JPWO2021106257A1 - - Google Patents

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Publication number
JPWO2021106257A1
JPWO2021106257A1 JP2021561151A JP2021561151A JPWO2021106257A1 JP WO2021106257 A1 JPWO2021106257 A1 JP WO2021106257A1 JP 2021561151 A JP2021561151 A JP 2021561151A JP 2021561151 A JP2021561151 A JP 2021561151A JP WO2021106257 A1 JPWO2021106257 A1 JP WO2021106257A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021561151A
Other languages
Japanese (ja)
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JP7479396B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021106257A1 publication Critical patent/JPWO2021106257A1/ja
Application granted granted Critical
Publication of JP7479396B2 publication Critical patent/JP7479396B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/1006—Beam splitting or combining systems for splitting or combining different wavelengths
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/0944—Diffractive optical elements, e.g. gratings, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • G02B27/0955—Lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/1086—Beam splitting or combining systems operating by diffraction only
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/12—Beam splitting or combining systems operating by refraction only
    • G02B27/123—The splitting element being a lens or a system of lenses, including arrays and surfaces with refractive power
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/18—Diffraction gratings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/14—External cavity lasers
    • H01S5/141—External cavity lasers using a wavelength selective device, e.g. a grating or etalon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031—Edge-emitting structures
    • H01S5/4062—Edge-emitting structures with an external cavity or using internal filters, e.g. Talbot filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
  • Diffracting Gratings Or Hologram Optical Elements (AREA)
  • Laser Beam Processing (AREA)
JP2021561151A 2019-11-28 2020-07-01 光学ユニット、ビーム結合装置およびレーザ加工機 Active JP7479396B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019215505 2019-11-28
JP2019215505 2019-11-28
PCT/JP2020/025876 WO2021106257A1 (ja) 2019-11-28 2020-07-01 光学ユニット、ビーム結合装置およびレーザ加工機

Publications (2)

Publication Number Publication Date
JPWO2021106257A1 true JPWO2021106257A1 (https=) 2021-06-03
JP7479396B2 JP7479396B2 (ja) 2024-05-08

Family

ID=76130448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021561151A Active JP7479396B2 (ja) 2019-11-28 2020-07-01 光学ユニット、ビーム結合装置およびレーザ加工機

Country Status (5)

Country Link
US (1) US11867919B2 (https=)
EP (1) EP4067947B1 (https=)
JP (1) JP7479396B2 (https=)
CN (1) CN114761835A (https=)
WO (1) WO2021106257A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000137139A (ja) * 1998-10-30 2000-05-16 Vitalij Lissotschenko 光学的光束変換装置
JP2006171348A (ja) * 2004-12-15 2006-06-29 Nippon Steel Corp 半導体レーザ装置
WO2009137703A2 (en) * 2008-05-08 2009-11-12 Newport Corporation High brightness diode output methods and devices
WO2018037663A1 (ja) * 2016-08-26 2018-03-01 パナソニックＩｐマネジメント株式会社 レーザモジュール
WO2018163598A1 (ja) * 2017-03-09 2018-09-13 三菱電機株式会社 波長結合レーザ装置
WO2019163335A1 (ja) * 2018-02-26 2019-08-29 パナソニックＩｐマネジメント株式会社 光共振器及びレーザ加工機

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6246524B1 (en) * 1998-07-13 2001-06-12 Semiconductor Energy Laboratory Co., Ltd. Beam homogenizer, laser irradiation apparatus, laser irradiation method, and method of manufacturing semiconductor device
JP3472249B2 (ja) * 2000-08-25 2003-12-02 キヤノン株式会社 複数の光源を使用する照明装置、照明制御装置及び方法、並びに、露光装置
US8536110B2 (en) 2011-07-02 2013-09-17 Brad Drost Molded solid industrial cleaning block
US8946594B2 (en) * 2011-11-04 2015-02-03 Applied Materials, Inc. Optical design for line generation using microlens array
US9746679B2 (en) 2012-02-22 2017-08-29 TeraDiode, Inc. Wavelength beam combining laser systems utilizing lens roll for chief ray focusing
CN102809822B (zh) * 2012-08-22 2015-03-25 温州泛波激光有限公司 一种激光二极管阵列的光束耦合聚焦装置
JP6327035B2 (ja) * 2013-08-12 2018-05-23 大日本印刷株式会社 照明装置、投射装置、レンズアレイおよび光学モジュール
US10571708B2 (en) * 2016-02-09 2020-02-25 Mitsubishi Electric Corporation Beam shaping device and laser oscillator

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000137139A (ja) * 1998-10-30 2000-05-16 Vitalij Lissotschenko 光学的光束変換装置
JP2006171348A (ja) * 2004-12-15 2006-06-29 Nippon Steel Corp 半導体レーザ装置
WO2009137703A2 (en) * 2008-05-08 2009-11-12 Newport Corporation High brightness diode output methods and devices
WO2018037663A1 (ja) * 2016-08-26 2018-03-01 パナソニックＩｐマネジメント株式会社 レーザモジュール
WO2018163598A1 (ja) * 2017-03-09 2018-09-13 三菱電機株式会社 波長結合レーザ装置
WO2019163335A1 (ja) * 2018-02-26 2019-08-29 パナソニックＩｐマネジメント株式会社 光共振器及びレーザ加工機

Also Published As

Publication number Publication date
WO2021106257A1 (ja) 2021-06-03
CN114761835A (zh) 2022-07-15
US11867919B2 (en) 2024-01-09
US20220260842A1 (en) 2022-08-18
JP7479396B2 (ja) 2024-05-08
EP4067947B1 (en) 2024-09-04
EP4067947A4 (en) 2023-03-08
EP4067947A1 (en) 2022-10-05

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