JPWO2021131710A1 - - Google Patents

Info

Publication number
JPWO2021131710A1
JPWO2021131710A1 JP2021567195A JP2021567195A JPWO2021131710A1 JP WO2021131710 A1 JPWO2021131710 A1 JP WO2021131710A1 JP 2021567195 A JP2021567195 A JP 2021567195A JP 2021567195 A JP2021567195 A JP 2021567195A JP WO2021131710 A1 JPWO2021131710 A1 JP WO2021131710A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021567195A
Other versions
JP7308292B2 (ja
JPWO2021131710A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of JPWO2021131710A1 publication Critical patent/JPWO2021131710A1/ja
Publication of JPWO2021131710A5 publication Critical patent/JPWO2021131710A5/ja
Application granted granted Critical
Publication of JP7308292B2 publication Critical patent/JP7308292B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laser Beam Processing (AREA)
JP2021567195A 2019-12-26 2020-12-09 基板処理装置及び基板処理方法 Active JP7308292B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019236287 2019-12-26
JP2019236287 2019-12-26
PCT/JP2020/045883 WO2021131710A1 (ja) 2019-12-26 2020-12-09 基板処理装置及び基板処理方法

Publications (3)

Publication Number Publication Date
JPWO2021131710A1 true JPWO2021131710A1 (ja) 2021-07-01
JPWO2021131710A5 JPWO2021131710A5 (ja) 2022-08-31
JP7308292B2 JP7308292B2 (ja) 2023-07-13

Family

ID=76575478

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021567195A Active JP7308292B2 (ja) 2019-12-26 2020-12-09 基板処理装置及び基板処理方法

Country Status (4)

Country Link
JP (1) JP7308292B2 (ja)
CN (1) CN114830293A (ja)
TW (1) TW202129742A (ja)
WO (1) WO2021131710A1 (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10125929A (ja) * 1996-08-27 1998-05-15 Seiko Epson Corp 剥離方法
JP2013179237A (ja) * 2012-02-29 2013-09-09 Disco Abrasive Syst Ltd リフトオフ装置
JP2013239650A (ja) * 2012-05-16 2013-11-28 Tokyo Ohka Kogyo Co Ltd 支持体分離方法および支持体分離装置
JP2015144192A (ja) * 2014-01-31 2015-08-06 株式会社ディスコ リフトオフ方法
JP2017084910A (ja) * 2015-10-26 2017-05-18 東京応化工業株式会社 支持体分離方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10125929A (ja) * 1996-08-27 1998-05-15 Seiko Epson Corp 剥離方法
JP2013179237A (ja) * 2012-02-29 2013-09-09 Disco Abrasive Syst Ltd リフトオフ装置
JP2013239650A (ja) * 2012-05-16 2013-11-28 Tokyo Ohka Kogyo Co Ltd 支持体分離方法および支持体分離装置
JP2015144192A (ja) * 2014-01-31 2015-08-06 株式会社ディスコ リフトオフ方法
JP2017084910A (ja) * 2015-10-26 2017-05-18 東京応化工業株式会社 支持体分離方法

Also Published As

Publication number Publication date
JP7308292B2 (ja) 2023-07-13
TW202129742A (zh) 2021-08-01
WO2021131710A1 (ja) 2021-07-01
CN114830293A (zh) 2022-07-29

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