JPWO2021090415A1 - - Google Patents

Info

Publication number
JPWO2021090415A1
JPWO2021090415A1 JP2021554481A JP2021554481A JPWO2021090415A1 JP WO2021090415 A1 JPWO2021090415 A1 JP WO2021090415A1 JP 2021554481 A JP2021554481 A JP 2021554481A JP 2021554481 A JP2021554481 A JP 2021554481A JP WO2021090415 A1 JPWO2021090415 A1 JP WO2021090415A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021554481A
Other versions
JP7201838B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021090415A1 publication Critical patent/JPWO2021090415A1/ja
Priority to JP2022205049A priority Critical patent/JP7340085B2/ja
Application granted granted Critical
Publication of JP7201838B2 publication Critical patent/JP7201838B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/083—Quality monitoring using results from monitoring devices, e.g. feedback loops
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41805—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/089—Calibration, teaching or correction of mechanical systems, e.g. of the mounting head
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/36—Nc in input of data, input key till input tape
    • G05B2219/36195—Assembly, mount of electronic parts onto board

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2021554481A 2019-11-06 2019-11-06 部品実装装置および補正値管理方法 Active JP7201838B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022205049A JP7340085B2 (ja) 2019-11-06 2022-12-22 部品実装装置および補正値管理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/043547 WO2021090415A1 (ja) 2019-11-06 2019-11-06 部品実装装置および補正値管理方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022205049A Division JP7340085B2 (ja) 2019-11-06 2022-12-22 部品実装装置および補正値管理方法

Publications (2)

Publication Number Publication Date
JPWO2021090415A1 true JPWO2021090415A1 (ja) 2021-05-14
JP7201838B2 JP7201838B2 (ja) 2023-01-10

Family

ID=75848808

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021554481A Active JP7201838B2 (ja) 2019-11-06 2019-11-06 部品実装装置および補正値管理方法
JP2022205049A Active JP7340085B2 (ja) 2019-11-06 2022-12-22 部品実装装置および補正値管理方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022205049A Active JP7340085B2 (ja) 2019-11-06 2022-12-22 部品実装装置および補正値管理方法

Country Status (5)

Country Link
US (1) US20220394894A1 (ja)
EP (1) EP4057790A4 (ja)
JP (2) JP7201838B2 (ja)
CN (1) CN114616933B (ja)
WO (1) WO2021090415A1 (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007268682A (ja) * 2006-03-31 2007-10-18 Jtekt Corp 空間３自由度パラレル機構の制御方法および空間３自由度パラレル機構
JP2015002230A (ja) * 2013-06-14 2015-01-05 パナソニック株式会社 電子部品実装装置及び電子部品実装システム
WO2017072887A1 (ja) * 2015-10-28 2017-05-04 富士機械製造株式会社 ユニット固有情報管理システム
JP2017194921A (ja) * 2016-04-22 2017-10-26 オムロン株式会社 生産ラインの管理装置
JP2018113337A (ja) * 2017-01-12 2018-07-19 パナソニックＩｐマネジメント株式会社 部品実装システムおよび部品実装方法ならびに補正値算出装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0823196A (ja) * 1994-07-05 1996-01-23 Yamaha Motor Co Ltd 実装機の位置補正方法及び装置
JP4326641B2 (ja) * 1999-11-05 2009-09-09 富士機械製造株式会社 装着装置，装着精度検出治具セットおよび装着精度検出方法
JP4828298B2 (ja) * 2006-05-11 2011-11-30 ヤマハ発動機株式会社 部品実装方法および部品実装装置
CN101568891B (zh) * 2006-12-22 2013-02-06 K&S芯片键合设备有限公司 定位工具用x-y定位的校准方法及具有这种定位工具的装置
JP2013221766A (ja) * 2012-04-13 2013-10-28 Panasonic Corp 外観検査装置および外観検査方法
JP6402451B2 (ja) 2014-02-14 2018-10-10 オムロン株式会社 品質管理装置、品質管理方法、およびプログラム
CN109076728B (zh) * 2016-04-26 2021-05-28 株式会社富士 对基板作业机
CN108536397A (zh) * 2017-03-06 2018-09-14 日本冲信息株式会社 信息处理装置和方法、以及图像形成装置
JP7220679B2 (ja) * 2018-02-07 2023-02-10 株式会社Fuji 基板作業システム

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007268682A (ja) * 2006-03-31 2007-10-18 Jtekt Corp 空間３自由度パラレル機構の制御方法および空間３自由度パラレル機構
JP2015002230A (ja) * 2013-06-14 2015-01-05 パナソニック株式会社 電子部品実装装置及び電子部品実装システム
WO2017072887A1 (ja) * 2015-10-28 2017-05-04 富士機械製造株式会社 ユニット固有情報管理システム
JP2017194921A (ja) * 2016-04-22 2017-10-26 オムロン株式会社 生産ラインの管理装置
JP2018113337A (ja) * 2017-01-12 2018-07-19 パナソニックＩｐマネジメント株式会社 部品実装システムおよび部品実装方法ならびに補正値算出装置

Also Published As

Publication number Publication date
EP4057790A1 (en) 2022-09-14
CN114616933A (zh) 2022-06-10
CN114616933B (zh) 2023-11-10
JP2023024635A (ja) 2023-02-16
JP7201838B2 (ja) 2023-01-10
US20220394894A1 (en) 2022-12-08
WO2021090415A1 (ja) 2021-05-14
EP4057790A4 (en) 2022-11-09
JP7340085B2 (ja) 2023-09-06

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