JPWO2021060475A1 - - Google Patents

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Publication number
JPWO2021060475A1
JPWO2021060475A1 JP2021549049A JP2021549049A JPWO2021060475A1 JP WO2021060475 A1 JPWO2021060475 A1 JP WO2021060475A1 JP 2021549049 A JP2021549049 A JP 2021549049A JP 2021549049 A JP2021549049 A JP 2021549049A JP WO2021060475 A1 JPWO2021060475 A1 JP WO2021060475A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021549049A
Other versions
JP7143535B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021060475A1 publication Critical patent/JPWO2021060475A1/ja
Application granted granted Critical
Publication of JP7143535B2 publication Critical patent/JP7143535B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
JP2021549049A 2019-09-25 2020-09-25 電子部品搭載用基体および電子装置 Active JP7143535B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019174322 2019-09-25
JP2019174322 2019-09-25
PCT/JP2020/036298 WO2021060475A1 (ja) 2019-09-25 2020-09-25 電子部品搭載用基体および電子装置

Publications (2)

Publication Number Publication Date
JPWO2021060475A1 true JPWO2021060475A1 (ja) 2021-04-01
JP7143535B2 JP7143535B2 (ja) 2022-09-28

Family

ID=75165259

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021549049A Active JP7143535B2 (ja) 2019-09-25 2020-09-25 電子部品搭載用基体および電子装置

Country Status (5)

Country Link
US (1) US20220336316A1 (ja)
EP (1) EP4036965A4 (ja)
JP (1) JP7143535B2 (ja)
CN (1) CN114424351A (ja)
WO (1) WO2021060475A1 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013229363A (ja) * 2012-04-24 2013-11-07 Daikin Ind Ltd パワーモジュール
JP2015185707A (ja) * 2014-03-25 2015-10-22 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板の製造方法
JP2016178261A (ja) * 2015-03-23 2016-10-06 カルソニックカンセイ株式会社 ハンダ付け構造

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10189845A (ja) * 1996-12-25 1998-07-21 Denso Corp 半導体素子の放熱装置
DE19959248A1 (de) * 1999-12-08 2001-06-28 Daimler Chrysler Ag Isolationsverbesserung bei Hochleistungs-Halbleitermodulen
DE10051338A1 (de) * 2000-10-17 2002-04-18 Daimlerchrysler Rail Systems Flüssigkeitskühlvorrichtung für ein Hochleistungs-Halbleitermodul und Verfahren für deren Herstellung
JP2005086042A (ja) * 2003-09-09 2005-03-31 Sony Chem Corp 電子部品実装モジュール
US9812377B2 (en) * 2013-09-04 2017-11-07 Mitsubishi Electric Corporation Semiconductor module and inverter device
JP6626735B2 (ja) * 2016-02-22 2019-12-25 京セラ株式会社 電子部品搭載用基板、電子装置および電子モジュール
JP2017199842A (ja) 2016-04-28 2017-11-02 株式会社光波 Ｌｅｄ光源装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013229363A (ja) * 2012-04-24 2013-11-07 Daikin Ind Ltd パワーモジュール
JP2015185707A (ja) * 2014-03-25 2015-10-22 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板の製造方法
JP2016178261A (ja) * 2015-03-23 2016-10-06 カルソニックカンセイ株式会社 ハンダ付け構造

Also Published As

Publication number Publication date
CN114424351A (zh) 2022-04-29
EP4036965A4 (en) 2023-11-01
EP4036965A1 (en) 2022-08-03
US20220336316A1 (en) 2022-10-20
WO2021060475A1 (ja) 2021-04-01
JP7143535B2 (ja) 2022-09-28

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