JPWO2021079918A1 - - Google Patents

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Publication number
JPWO2021079918A1
JPWO2021079918A1 JP2021553503A JP2021553503A JPWO2021079918A1 JP WO2021079918 A1 JPWO2021079918 A1 JP WO2021079918A1 JP 2021553503 A JP2021553503 A JP 2021553503A JP 2021553503 A JP2021553503 A JP 2021553503A JP WO2021079918 A1 JPWO2021079918 A1 JP WO2021079918A1
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JP
Japan
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JP2021553503A
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Japanese (ja)
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Classifications

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    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
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    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
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    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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    • C08J2479/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
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WO2022071304A1 (ja) * 2020-09-29 2022-04-07 デンカ株式会社 複合シート、積層体、及び、複合シートの接着性を推定する評価方法
JP2023042918A (ja) * 2021-09-15 2023-03-28 デンカ株式会社 半硬化物複合体の製造方法、硬化物複合体の製造方法、及び半硬化物複合体

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