JPWO2021117796A1 - - Google Patents

Info

Publication number
JPWO2021117796A1
JPWO2021117796A1 JP2021564019A JP2021564019A JPWO2021117796A1 JP WO2021117796 A1 JPWO2021117796 A1 JP WO2021117796A1 JP 2021564019 A JP2021564019 A JP 2021564019A JP 2021564019 A JP2021564019 A JP 2021564019A JP WO2021117796 A1 JPWO2021117796 A1 JP WO2021117796A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021564019A
Other languages
Japanese (ja)
Other versions
JP7660522B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021117796A1 publication Critical patent/JPWO2021117796A1/ja
Application granted granted Critical
Publication of JP7660522B2 publication Critical patent/JP7660522B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C08K5/5455—Silicon-containing compounds containing nitrogen containing at least one group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/548—Silicon-containing compounds containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J135/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least another carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2021564019A 2019-12-13 2020-12-10 樹脂組成物及び樹脂シート Active JP7660522B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019225068 2019-12-13
JP2019225068 2019-12-13
PCT/JP2020/045975 WO2021117796A1 (ja) 2019-12-13 2020-12-10 樹脂組成物及び樹脂シート

Publications (2)

Publication Number Publication Date
JPWO2021117796A1 true JPWO2021117796A1 (https=) 2021-06-17
JP7660522B2 JP7660522B2 (ja) 2025-04-11

Family

ID=76329893

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021564019A Active JP7660522B2 (ja) 2019-12-13 2020-12-10 樹脂組成物及び樹脂シート

Country Status (5)

Country Link
JP (1) JP7660522B2 (https=)
KR (1) KR102945376B1 (https=)
CN (1) CN114846053B (https=)
TW (1) TWI861307B (https=)
WO (1) WO2021117796A1 (https=)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05170953A (ja) * 1991-12-25 1993-07-09 Mitsubishi Rayon Co Ltd 炭素繊維強化樹脂複合材料用プリプレグ
JPH0693085A (ja) * 1992-09-11 1994-04-05 Mitsui Toatsu Chem Inc 樹脂組成物
JP2014101398A (ja) * 2012-11-16 2014-06-05 Hitachi Chemical Co Ltd 熱硬化性樹脂組成物、プリプレグ、金属張積層板及びプリント配線板
WO2015141618A1 (ja) * 2014-03-17 2015-09-24 旭化成イーマテリアルズ株式会社 感光性樹脂組成物、硬化レリーフパターンの製造方法、並びに半導体装置
JP2017110051A (ja) * 2015-12-14 2017-06-22 住友ベークライト株式会社 封止用樹脂組成物、半導体装置および車載用電子制御ユニット
JP2018115233A (ja) * 2017-01-16 2018-07-26 住友ベークライト株式会社 封止用樹脂組成物および半導体装置
JP2018154791A (ja) * 2017-03-21 2018-10-04 住友ベークライト株式会社 封止用樹脂組成物、半導体装置および車載用電子制御ユニット

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3193095B2 (ja) * 1992-02-24 2001-07-30 三菱レイヨン株式会社 複合材料の製造方法
JP2008095063A (ja) * 2006-09-13 2008-04-24 Hitachi Chem Co Ltd 半導体用接着フィルム、半導体用接着フィルム付きリードフレーム、半導体用接着フィルム付き半導体装置、半導体装置
TW201520695A (zh) * 2013-09-25 2015-06-01 Fujifilm Corp 感光性樹脂組成物、硬化膜的製造方法、硬化膜、液晶顯示裝置及有機ｅｌ顯示裝置
JP2015147849A (ja) 2014-02-05 2015-08-20 住友ベークライト株式会社 樹脂組成物および半導体装置
KR102470719B1 (ko) * 2017-03-13 2022-11-24 린텍 가부시키가이샤 수지 조성물 및 수지 시트

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05170953A (ja) * 1991-12-25 1993-07-09 Mitsubishi Rayon Co Ltd 炭素繊維強化樹脂複合材料用プリプレグ
JPH0693085A (ja) * 1992-09-11 1994-04-05 Mitsui Toatsu Chem Inc 樹脂組成物
JP2014101398A (ja) * 2012-11-16 2014-06-05 Hitachi Chemical Co Ltd 熱硬化性樹脂組成物、プリプレグ、金属張積層板及びプリント配線板
WO2015141618A1 (ja) * 2014-03-17 2015-09-24 旭化成イーマテリアルズ株式会社 感光性樹脂組成物、硬化レリーフパターンの製造方法、並びに半導体装置
JP2017110051A (ja) * 2015-12-14 2017-06-22 住友ベークライト株式会社 封止用樹脂組成物、半導体装置および車載用電子制御ユニット
JP2018115233A (ja) * 2017-01-16 2018-07-26 住友ベークライト株式会社 封止用樹脂組成物および半導体装置
JP2018154791A (ja) * 2017-03-21 2018-10-04 住友ベークライト株式会社 封止用樹脂組成物、半導体装置および車載用電子制御ユニット

Also Published As

Publication number Publication date
TW202136414A (zh) 2021-10-01
KR20220117216A (ko) 2022-08-23
KR102945376B1 (ko) 2026-03-27
JP7660522B2 (ja) 2025-04-11
TWI861307B (zh) 2024-11-11
CN114846053B (zh) 2024-11-12
WO2021117796A1 (ja) 2021-06-17
CN114846053A (zh) 2022-08-02

Similar Documents

Publication Publication Date Title
BR112019017762A2 (https=)
BR112021017339A2 (https=)
BR112021018450A2 (https=)
BR112021017637A2 (https=)
BR112021017892A2 (https=)
BR112021017782A2 (https=)
BR112021016821A2 (https=)
BR112021017939A2 (https=)
BR112021017738A2 (https=)
BR112021016996A2 (https=)
BR112021008711A2 (https=)
BR112019016141A2 (https=)
BR112021017728A2 (https=)
AU2020104490A5 (https=)
BR112021013944A2 (https=)
BR112021017703A2 (https=)
BR112021018102A2 (https=)
BR112019016142A2 (https=)
BR112019016138A2 (https=)
BR112021017732A2 (https=)
BR112021017234A2 (https=)
BR112021017355A2 (https=)
BR112021018168A2 (https=)
BR112021018093A2 (https=)
BR112021017173A2 (https=)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20231004

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240910

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20241108

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20241202

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20250318

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20250401

R150 Certificate of patent or registration of utility model

Ref document number: 7660522

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150