JPWO2021059581A1 - - Google Patents
Info
- Publication number
- JPWO2021059581A1 JPWO2021059581A1 JP2021548325A JP2021548325A JPWO2021059581A1 JP WO2021059581 A1 JPWO2021059581 A1 JP WO2021059581A1 JP 2021548325 A JP2021548325 A JP 2021548325A JP 2021548325 A JP2021548325 A JP 2021548325A JP WO2021059581 A1 JPWO2021059581 A1 JP WO2021059581A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0504—Holders; Supports for bulk acoustic wave devices
- H03H9/0514—Holders; Supports for bulk acoustic wave devices consisting of mounting pads or bumps
- H03H9/0519—Holders; Supports for bulk acoustic wave devices consisting of mounting pads or bumps for cantilever
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
- H03H2003/0414—Resonance frequency
- H03H2003/0485—Resonance frequency during the manufacture of a cantilever
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019175977 | 2019-09-26 | ||
JP2019175977 | 2019-09-26 | ||
PCT/JP2020/019308 WO2021059581A1 (ja) | 2019-09-26 | 2020-05-14 | 圧電振動子及びその製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2021059581A1 true JPWO2021059581A1 (ja) | 2021-04-01 |
JPWO2021059581A5 JPWO2021059581A5 (ja) | 2022-04-08 |
JP7273377B2 JP7273377B2 (ja) | 2023-05-15 |
Family
ID=75166005
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021548325A Active JP7273377B2 (ja) | 2019-09-26 | 2020-05-14 | 圧電振動子及びその製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20220199892A1 (ja) |
JP (1) | JP7273377B2 (ja) |
CN (1) | CN114208028A (ja) |
WO (1) | WO2021059581A1 (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57107624A (en) * | 1980-12-25 | 1982-07-05 | Seikosha Co Ltd | Piezoelectric oscillator |
JPS62165421A (ja) * | 1986-01-16 | 1987-07-22 | Murata Mfg Co Ltd | 電子部品およびその製造方法 |
JPH1141051A (ja) * | 1997-07-16 | 1999-02-12 | Matsushita Electric Ind Co Ltd | 圧電共振部品およびその製造方法 |
JP2003198312A (ja) * | 2001-12-25 | 2003-07-11 | Seiko Epson Corp | 圧電デバイスとその製造方法、及び圧電デバイスを利用した携帯電話装置ならびに圧電デバイスを利用した電子機器 |
JP2010232806A (ja) * | 2009-03-26 | 2010-10-14 | Seiko Epson Corp | 圧電振動子、圧電発振器、電子機器、及び圧電振動子の製造方法 |
-
2020
- 2020-05-14 WO PCT/JP2020/019308 patent/WO2021059581A1/ja active Application Filing
- 2020-05-14 JP JP2021548325A patent/JP7273377B2/ja active Active
- 2020-05-14 CN CN202080056557.0A patent/CN114208028A/zh active Pending
-
2022
- 2022-02-17 US US17/651,483 patent/US20220199892A1/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57107624A (en) * | 1980-12-25 | 1982-07-05 | Seikosha Co Ltd | Piezoelectric oscillator |
JPS62165421A (ja) * | 1986-01-16 | 1987-07-22 | Murata Mfg Co Ltd | 電子部品およびその製造方法 |
JPH1141051A (ja) * | 1997-07-16 | 1999-02-12 | Matsushita Electric Ind Co Ltd | 圧電共振部品およびその製造方法 |
JP2003198312A (ja) * | 2001-12-25 | 2003-07-11 | Seiko Epson Corp | 圧電デバイスとその製造方法、及び圧電デバイスを利用した携帯電話装置ならびに圧電デバイスを利用した電子機器 |
JP2010232806A (ja) * | 2009-03-26 | 2010-10-14 | Seiko Epson Corp | 圧電振動子、圧電発振器、電子機器、及び圧電振動子の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20220199892A1 (en) | 2022-06-23 |
CN114208028A (zh) | 2022-03-18 |
WO2021059581A1 (ja) | 2021-04-01 |
JP7273377B2 (ja) | 2023-05-15 |
Similar Documents
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