JPWO2021106713A5 - - Google Patents

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Publication number
JPWO2021106713A5
JPWO2021106713A5 JP2021561344A JP2021561344A JPWO2021106713A5 JP WO2021106713 A5 JPWO2021106713 A5 JP WO2021106713A5 JP 2021561344 A JP2021561344 A JP 2021561344A JP 2021561344 A JP2021561344 A JP 2021561344A JP WO2021106713 A5 JPWO2021106713 A5 JP WO2021106713A5
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JP
Japan
Prior art keywords
molded
wiring board
molded product
dimensionally
product provided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2021561344A
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English (en)
Japanese (ja)
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JPWO2021106713A1 (https=
JP7465893B2 (ja
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Priority claimed from PCT/JP2020/042995 external-priority patent/WO2021106713A1/ja
Publication of JPWO2021106713A1 publication Critical patent/JPWO2021106713A1/ja
Publication of JPWO2021106713A5 publication Critical patent/JPWO2021106713A5/ja
Application granted granted Critical
Publication of JP7465893B2 publication Critical patent/JP7465893B2/ja
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JP2021561344A 2019-11-25 2020-11-18 配線板の製造方法及び配線板、並びに、成形品の製造方法及び成形品 Active JP7465893B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019212302 2019-11-25
JP2019212302 2019-11-25
PCT/JP2020/042995 WO2021106713A1 (ja) 2019-11-25 2020-11-18 配線板の製造方法及び配線板、並びに、成形品の製造方法及び成形品

Publications (3)

Publication Number Publication Date
JPWO2021106713A1 JPWO2021106713A1 (https=) 2021-06-03
JPWO2021106713A5 true JPWO2021106713A5 (https=) 2022-07-19
JP7465893B2 JP7465893B2 (ja) 2024-04-11

Family

ID=76129349

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021561344A Active JP7465893B2 (ja) 2019-11-25 2020-11-18 配線板の製造方法及び配線板、並びに、成形品の製造方法及び成形品

Country Status (5)

Country Link
US (1) US12284767B2 (https=)
JP (1) JP7465893B2 (https=)
CN (1) CN114762464B (https=)
TW (1) TWI746282B (https=)
WO (1) WO2021106713A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120500917A (zh) * 2023-01-10 2025-08-15 日本发条株式会社 电路基板的制造装置及电路基板的制造方法
WO2026042538A1 (ja) * 2024-08-23 2026-02-26 株式会社フジクラ 成形品の製造方法、および成形品

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4401521A (en) * 1980-11-28 1983-08-30 Asahi Kasei Kogyo Kabushiki Kaisha Method for manufacturing a fine-patterned thick film conductor structure
JPH0739230B2 (ja) * 1987-05-29 1995-05-01 大日本印刷株式会社 導電性転写シ−ト
JP2588114B2 (ja) * 1993-06-18 1997-03-05 帝国通信工業株式会社 平滑基板の製造方法
JP3085649B2 (ja) * 1996-07-29 2000-09-11 京セラ株式会社 転写シート及びそれを用いた配線基板の製造方法
US6197145B1 (en) * 1998-08-17 2001-03-06 Ford Motor Company Method of laminating a flexible circuit to a substrate
JP2002305334A (ja) * 2001-04-09 2002-10-18 Canon Inc 機能性薄膜の転写方法
JP2003264368A (ja) * 2002-03-08 2003-09-19 Sony Corp 多層電気配線回路基板及びその製造方法
JP2006285179A (ja) 2005-03-09 2006-10-19 Fuji Photo Film Co Ltd 感光性永久レジストフィルム及び永久パターン形成方法
JP5630637B2 (ja) * 2010-02-26 2014-11-26 日立化成株式会社 感光性樹脂組成物
TWI472282B (zh) * 2012-03-09 2015-02-01 Taiyo Yuden Kk 轉移薄膜元件之方法及具備其之電路板
KR102045113B1 (ko) * 2013-11-01 2019-11-14 피피지 인더스트리즈 오하이오 인코포레이티드 전기전도성 물질의 전달 방법
US20160293334A1 (en) 2015-03-31 2016-10-06 Tdk Corporation Thin film capacitor
WO2016208371A1 (ja) 2015-06-26 2016-12-29 東レフィルム加工株式会社 導電積層体、それを用いた成型体、静電容量式タッチセンサーおよび面状発熱体、ならびに成型体の製造方法
CN108778011B (zh) * 2016-03-16 2021-02-12 东洋纺株式会社 可穿戴智能装置
JP6788526B2 (ja) * 2017-03-09 2020-11-25 株式会社フジクラ 伸縮性基板及びその製造方法
TWI703959B (zh) * 2018-03-19 2020-09-11 日商藤倉股份有限公司 拉伸性配線板以及拉伸性配線板之製造方法
JP6699783B2 (ja) * 2019-04-26 2020-05-27 大日本印刷株式会社 積層体ならびにそれを用いた導電性基材の製造方法および電子デバイスの製造方法

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