JPWO2021085417A1 - - Google Patents

Info

Publication number
JPWO2021085417A1
JPWO2021085417A1 JP2021553626A JP2021553626A JPWO2021085417A1 JP WO2021085417 A1 JPWO2021085417 A1 JP WO2021085417A1 JP 2021553626 A JP2021553626 A JP 2021553626A JP 2021553626 A JP2021553626 A JP 2021553626A JP WO2021085417 A1 JPWO2021085417 A1 JP WO2021085417A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021553626A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021085417A1 publication Critical patent/JPWO2021085417A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/038—Textiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Textile Engineering (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)
JP2021553626A 2019-10-30 2020-10-27 Pending JPWO2021085417A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019197471 2019-10-30
PCT/JP2020/040252 WO2021085417A1 (ja) 2019-10-30 2020-10-27 プリント配線板およびプリント配線板の製造方法

Publications (1)

Publication Number Publication Date
JPWO2021085417A1 true JPWO2021085417A1 (ja) 2021-05-06

Family

ID=75716002

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021553626A Pending JPWO2021085417A1 (ja) 2019-10-30 2020-10-27

Country Status (4)

Country Link
US (1) US11979982B2 (ja)
JP (1) JPWO2021085417A1 (ja)
CN (1) CN114731757A (ja)
WO (1) WO2021085417A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11979982B2 (en) * 2019-10-30 2024-05-07 Tanazawa Hakkosha Co., Ltd. Printed wiring board and method for manufacturing printed wiring board

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5857935A (ja) * 1981-10-02 1983-04-06 株式会社日立製作所 積層板
JPH0515462U (ja) * 1991-08-05 1993-02-26 株式会社長谷川電機製作所 プリント配線基板
JPH0563338A (ja) * 1991-09-02 1993-03-12 Tamatsukusu:Kk 回路基板用スクリーン印刷方法と装置
JPH08139424A (ja) * 1994-11-10 1996-05-31 Ibiden Co Ltd プリント配線板及びその製造方法
JPH10100375A (ja) * 1996-09-30 1998-04-21 Matsushita Electric Works Ltd プリント配線板の印刷方法及びプリント配線板印刷装置
JP2002232152A (ja) * 2001-01-30 2002-08-16 Kyocera Corp 多層配線基板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4173670A (en) * 1977-05-27 1979-11-06 Exxon Research & Engineering Co. Composite tubular elements
US4214932A (en) * 1979-05-17 1980-07-29 Exxon Research & Engineering Co. Method for making composite tubular elements
JPH0271771A (ja) * 1988-09-05 1990-03-12 Ryobi Ltd ゴルフシャフト及びその製造方法
JP3025919B2 (ja) * 1991-07-09 2000-03-27 松下電器産業株式会社 トースター
JP2003031912A (ja) 2001-07-19 2003-01-31 Sony Corp 基 板
CN101462316A (zh) * 2007-12-19 2009-06-24 维斯塔斯风力系统有限公司 预成型件的制备方法
WO2020202754A1 (ja) * 2019-04-01 2020-10-08 三井化学株式会社 積層体、三次元賦形積層体、及び三次元賦形積層体の製造方法
US11979982B2 (en) * 2019-10-30 2024-05-07 Tanazawa Hakkosha Co., Ltd. Printed wiring board and method for manufacturing printed wiring board

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5857935A (ja) * 1981-10-02 1983-04-06 株式会社日立製作所 積層板
JPH0515462U (ja) * 1991-08-05 1993-02-26 株式会社長谷川電機製作所 プリント配線基板
JPH0563338A (ja) * 1991-09-02 1993-03-12 Tamatsukusu:Kk 回路基板用スクリーン印刷方法と装置
JPH08139424A (ja) * 1994-11-10 1996-05-31 Ibiden Co Ltd プリント配線板及びその製造方法
JPH10100375A (ja) * 1996-09-30 1998-04-21 Matsushita Electric Works Ltd プリント配線板の印刷方法及びプリント配線板印刷装置
JP2002232152A (ja) * 2001-01-30 2002-08-16 Kyocera Corp 多層配線基板

Also Published As

Publication number Publication date
US11979982B2 (en) 2024-05-07
CN114731757A (zh) 2022-07-08
US20230026493A1 (en) 2023-01-26
WO2021085417A1 (ja) 2021-05-06

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