JPWO2021095110A1 - - Google Patents

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Publication number
JPWO2021095110A1
JPWO2021095110A1 JP2021555649A JP2021555649A JPWO2021095110A1 JP WO2021095110 A1 JPWO2021095110 A1 JP WO2021095110A1 JP 2021555649 A JP2021555649 A JP 2021555649A JP 2021555649 A JP2021555649 A JP 2021555649A JP WO2021095110 A1 JPWO2021095110 A1 JP WO2021095110A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021555649A
Other versions
JP7260663B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2021095110A1 publication Critical patent/JPWO2021095110A1/ja
Application granted granted Critical
Publication of JP7260663B2 publication Critical patent/JP7260663B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2021555649A 2019-11-12 2019-11-12 対基板作業機と清掃方法 Active JP7260663B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/044243 WO2021095110A1 (ja) 2019-11-12 2019-11-12 対基板作業機と清掃方法

Publications (2)

Publication Number Publication Date
JPWO2021095110A1 true JPWO2021095110A1 (ja) 2021-05-20
JP7260663B2 JP7260663B2 (ja) 2023-04-18

Family

ID=75911922

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021555649A Active JP7260663B2 (ja) 2019-11-12 2019-11-12 対基板作業機と清掃方法

Country Status (3)

Country Link
JP (1) JP7260663B2 (ja)
CN (1) CN114616932B (ja)
WO (1) WO2021095110A1 (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004314004A (ja) * 2003-04-18 2004-11-11 Seiko Epson Corp 接着剤塗布装置
JP2010129606A (ja) * 2008-11-25 2010-06-10 Samsung Techwin Co Ltd 電子部品装着装置
JP2017148742A (ja) * 2016-02-25 2017-08-31 東レエンジニアリング株式会社 ノズル清掃装置
JP2018058045A (ja) * 2016-10-07 2018-04-12 三菱電機株式会社 粘性材の塗布装置
JP2018190904A (ja) * 2017-05-10 2018-11-29 株式会社Fuji ツールステーション

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06252541A (ja) * 1993-02-24 1994-09-09 Matsushita Electric Ind Co Ltd ノズルクリーニング付粘性流体塗布装置
JP2003179399A (ja) * 2001-12-10 2003-06-27 Matsushita Electric Ind Co Ltd 部品実装機
JP3936904B2 (ja) * 2002-10-07 2007-06-27 大日本スクリーン製造株式会社 ノズル清掃装置およびこのノズル清掃装置を備えた基板処理装置
JP2004311599A (ja) * 2003-04-03 2004-11-04 Fuji Mach Mfg Co Ltd ノズルストッカおよび電子回路部品装着機
EP2095885B1 (en) * 2003-07-14 2017-08-02 Nordson Corporation Apparatus for dispensing discrete amounts of viscous material
JP2012227236A (ja) * 2011-04-18 2012-11-15 Panasonic Corp 部品実装装置
WO2013103298A1 (en) * 2012-01-02 2013-07-11 Mutracx B.V. Inkjetsystem for printing a printed circuit board
CN106232247B (zh) * 2014-04-22 2020-07-31 株式会社富士 吸嘴清洗装置及吸嘴干燥方法
JP6660055B2 (ja) * 2016-02-04 2020-03-04 株式会社Fuji ノズル洗浄装置
WO2018134867A1 (ja) * 2017-01-17 2018-07-26 株式会社Fuji メンテナンス用基板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004314004A (ja) * 2003-04-18 2004-11-11 Seiko Epson Corp 接着剤塗布装置
JP2010129606A (ja) * 2008-11-25 2010-06-10 Samsung Techwin Co Ltd 電子部品装着装置
JP2017148742A (ja) * 2016-02-25 2017-08-31 東レエンジニアリング株式会社 ノズル清掃装置
JP2018058045A (ja) * 2016-10-07 2018-04-12 三菱電機株式会社 粘性材の塗布装置
JP2018190904A (ja) * 2017-05-10 2018-11-29 株式会社Fuji ツールステーション

Also Published As

Publication number Publication date
CN114616932A (zh) 2022-06-10
JP7260663B2 (ja) 2023-04-18
WO2021095110A1 (ja) 2021-05-20
CN114616932B (zh) 2023-09-19

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