relating to the flow rate and pressure of the process liquid 2 in contact with the process surface can be set to be equal.

2.4. Through-hole processing mode 1

Fig. 8 shows the through-via-hole processing mode 1. In the through-hole treatment mode 1, the liquid level L0 and the flow rate Q1/s of the treatment liquid 2 in the 1 st tank 101 are the same as those in the normal operation mode 1. That is, the valve control is performed such that the 1 st feed flow SFF1 is selected in the 1 st cycle 210 of fig. 1. On the other hand, the flow rate Q3/s of the treatment liquid 2 in the 2 nd tank 102 is smaller than the flow rate Q1/s in the normal operation mode 1 (Q3/s < Q1/s). That is, the valve control is performed such that the 2 nd feed flow SFB2 is selected in the 2 nd cycle 220.

Thus, the level L0 of the treatment liquid 2 in the 1 st tank 101 of the surface treatment tank 100 is equal to the overflow level in the 1 st overflow tank 180A, while the level L1 or L2 (L2) is lower in the 2 nd tank 102 separated from the 1 st tank 101 by the work W, the jig 10, or the like<L1<L0). Therefore, in the 1 st bath 101 and the 2 nd bath 102, the pressure of the processing liquid 2 acting on the processing surface of the workpiece W can be made different by the difference in the liquid surface level between the 1 st bath 101 and the 2 nd bath 102. The workpiece W has a surface W _F And a back surface W _B In the case of a through hole, the treatment liquid can be replaced from the higher pressure side to the lower pressure side in the through hole, and the surface treatment in the through hole can be improved. Similarly, the 1 st tank 101 may be set to the low liquid level L1 or L2, and the 2 nd tank 102 may be set to the high liquid level L0. In addition, the low liquid level L1 or L2 in the 1 st tank 101 and/or the 2 nd tank 102 may pass through the 1 st tank 101 and/or the 2 nd tank 102The setting or adjustment of the overflow level of the tank 102.

2.5. Through-via-hole processing mode 2

Fig. 9 shows the through-via-hole processing mode 2. In the through-hole treatment mode 2, the liquid level L0 and the flow rate Q1/s of the treatment liquid 2 in the 1 st tank 101 were the same as in the normal operation mode 1. That is, the valve control is performed such that the 1 st feed flow SFF1 is selected in the 1 st cycle 210 of fig. 1. On the other hand, in the 2 nd circulation unit 220, the valve control is performed so that the 2 nd supply flow SFB2 is selected simultaneously with or after the installation of the jig 10 in the surface treatment tank 100. That is, in the 2 nd circulation unit 220, a small flow rate Q4/s (Q4/s < Q1/s) in the processing liquid 2 pumped by the pump P is supplied to the surface treatment tank 100.

In the through-hole processing mode 2, a part of the flow rate Q1/s flowing through the 1 st groove 101 passes through the surface W of the workpiece W _F And a back surface W _B The penetrating through-hole flows to the 2 nd groove 102. This enables the treatment liquid 2 to be displaced from the liquid-flow side to the liquid-non-flow side in the through hole of the workpiece W, thereby improving the surface treatment in the through hole.

2.6. Through-hole processing mode 3

Fig. 10 shows the through-via-hole processing mode 3. In the through-hole treatment mode 3, the liquid level L0 and the flow rate Q1/s of the treatment liquid 2 in the 1 st tank 101 are the same as those in the normal operation mode 1. That is, the valve control is performed such that the 1 st feed flow SFF1 is selected in the 1 st cycle 210 of fig. 1. On the other hand, in the 2 nd circulation unit 220, the shutoff valve SVB is fully opened, and the valve control is performed so that the 3 rd supply flow SFB3 is selected. That is, in the 2 nd circulation unit 220, all of the treatment liquid 2 pumped by the pump P is returned to the adjustment tank CT by the three-way valve TCVB2 and is not supplied to the surface treatment tank 100.

In the through-hole processing mode 3, as in the through-hole processing mode 2, a part of the flow rate Q1/s flowing through the 1 st groove 101 passes over the surface W of the workpiece W _F And a back surface W _B The penetrating through-hole flows to the 2 nd groove 102. This enables the treatment liquid 2 to be displaced from the liquid-flow side to the liquid-non-flow side in the through hole of the workpiece W, thereby improving the surface treatment in the through hole.

In the above-described normal operation modes 1 and 2 and through-hole treatment modes 1 to 3, the flow rate and the liquid level of the treatment liquid 2 are changed in the 1 st tank 101 and the 2 nd tank 102, and in addition, the temperature, the additive amount, and the like of the treatment liquid 2 may be independently set in the 1 st and 2 nd adjustment tanks provided in the 1 st and 2

nd circulation units

210 and 220. Further, on the surface W of the workpiece W _F And a back surface W _B The current may be further controlled by a rectifier provided in each of the divided regions of each surface. In addition, when the level meters of the process liquid 2 installed in the 1 st tank 101 and the 2 nd tank 102 detect a liquid level lower than the overflow liquid level, a warning may be issued in response to an abnormality such as clogging occurring in a part of the corresponding 1 st and 2

nd circulation units

210 and 220.

2.7. Cleaning or run-stop modes

Fig. 11 shows a cleaning or shutdown mode. In this mode, the shutoff valves SVF, SVB of fig. 1 are fully open. Further, the valve control is performed such that the 3 rd supply flow SFF3 is selected in the 1 st cycle 210 and the 3 rd supply flow SFB3 is selected in the 2 nd cycle 220 in fig. 1. Thus, in the 1 st and 2

nd circulation units

210 and 220, all of the processing liquid 2 pumped by the pump P is returned to the conditioning tank CT by the three-way valves TCVF2 and TCVB2, and is not supplied to the surface treatment tank 100. In this way, the processing liquid 2 supplied to the surface treatment tank 100 can be shut off, and the operation stop mode or the cleaning mode can be set.

2.8. Current regulation mode

In each of the modes other than the operation start mode, the cleaning mode, and the operation stop mode, the current flowing between the work W and the 2 or more rectifiers shown in fig. 5 (a) to 5 (C) may be controlled. Particularly, in the present embodiment, the workpiece W has a front surface W _F And a back surface W _B The current values can be set independently from each other, and the current values can be set on the surface W of the workpiece W _F And a back surface W _B The current value can be set independently in the divided regions of each surface. Thereby, for example, even the surface W _F 95% of the area of the back surface W is the plating area _B Is only 5% ofThe coating area can be adjusted in accordance with the plating area and the plating site.

Description of the symbols

1 … surface treatment device, 2 … treatment solution, 10 … jig, 12 … main body plate, 13a … lower part, 13B … 1 st side part, 13C … 2 nd side part, 14 … rectangular opening, 16A,16B … protruding piece, 21,41 … first clamp, 22,42 … second clamp, 23,43 … first clamp, 24,44 … 4 th clamp, 31A-34B …, 41A-44B … conductive pattern, 35A,35B,45A,45B … terminal group, 36A-37B … wiring, 100 … surface treatment groove, 101 … first groove, 101A,181 … notch, 102 … first groove, 103, 104 … liquid discharge port, 110 … lower part support part, 120 upper part support part, 130, 140 … first 1 wall part, 142, anode 72 first 1 anode part, 150 first 2 nd side part, 152, … second side part, … spray liquid discharge port, …, anode … discharge part, … lower part support part, … upper part, … partition part, … upper part support part, …, 130, 140 … spray liquid discharge part, …, anode spray liquid discharge part, … discharge part 200, … discharge part, … discharge part, 210 … 1 st cycle, 220 … 2 nd cycle, 300A-320H … rectifier, CT … adjustment tank, F … filter, P … pump, FCVF 1-FCVB 4 … flow control valve, FCVF1, FCVB1 … liquid discharge flow control valve, FCVF 2-FCVF 4, FCVB 2-FCVB 4 … liquid supply flow control valve, FCVF3, FCVB3 … partial return valve, SVF, SVB … shut-off valve (solenoid valve), FMF 1-FMB 2 … flow meter, TCVF 1-TCVB 2 … three-way valve, TCVF2, TCVB2 … total amount return valve, P … pump, W … workpiece, W … work piece, W1-FMB 2 … flow meter _F … 1 st principal surface, W _B … major face 2.

Claims

1. A surface treatment device, comprising:

a jig which surrounds and holds the periphery of a workpiece having the 1 st main surface and the 2 nd main surface in a front-back relationship as a surface to be processed;

a surface treatment tank; and

the surface treatment tank includes:

a support portion that detachably supports the jig that holds the workpiece in a vertical state; and

a1 st wall portion and a2 nd wall portion opposed to the 1 st principal surface and the 2 nd principal surface of the workpiece, respectively,

forming a1 st channel through which the treatment liquid flows between the 1 st main surface and the 1 st wall portion of the workpiece, and forming a2 nd channel through which the treatment liquid flows between the 2 nd main surface and the 2 nd wall portion of the workpiece,

the treatment liquid circulating unit includes a1 st circulating unit for forming a1 st flow of the treatment liquid along the 1 st channel, and a2 nd circulating unit for forming a2 nd flow of the treatment liquid along the 2 nd channel.

2. The surface treatment apparatus according to claim 1,

in the 1 st circulation part, the flow rate of the 1 st liquid flow per unit time is variable,

in the 2 nd circulation part, the flow rate of the 2 nd liquid flow per unit time is variable.

3. The surface treatment apparatus according to claim 1 or 2,

dividing the surface treatment tank into a1 st tank and a2 nd tank by the support portion, the jig supported by the support portion, and the workpiece held by the jig,

the surface treatment device further comprises:

a1 st overflow tank for returning the treatment liquid exceeding a certain level in the 1 st tank to the treatment liquid circulation portion; and

a2 nd overflow tank that returns the treatment liquid exceeding a certain level in the 2 nd tank to the treatment liquid circulation portion.

4. The surface treatment apparatus of claim 3, wherein at least one of the 1 st and 2 nd overflow troughs is capable of adjusting an overflow level.

5. The surface treatment apparatus according to claim 3 or 4,

the treatment liquid circulating section includes:

an adjustment tank for adjusting the treatment liquid discharged from the surface treatment tank; and

a pump for pumping the treatment liquid in the adjustment tank,

the conditioning tank comprises:

a1 st adjustment tank for adjusting the treatment liquid discharged from the 1 st tank; and

a2 nd adjustment tank for adjusting the treatment liquid discharged from the 2 nd tank,

the pump includes:

a1 st pump for pumping the treatment liquid in the 1 st adjustment tank; and

and a2 nd pump for pumping the treatment liquid in the 2 nd adjustment tank.

6. The surface treatment device according to any one of claims 1 to 4,

the treatment liquid circulating section includes:

a pump for pumping the treatment liquid in the adjustment tank,

the conditioning tank and the pump are shared by the 1 st cycle part and the 2 nd cycle part.

7. The surface treatment apparatus of claim 5 or 6, wherein the 1 st cycle portion and the 2 nd cycle portion each comprise:

a drain flow control valve for varying a flow rate per unit time of the treatment liquid drained from the lower portion of the surface treatment tank;

a liquid supply flow control valve for varying a flow rate per unit time of the treatment liquid supplied from the upper portion of the surface treatment tank; and

and a partial return valve that returns a part of the treatment liquid pumped by the pump to the adjustment tank.

8. The surface treatment apparatus according to any one of claims 5 to 7,

the 1 st cycle part and the 2 nd cycle part respectively comprise:

a shut-off valve for shutting off the discharge of the treatment liquid from the lower part of the surface treatment tank; and

and a total amount return valve that returns all of the treatment liquid pumped by the pump to the adjustment tank.

9. The surface treatment device according to any one of claims 1 to 8,

further comprising at least one rectifier which is connected to the power supply,

the 1 st wall portion holds a1 st anode facing the 1 st main surface of the workpiece,

the 2 nd wall portion holds a2 nd anode opposed to the 2 nd principal surface of the workpiece,

the at least one rectifier is connected to the 1 st anode and the 2 nd anode, and sets the workpiece at a cathode by the jig.

10. The surface treatment apparatus according to claim 9,

the jig includes a1 st conduction part which is conducted with the 1 st main surface of the workpiece and a2 nd conduction part which is conducted with the 2 nd main surface of the workpiece,

the at least one rectifier includes a1 st rectifier connected to the 1 st conduction part and the 1 st anode of the jig, and a2 nd rectifier connected to the 2 nd conduction part and the 2 nd anode of the jig.

11. The surface treatment apparatus according to claim 9,

the jig includes:

a1 st conduction part which is conducted to a1 st divided region of the 1 st main surface of the workpiece;

a2 nd conduction part which is conducted with a2 nd divided region of the 1 st main surface of the workpiece;

a 3 rd conduction part which is conducted with a1 st divided region of the 2 nd main surface of the workpiece; and

a 4 th conduction part which is conducted to a2 nd divided region of the 2 nd main surface of the workpiece,

the at least one rectifier includes 1 st to 4 th rectifiers,

the 1 st rectifier is connected to the 1 st divided region of the 1 st anode and the 1 st conduction part of the jig, which are opposed to the 1 st divided region of the 1 st main surface of the workpiece;

the 2 nd rectifier is connected to a2 nd divided region of the 1 st anode and the 2 nd conduction part of the jig, which are opposed to the 2 nd divided region of the 1 st main surface of the workpiece;

the 3 rd rectifier is connected to the 1 st divided region of the 2 nd anode and the 3 rd conduction part of the jig, which are opposed to the 1 st divided region of the 2 nd principal surface of the workpiece;

the 4 th rectifier is connected to a2 nd divided region of the 2 nd anode opposed to the 2 nd divided region of the 2 nd principal surface of the workpiece and the 4 th conduction part of the jig.

12. A surface treatment method comprises the following steps:

a step of supporting a flat-plate-shaped jig, which surrounds and holds the periphery of a workpiece having a1 st main surface and a2 nd main surface in a front-back relationship as a surface to be processed, on a support portion provided in a surface processing tank, and vertically supporting the workpiece between a1 st wall portion and a2 nd wall portion provided in the surface processing tank; and

and circulating the treatment liquid inside and outside the surface treatment tank by a1 st circulating unit so as to form a treatment liquid flowing from top to bottom along a1 st flow path disposed between the 1 st main surface and the 1 st wall portion of the workpiece, and circulating the treatment liquid inside and outside the surface treatment tank by a2 nd circulating unit so as to form a2 nd flow of the treatment liquid flowing from top to bottom along a2 nd flow path disposed between the 2 nd main surface and the 2 nd wall portion of the workpiece, thereby performing surface treatment on the 1 st main surface and the 2 nd main surface of the workpiece.