JPWO2021049604A1 - - Google Patents

Info

Publication number
JPWO2021049604A1
JPWO2021049604A1 JP2021545611A JP2021545611A JPWO2021049604A1 JP WO2021049604 A1 JPWO2021049604 A1 JP WO2021049604A1 JP 2021545611 A JP2021545611 A JP 2021545611A JP 2021545611 A JP2021545611 A JP 2021545611A JP WO2021049604 A1 JPWO2021049604 A1 JP WO2021049604A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021545611A
Other versions
JP7120467B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021049604A1 publication Critical patent/JPWO2021049604A1/ja
Application granted granted Critical
Publication of JP7120467B2 publication Critical patent/JP7120467B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R11/00—Arrangements for holding or mounting articles, not otherwise provided for
    • B60R11/02—Arrangements for holding or mounting articles, not otherwise provided for for radio sets, television sets, telephones, or the like; Arrangement of controls thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/27—Adaptation for use in or on movable bodies
    • H01Q1/32—Adaptation for use in or on road or rail vehicles
    • H01Q1/325—Adaptation for use in or on road or rail vehicles characterised by the location of the antenna on the vehicle
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/27—Adaptation for use in or on movable bodies
    • H01Q1/32—Adaptation for use in or on road or rail vehicles
    • H01Q1/325—Adaptation for use in or on road or rail vehicles characterised by the location of the antenna on the vehicle
    • H01Q1/3275—Adaptation for use in or on road or rail vehicles characterised by the location of the antenna on the vehicle mounted on a horizontal surface of the vehicle, e.g. on roof, hood, trunk
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/003—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an integrally preformed housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14—Thermal energy storage

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Remote Sensing (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Fittings On The Vehicle Exterior For Carrying Loads, And Devices For Holding Or Mounting Articles (AREA)
JP2021545611A 2019-09-12 2020-09-11 車載用電子装置 Active JP7120467B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019166484 2019-09-12
JP2019166484 2019-09-12
PCT/JP2020/034431 WO2021049604A1 (ja) 2019-09-12 2020-09-11 車載用電子装置

Publications (2)

Publication Number Publication Date
JPWO2021049604A1 true JPWO2021049604A1 (ja) 2021-03-18
JP7120467B2 JP7120467B2 (ja) 2022-08-17

Family

ID=74867023

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021545611A Active JP7120467B2 (ja) 2019-09-12 2020-09-11 車載用電子装置

Country Status (5)

Country Link
US (1) US20220201834A1 (ja)
JP (1) JP7120467B2 (ja)
CN (1) CN114375265A (ja)
DE (1) DE112020004352T5 (ja)
WO (1) WO2021049604A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11008731B2 (en) * 2017-03-31 2021-05-18 Komatsu Ltd. Work vehicle
US20230031896A1 (en) * 2020-01-13 2023-02-02 Lg Electronics Inc. Antenna system mounted on vehicle
JP2023170883A (ja) * 2022-05-20 2023-12-01 株式会社豊田自動織機 車載用アンテナ装置の取付構造

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59187153U (ja) * 1983-05-31 1984-12-12 三菱電機株式会社 部品冷却構造
US20040145048A1 (en) * 2002-10-30 2004-07-29 Michael Frisch Integrated circuit system with a latent heat storage module
JP2005239133A (ja) * 2004-01-29 2005-09-08 Nippon Soken Inc 車両用オーバヘッドモジュール
JP2012102264A (ja) * 2010-11-11 2012-05-31 Kitagawa Ind Co Ltd 熱対策部材

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2865888B1 (fr) * 2004-02-03 2008-08-29 Thales Sa Systeme de refroidissement d'un boitier electronique
JP2006036138A (ja) * 2004-07-29 2006-02-09 Nippon Soken Inc 車両用オーバヘッドモジュールの温度上昇抑制装置
EP1672642A1 (en) * 2004-12-20 2006-06-21 Harman Becker Automotive Systems GmbH Electronic built-in system
US8305773B2 (en) * 2006-08-18 2012-11-06 Delphi Technologies, Inc. Lightweight audio system for automotive applications and method
JP5019309B2 (ja) * 2006-09-13 2012-09-05 富士重工業株式会社 車載電子機器の冷却構造
JP5920123B2 (ja) 2012-09-03 2016-05-18 株式会社日本自動車部品総合研究所 車載用アンテナ装置
JP6486314B2 (ja) * 2016-10-28 2019-03-20 原田工業株式会社 車載用アンテナ装置
JP7030588B2 (ja) 2018-03-23 2022-03-07 日本碍子株式会社 ハニカム構造体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59187153U (ja) * 1983-05-31 1984-12-12 三菱電機株式会社 部品冷却構造
US20040145048A1 (en) * 2002-10-30 2004-07-29 Michael Frisch Integrated circuit system with a latent heat storage module
JP2005239133A (ja) * 2004-01-29 2005-09-08 Nippon Soken Inc 車両用オーバヘッドモジュール
JP2012102264A (ja) * 2010-11-11 2012-05-31 Kitagawa Ind Co Ltd 熱対策部材

Also Published As

Publication number Publication date
DE112020004352T5 (de) 2022-06-09
WO2021049604A1 (ja) 2021-03-18
JP7120467B2 (ja) 2022-08-17
CN114375265A (zh) 2022-04-19
US20220201834A1 (en) 2022-06-23

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