JPWO2021131160A1 - - Google Patents

Info

Publication number
JPWO2021131160A1
JPWO2021131160A1 JP2021566810A JP2021566810A JPWO2021131160A1 JP WO2021131160 A1 JPWO2021131160 A1 JP WO2021131160A1 JP 2021566810 A JP2021566810 A JP 2021566810A JP 2021566810 A JP2021566810 A JP 2021566810A JP WO2021131160 A1 JPWO2021131160 A1 JP WO2021131160A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021566810A
Other versions
JP7364692B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021131160A1 publication Critical patent/JPWO2021131160A1/ja
Application granted granted Critical
Publication of JP7364692B2 publication Critical patent/JP7364692B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
JP2021566810A 2019-12-27 2020-08-27 基板吸引保持構造及び基板搬送ロボット Active JP7364692B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/728,541 2019-12-27
US16/728,541 US11315823B2 (en) 2019-12-27 2019-12-27 Substrate suction-holding structure and substrate transfer robot
PCT/JP2020/032455 WO2021131160A1 (ja) 2019-12-27 2020-08-27 基板吸引保持構造及び基板搬送ロボット

Publications (2)

Publication Number Publication Date
JPWO2021131160A1 true JPWO2021131160A1 (ja) 2021-07-01
JP7364692B2 JP7364692B2 (ja) 2023-10-18

Family

ID=76547276

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021566810A Active JP7364692B2 (ja) 2019-12-27 2020-08-27 基板吸引保持構造及び基板搬送ロボット

Country Status (6)

Country Link
US (1) US11315823B2 (ja)
JP (1) JP7364692B2 (ja)
KR (1) KR20220116291A (ja)
CN (1) CN114600230A (ja)
TW (1) TWI776228B (ja)
WO (1) WO2021131160A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102652284B1 (ko) * 2022-07-11 2024-03-28 한국생산기술연구원 기판 이송용 핸드

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011029388A (ja) * 2009-07-24 2011-02-10 Tokyo Electron Ltd 真空吸着パッド、搬送アーム及び基板搬送装置
JP6568986B1 (ja) * 2018-06-28 2019-08-28 平田機工株式会社 アライメント装置、半導体ウエハ処理装置、およびアライメント方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4040254B2 (ja) * 1998-06-08 2008-01-30 クライテック株式会社 吸引装置
JP4214509B2 (ja) 2002-12-03 2009-01-28 株式会社ニコン 吸着保持部材及び吸着保持装置
US7055875B2 (en) * 2003-07-11 2006-06-06 Asyst Technologies, Inc. Ultra low contact area end effector
JP4895518B2 (ja) * 2005-03-22 2012-03-14 オリンパス株式会社 基板保持装置及び基板の保持方法
JP5861676B2 (ja) 2013-07-08 2016-02-16 株式会社安川電機 吸着構造、ロボットハンドおよびロボット
JP6486140B2 (ja) * 2015-02-25 2019-03-20 キヤノン株式会社 搬送ハンド、リソグラフィ装置及び被搬送物を搬送する方法
CN107527848B (zh) * 2016-06-20 2020-12-18 上海新昇半导体科技有限公司 一种机械手臂及基板的抓取方法
JP7160249B2 (ja) * 2018-08-08 2022-10-25 Smc株式会社 吸着装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011029388A (ja) * 2009-07-24 2011-02-10 Tokyo Electron Ltd 真空吸着パッド、搬送アーム及び基板搬送装置
JP6568986B1 (ja) * 2018-06-28 2019-08-28 平田機工株式会社 アライメント装置、半導体ウエハ処理装置、およびアライメント方法

Also Published As

Publication number Publication date
CN114600230A (zh) 2022-06-07
TWI776228B (zh) 2022-09-01
WO2021131160A1 (ja) 2021-07-01
JP7364692B2 (ja) 2023-10-18
US20210202291A1 (en) 2021-07-01
US11315823B2 (en) 2022-04-26
TW202124111A (zh) 2021-07-01
KR20220116291A (ko) 2022-08-22

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