JPWO2021065897A1 - - Google Patents

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Publication number
JPWO2021065897A1
JPWO2021065897A1 JP2021551302A JP2021551302A JPWO2021065897A1 JP WO2021065897 A1 JPWO2021065897 A1 JP WO2021065897A1 JP 2021551302 A JP2021551302 A JP 2021551302A JP 2021551302 A JP2021551302 A JP 2021551302A JP WO2021065897 A1 JPWO2021065897 A1 JP WO2021065897A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021551302A
Other versions
JP7037707B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021065897A1 publication Critical patent/JPWO2021065897A1/ja
Priority to JP2022033232A priority Critical patent/JP2022082558A/ja
Application granted granted Critical
Publication of JP7037707B2 publication Critical patent/JP7037707B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
JP2021551302A 2019-10-01 2020-09-29 保持具および製造方法 Active JP7037707B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022033232A JP2022082558A (ja) 2019-10-01 2022-03-04 保持具

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019181173 2019-10-01
JP2019181173 2019-10-01
PCT/JP2020/036861 WO2021065897A1 (ja) 2019-10-01 2020-09-29 保持具および製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022033232A Division JP2022082558A (ja) 2019-10-01 2022-03-04 保持具

Publications (2)

Publication Number Publication Date
JPWO2021065897A1 true JPWO2021065897A1 (ja) 2021-04-08
JP7037707B2 JP7037707B2 (ja) 2022-03-16

Family

ID=75336414

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021551302A Active JP7037707B2 (ja) 2019-10-01 2020-09-29 保持具および製造方法
JP2022033232A Pending JP2022082558A (ja) 2019-10-01 2022-03-04 保持具

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022033232A Pending JP2022082558A (ja) 2019-10-01 2022-03-04 保持具

Country Status (5)

Country Link
EP (1) EP4040469A4 (ja)
JP (2) JP7037707B2 (ja)
CN (1) CN114762084A (ja)
TW (1) TW202117916A (ja)
WO (1) WO2021065897A1 (ja)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000301451A (ja) * 1999-04-21 2000-10-31 Super Silicon Kenkyusho:Kk 研磨機用キャリア及びその製造方法
JP2007062333A (ja) * 2005-09-02 2007-03-15 Shin Etsu Polymer Co Ltd 成形用金型及び半導体ウェーハ用ダイシングフレーム
JP2007222998A (ja) * 2006-02-24 2007-09-06 Kyocera Chemical Corp ラッピングキャリア及びその製造方法
JP2008044083A (ja) * 2006-08-18 2008-02-28 Kyocera Chemical Corp 研磨用保持材
WO2009020243A1 (ja) * 2007-08-09 2009-02-12 Jfe Techno-Research Corporation ウェーハ用フレーム
WO2015080295A1 (ja) * 2013-11-29 2015-06-04 Hoya株式会社 研磨処理用キャリア、研磨処理用キャリアの製造方法、及び磁気ディスク用基板の製造方法
JP2015181082A (ja) * 2015-04-28 2015-10-15 旭硝子株式会社 磁気記録媒体用ガラス基板
JP2016531020A (ja) * 2013-07-17 2016-10-06 マークフォーゲット インコーポレイテッドＭａｒｋｆｏｒｇｅｄ， Ｉｎｃ． 繊維強化による積層造形用装置
JP2019018399A (ja) * 2017-07-13 2019-02-07 フドー株式会社 成形品の製造方法および製造装置
JP6511577B1 (ja) * 2018-08-21 2019-05-15 独立行政法人国立高等専門学校機構 成形装置および成形方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5148924B2 (ja) 2007-05-30 2013-02-20 株式会社ディスコ ダイシング用フレームユニット
WO2012140785A1 (ja) 2011-04-12 2012-10-18 三菱瓦斯化学株式会社 ポリアミド樹脂系複合材およびその製造方法
JP2013106021A (ja) 2011-11-17 2013-05-30 Shin Etsu Polymer Co Ltd ダイシングフレームの製造方法
JP6602552B2 (ja) 2015-04-14 2019-11-06 国立大学法人岐阜大学 成形体の製造方法
JP2017220628A (ja) 2016-06-10 2017-12-14 株式会社秋本製作所 半導体ウェハのダイシング用フレームおよびダイシング用フレームの製造方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000301451A (ja) * 1999-04-21 2000-10-31 Super Silicon Kenkyusho:Kk 研磨機用キャリア及びその製造方法
JP2007062333A (ja) * 2005-09-02 2007-03-15 Shin Etsu Polymer Co Ltd 成形用金型及び半導体ウェーハ用ダイシングフレーム
JP2007222998A (ja) * 2006-02-24 2007-09-06 Kyocera Chemical Corp ラッピングキャリア及びその製造方法
JP2008044083A (ja) * 2006-08-18 2008-02-28 Kyocera Chemical Corp 研磨用保持材
WO2009020243A1 (ja) * 2007-08-09 2009-02-12 Jfe Techno-Research Corporation ウェーハ用フレーム
JP2016531020A (ja) * 2013-07-17 2016-10-06 マークフォーゲット インコーポレイテッドＭａｒｋｆｏｒｇｅｄ， Ｉｎｃ． 繊維強化による積層造形用装置
WO2015080295A1 (ja) * 2013-11-29 2015-06-04 Hoya株式会社 研磨処理用キャリア、研磨処理用キャリアの製造方法、及び磁気ディスク用基板の製造方法
JP2015181082A (ja) * 2015-04-28 2015-10-15 旭硝子株式会社 磁気記録媒体用ガラス基板
JP2019018399A (ja) * 2017-07-13 2019-02-07 フドー株式会社 成形品の製造方法および製造装置
JP6511577B1 (ja) * 2018-08-21 2019-05-15 独立行政法人国立高等専門学校機構 成形装置および成形方法

Also Published As

Publication number Publication date
CN114762084A (zh) 2022-07-15
EP4040469A1 (en) 2022-08-10
TW202117916A (zh) 2021-05-01
EP4040469A4 (en) 2023-11-08
WO2021065897A1 (ja) 2021-04-08
JP7037707B2 (ja) 2022-03-16
JP2022082558A (ja) 2022-06-02

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