JPWO2021085098A1 - - Google Patents

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Publication number
JPWO2021085098A1
JPWO2021085098A1 JP2021554286A JP2021554286A JPWO2021085098A1 JP WO2021085098 A1 JPWO2021085098 A1 JP WO2021085098A1 JP 2021554286 A JP2021554286 A JP 2021554286A JP 2021554286 A JP2021554286 A JP 2021554286A JP WO2021085098 A1 JPWO2021085098 A1 JP WO2021085098A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021554286A
Other versions
JP7520867B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021085098A1 publication Critical patent/JPWO2021085098A1/ja
Application granted granted Critical
Publication of JP7520867B2 publication Critical patent/JP7520867B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/16—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force
    • G01L5/166—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using photoelectric means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/24—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet
    • G01L1/247—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet using distributed sensing elements, e.g. microcapsules
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/24—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/24—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet
    • G01L1/241—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet by photoelastic stress analysis
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)
JP2021554286A 2019-10-30 2020-10-12 光学式センサおよび光学式センサモジュール Active JP7520867B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019197606 2019-10-30
JP2019197606 2019-10-30
PCT/JP2020/038452 WO2021085098A1 (ja) 2019-10-30 2020-10-12 光学式センサおよび光学式センサモジュール

Publications (2)

Publication Number Publication Date
JPWO2021085098A1 true JPWO2021085098A1 (ja) 2021-05-06
JP7520867B2 JP7520867B2 (ja) 2024-07-23

Family

ID=75714639

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021554286A Active JP7520867B2 (ja) 2019-10-30 2020-10-12 光学式センサおよび光学式センサモジュール

Country Status (4)

Country Link
US (1) US12078561B2 (ja)
JP (1) JP7520867B2 (ja)
CN (1) CN114599938A (ja)
WO (1) WO2021085098A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220120945A1 (en) * 2020-10-16 2022-04-21 GM Global Technology Operations LLC Feedback sensor for mems mirror
CN118329246A (zh) * 2023-01-10 2024-07-12 肯塔泰尔私人有限公司 感测布置

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59153139A (ja) 1983-02-22 1984-09-01 Oki Electric Ind Co Ltd 二次元感圧センサ
JPS60209128A (ja) * 1984-04-02 1985-10-21 Oki Electric Ind Co Ltd 感圧センサ
JPS6141938A (ja) * 1984-08-03 1986-02-28 Oki Electric Ind Co Ltd 二次元感圧センサ
JP3193838B2 (ja) * 1994-11-14 2001-07-30 シャープ株式会社 光半導体装置
JP2000349306A (ja) 1999-06-02 2000-12-15 Mitsubishi Electric Corp 集光レンズ付き半導体装置
JP4621827B2 (ja) * 2004-03-09 2011-01-26 財団法人名古屋産業科学研究所 光学式触覚センサ、光学式触覚センサを利用したセンシング方法、センシングシステム、物体操作力制御方法、物体操作力制御装置、物体把持力制御装置及びロボットハンド
EP2034287A1 (en) * 2007-09-10 2009-03-11 Nederlandse Organisatie voor Toegepast-Natuuurwetenschappelijk Onderzoek TNO Optical sensor for measuring a force distribution
JP5449336B2 (ja) * 2008-06-19 2014-03-19 マサチューセッツ インスティテュート オブ テクノロジー 弾性撮像を使用する接触センサ
WO2012129410A2 (en) * 2011-03-23 2012-09-27 University Of Southern California Elastomeric optical tactile sensor
HUP1100633A2 (en) * 2011-11-17 2013-06-28 Pazmany Peter Katolikus Egyetem Device with optical feedback for measuring force and pressure
JP5859134B2 (ja) * 2012-09-21 2016-02-10 株式会社安川電機 力センサおよび力センサを有するロボット
US9625333B2 (en) * 2013-03-15 2017-04-18 President And Fellows Of Harvard College Tactile sensor
WO2015093442A1 (ja) * 2013-12-16 2015-06-25 京セラ株式会社 受発光素子モジュールおよびこれを用いたセンサ装置
JP2015197357A (ja) * 2014-04-01 2015-11-09 キヤノン株式会社 光学式力角センサおよびこれを用いた装置
JP6224636B2 (ja) 2015-02-02 2017-11-01 内藤電誠工業株式会社 モジュールシステム
US10038854B1 (en) * 2015-08-14 2018-07-31 X Development Llc Imaging-based tactile sensor with multi-lens array
JP6400035B2 (ja) 2016-03-14 2018-10-03 キヤノン株式会社 位置検出装置、力覚センサ、および、装置
US10274386B2 (en) 2016-06-20 2019-04-30 X Development Llc Retroreflective multi-axis force torque sensor
JP6843726B2 (ja) 2017-10-17 2021-03-17 キヤノン株式会社 力覚センサ及びロボット
JP2019191018A (ja) * 2018-04-26 2019-10-31 ソニー株式会社 測距装置及び測距モジュール
CN112097675A (zh) * 2019-06-17 2020-12-18 香港科技大学 触觉传感器
US20230215889A1 (en) * 2020-05-29 2023-07-06 Sony Semiconductor Solutions Corporation Imaging element and imaging device

Also Published As

Publication number Publication date
US12078561B2 (en) 2024-09-03
JP7520867B2 (ja) 2024-07-23
CN114599938A (zh) 2022-06-07
WO2021085098A1 (ja) 2021-05-06
US20220397469A1 (en) 2022-12-15

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