JPWO2021106580A1 - - Google Patents

Info

Publication number
JPWO2021106580A1
JPWO2021106580A1 JP2021561284A JP2021561284A JPWO2021106580A1 JP WO2021106580 A1 JPWO2021106580 A1 JP WO2021106580A1 JP 2021561284 A JP2021561284 A JP 2021561284A JP 2021561284 A JP2021561284 A JP 2021561284A JP WO2021106580 A1 JPWO2021106580 A1 JP WO2021106580A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021561284A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021106580A1 publication Critical patent/JPWO2021106580A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/18—Materials not provided for elsewhere for application to surfaces to minimize adherence of ice, mist or water thereto; Thawing or antifreeze materials for application to surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Combustion & Propulsion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2021561284A 2019-11-29 2020-11-11 Pending JPWO2021106580A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019217605 2019-11-29
PCT/JP2020/042146 WO2021106580A1 (ja) 2019-11-29 2020-11-11 保護膜形成用薬液及びウェハの洗浄方法

Publications (1)

Publication Number Publication Date
JPWO2021106580A1 true JPWO2021106580A1 (zh) 2021-06-03

Family

ID=76130202

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021561284A Pending JPWO2021106580A1 (zh) 2019-11-29 2020-11-11

Country Status (5)

Country Link
JP (1) JPWO2021106580A1 (zh)
KR (1) KR20220106131A (zh)
CN (1) CN114762087A (zh)
TW (1) TW202130756A (zh)
WO (1) WO2021106580A1 (zh)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5821844B2 (ja) 1975-04-03 1983-05-04 日本電気株式会社 マイクロハタダンフイルタ
CN1742063A (zh) * 2003-01-29 2006-03-01 旭硝子株式会社 涂料组合物、抗反射膜、光刻胶及采用该光刻胶的图形形成方法
KR101363441B1 (ko) * 2010-06-07 2014-02-21 샌트랄 글래스 컴퍼니 리미티드 보호막 형성용 약액, 이의 조제 방법 및 이를 사용하는 세정 방법
JP6533576B2 (ja) 2015-07-13 2019-06-19 富士フイルム株式会社 パターン構造の処理方法、電子デバイスの製造方法およびパターン構造の倒壊抑制用処理液
JP2019080009A (ja) * 2017-10-27 2019-05-23 セントラル硝子株式会社 ウェハの洗浄方法
SG11202009171XA (en) * 2018-04-05 2020-10-29 Central Glass Co Ltd Surface treatment method of wafer and composition used for said method

Also Published As

Publication number Publication date
CN114762087A (zh) 2022-07-15
WO2021106580A1 (ja) 2021-06-03
KR20220106131A (ko) 2022-07-28
TW202130756A (zh) 2021-08-16

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