JPWO2021117396A1 - - Google Patents

Info

Publication number
JPWO2021117396A1
JPWO2021117396A1 JP2021563798A JP2021563798A JPWO2021117396A1 JP WO2021117396 A1 JPWO2021117396 A1 JP WO2021117396A1 JP 2021563798 A JP2021563798 A JP 2021563798A JP 2021563798 A JP2021563798 A JP 2021563798A JP WO2021117396 A1 JPWO2021117396 A1 JP WO2021117396A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021563798A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021117396A1 publication Critical patent/JPWO2021117396A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2021563798A 2019-12-11 2020-11-09 Pending JPWO2021117396A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019223752 2019-12-11
PCT/JP2020/041710 WO2021117396A1 (en) 2019-12-11 2020-11-09 Cationically curable composition, cured product, and joined body

Publications (1)

Publication Number Publication Date
JPWO2021117396A1 true JPWO2021117396A1 (en) 2021-06-17

Family

ID=76329757

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021563798A Pending JPWO2021117396A1 (en) 2019-12-11 2020-11-09

Country Status (4)

Country Link
JP (1) JPWO2021117396A1 (en)
CN (1) CN114761460B (en)
TW (1) TW202122444A (en)
WO (1) WO2021117396A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116888183A (en) * 2021-03-22 2023-10-13 松下知识产权经营株式会社 Thermosetting composition, electronic device and method for manufacturing electronic device
JP2024063368A (en) * 2022-10-26 2024-05-13 デクセリアルズ株式会社 Connection material, connection structure, and method for producing the connection structure

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6181005A (en) * 1984-09-28 1986-04-24 Seikosha Co Ltd Oscillating circuit
EP0653763A1 (en) * 1993-11-17 1995-05-17 SOPHIA SYSTEMS Co., Ltd. Ultraviolet hardenable, solventless conductive polymeric material
JP4860831B2 (en) * 2001-03-01 2012-01-25 株式会社リコー Photo-curable epoxy resin composition and photo-curable display element sealing agent
JP2002284966A (en) * 2001-03-27 2002-10-03 Mitsubishi Gas Chem Co Inc Flame-retardant cationic polymerizable resin composition
JP5302496B2 (en) * 2003-12-19 2013-10-02 ヘンケル コーポレイション Cationic curable epoxy resin composition
JP2007002073A (en) * 2005-06-22 2007-01-11 Adeka Corp Resin composition for optical sold forming and optical sold forming method using the same
JP5764419B2 (en) * 2011-07-19 2015-08-19 株式会社ダイセル Curable epoxy resin composition
CN102504745B (en) * 2011-11-09 2013-09-04 烟台德邦科技有限公司 Double curing encapsulating adhesive and preparation method thereof
US20200208019A1 (en) * 2015-12-02 2020-07-02 Threebond Co., Ltd. Cation-curable resin composition
CN105441001A (en) * 2015-12-24 2016-03-30 深圳市浩力新材料技术有限公司 High-performance adhesive for optical communication devices and preparation method thereof
WO2017175735A1 (en) * 2016-04-06 2017-10-12 株式会社スリーボンド Cationic-curable resin composition
JP6856213B2 (en) * 2017-03-07 2021-04-07 地方独立行政法人大阪産業技術研究所 UV curable resin composition

Also Published As

Publication number Publication date
TW202122444A (en) 2021-06-16
WO2021117396A1 (en) 2021-06-17
CN114761460B (en) 2024-03-15
CN114761460A (en) 2022-07-15

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Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220428

A621 Written request for application examination

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Effective date: 20231005