JPWO2021059812A1 - - Google Patents

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Publication number
JPWO2021059812A1
JPWO2021059812A1 JP2021548433A JP2021548433A JPWO2021059812A1 JP WO2021059812 A1 JPWO2021059812 A1 JP WO2021059812A1 JP 2021548433 A JP2021548433 A JP 2021548433A JP 2021548433 A JP2021548433 A JP 2021548433A JP WO2021059812 A1 JPWO2021059812 A1 JP WO2021059812A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021548433A
Other languages
Japanese (ja)
Other versions
JP7324299B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021059812A1 publication Critical patent/JPWO2021059812A1/ja
Application granted granted Critical
Publication of JP7324299B2 publication Critical patent/JP7324299B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
JP2021548433A 2019-09-25 2020-08-21 Plating solution, plating set, manufacturing method of conductive substrate Active JP7324299B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019174701 2019-09-25
JP2019174701 2019-09-25
PCT/JP2020/031550 WO2021059812A1 (en) 2019-09-25 2020-08-21 Plating solution, plating set, conductive substrate manufacturing method

Publications (2)

Publication Number Publication Date
JPWO2021059812A1 true JPWO2021059812A1 (en) 2021-04-01
JP7324299B2 JP7324299B2 (en) 2023-08-09

Family

ID=75166095

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021548433A Active JP7324299B2 (en) 2019-09-25 2020-08-21 Plating solution, plating set, manufacturing method of conductive substrate

Country Status (3)

Country Link
JP (1) JP7324299B2 (en)
CN (1) CN114269971A (en)
WO (1) WO2021059812A1 (en)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02170982A (en) * 1988-12-23 1990-07-02 Kawasaki Steel Corp Electrolyte paste for simple surface treatment
JP2000129452A (en) * 1998-10-23 2000-05-09 Inoac Corp Electroless plating primer agent, laminate provided with electroless plating layer and its production
JP2003218061A (en) * 2002-01-24 2003-07-31 Tokyo Electron Ltd Wiring forming method
JP2003332265A (en) * 2002-05-08 2003-11-21 Shin Etsu Chem Co Ltd Composition for forming metal wiring and method for forming the metal wiring by using the same
JP2007318072A (en) * 2006-04-27 2007-12-06 Kao Corp Polishing liquid composition
JP2010047506A (en) * 2008-08-21 2010-03-04 Shiseido Co Ltd Sol-gel reversible composition, thickening agent, and cosmetic material
JP2011249335A (en) * 2011-05-26 2011-12-08 Sumitomo Electric Ind Ltd Metal wiring
JP2015042776A (en) * 2013-07-24 2015-03-05 国立大学法人信州大学 Metal film and method for forming metal film
WO2017163830A1 (en) * 2016-03-23 2017-09-28 富士フイルム株式会社 Method for manufacturing electrically conductive laminate, and solid structure with layer to be plated precursor layer, solid structure with patterned layer to be plated, electrically conductive laminate, touch sensor, heat-generating member, and solid structure

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008091387A (en) * 2006-09-29 2008-04-17 Konica Minolta Holdings Inc Electromagnetic wave shielding film, and its manufacturing method
JP5227570B2 (en) * 2007-11-13 2013-07-03 セーレン株式会社 Method for producing transparent conductive member
KR20100033928A (en) * 2008-09-22 2010-03-31 후지필름 가부시키가이샤 Colored photosensitive composition, color filter and liquid crystal display device
CN103212720B (en) * 2013-04-02 2015-12-23 环保化工科技有限公司 A kind of nano silver dispersion and preparation method thereof, and a kind of preparation method of nano silver antibacterial coating
JP6442240B2 (en) * 2014-11-14 2018-12-19 三菱マテリアル電子化成株式会社 Silver-coated particles and method for producing the same
JP6824209B2 (en) * 2018-02-28 2021-02-03 富士フイルム株式会社 Conductive sheet for touch panel, manufacturing method of conductive sheet for touch panel, and touch panel

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02170982A (en) * 1988-12-23 1990-07-02 Kawasaki Steel Corp Electrolyte paste for simple surface treatment
JP2000129452A (en) * 1998-10-23 2000-05-09 Inoac Corp Electroless plating primer agent, laminate provided with electroless plating layer and its production
JP2003218061A (en) * 2002-01-24 2003-07-31 Tokyo Electron Ltd Wiring forming method
JP2003332265A (en) * 2002-05-08 2003-11-21 Shin Etsu Chem Co Ltd Composition for forming metal wiring and method for forming the metal wiring by using the same
JP2007318072A (en) * 2006-04-27 2007-12-06 Kao Corp Polishing liquid composition
JP2010047506A (en) * 2008-08-21 2010-03-04 Shiseido Co Ltd Sol-gel reversible composition, thickening agent, and cosmetic material
JP2011249335A (en) * 2011-05-26 2011-12-08 Sumitomo Electric Ind Ltd Metal wiring
JP2015042776A (en) * 2013-07-24 2015-03-05 国立大学法人信州大学 Metal film and method for forming metal film
WO2017163830A1 (en) * 2016-03-23 2017-09-28 富士フイルム株式会社 Method for manufacturing electrically conductive laminate, and solid structure with layer to be plated precursor layer, solid structure with patterned layer to be plated, electrically conductive laminate, touch sensor, heat-generating member, and solid structure

Also Published As

Publication number Publication date
JP7324299B2 (en) 2023-08-09
CN114269971A (en) 2022-04-01
WO2021059812A1 (en) 2021-04-01

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