JPWO2021131594A1 - - Google Patents

Info

Publication number
JPWO2021131594A1
JPWO2021131594A1 JP2021567147A JP2021567147A JPWO2021131594A1 JP WO2021131594 A1 JPWO2021131594 A1 JP WO2021131594A1 JP 2021567147 A JP2021567147 A JP 2021567147A JP 2021567147 A JP2021567147 A JP 2021567147A JP WO2021131594 A1 JPWO2021131594 A1 JP WO2021131594A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021567147A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021131594A1 publication Critical patent/JPWO2021131594A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
JP2021567147A 2019-12-23 2020-12-04 Pending JPWO2021131594A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019232012 2019-12-23
PCT/JP2020/045154 WO2021131594A1 (ja) 2019-12-23 2020-12-04 電磁波シールド用組成物

Publications (1)

Publication Number Publication Date
JPWO2021131594A1 true JPWO2021131594A1 (ja) 2021-07-01

Family

ID=76573964

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021567147A Pending JPWO2021131594A1 (ja) 2019-12-23 2020-12-04

Country Status (6)

Country Link
US (1) US20230042359A1 (ja)
JP (1) JPWO2021131594A1 (ja)
KR (1) KR20220119379A (ja)
CN (1) CN114846919A (ja)
TW (1) TW202136430A (ja)
WO (1) WO2021131594A1 (ja)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4983150B2 (ja) * 2006-04-28 2012-07-25 東洋インキＳｃホールディングス株式会社 導電性被膜の製造方法
WO2012053034A1 (ja) * 2010-10-20 2012-04-26 ニホンハンダ株式会社 有機物被覆金属粒子の加熱焼結性の評価方法、加熱焼結性金属ペーストの製造方法、および金属製部材接合体の製造方法
JP6155876B2 (ja) * 2012-12-28 2017-07-05 東洋インキＳｃホールディングス株式会社 導電性樹脂組成物
CN106538086B (zh) 2014-04-18 2019-12-03 汉高股份有限及两合公司 电磁干扰屏蔽组合物及其应用方法
JP2018051526A (ja) * 2016-09-30 2018-04-05 日華化学株式会社 金属粒子分散体及びその製造方法

Also Published As

Publication number Publication date
WO2021131594A1 (ja) 2021-07-01
TW202136430A (zh) 2021-10-01
KR20220119379A (ko) 2022-08-29
US20230042359A1 (en) 2023-02-09
CN114846919A (zh) 2022-08-02

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Legal Events

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Effective date: 20220518

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