JPWO2021049241A1 - - Google Patents

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Publication number
JPWO2021049241A1
JPWO2021049241A1 JP2021545176A JP2021545176A JPWO2021049241A1 JP WO2021049241 A1 JPWO2021049241 A1 JP WO2021049241A1 JP 2021545176 A JP2021545176 A JP 2021545176A JP 2021545176 A JP2021545176 A JP 2021545176A JP WO2021049241 A1 JPWO2021049241 A1 JP WO2021049241A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021545176A
Other versions
JP7223864B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021049241A1 publication Critical patent/JPWO2021049241A1/ja
Application granted granted Critical
Publication of JP7223864B2 publication Critical patent/JP7223864B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
JP2021545176A 2019-09-13 2020-08-12 感光性樹脂組成物、及び感光性エレメント Active JP7223864B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019167289 2019-09-13
JP2019167289 2019-09-13
PCT/JP2020/030719 WO2021049241A1 (ja) 2019-09-13 2020-08-12 感光性樹脂組成物、及び感光性エレメント

Publications (2)

Publication Number Publication Date
JPWO2021049241A1 true JPWO2021049241A1 (ja) 2021-03-18
JP7223864B2 JP7223864B2 (ja) 2023-02-16

Family

ID=74867230

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021545176A Active JP7223864B2 (ja) 2019-09-13 2020-08-12 感光性樹脂組成物、及び感光性エレメント

Country Status (6)

Country Link
JP (1) JP7223864B2 (ja)
KR (1) KR20220035454A (ja)
CN (1) CN114375420A (ja)
MY (1) MY197706A (ja)
TW (1) TWI752606B (ja)
WO (1) WO2021049241A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI830425B (zh) * 2021-10-25 2024-01-21 日商旭化成股份有限公司 感光性元件、及光阻圖案之形成方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005309384A (ja) * 2004-02-16 2005-11-04 Fuji Photo Film Co Ltd 感光性組成物
WO2019188652A1 (ja) * 2018-03-26 2019-10-03 富士フイルム株式会社 感光性組成物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008089741A (ja) * 2006-09-29 2008-04-17 Jsr Corp 感放射線性樹脂組成物およびカラーフィルタ
JP2008122924A (ja) * 2006-10-17 2008-05-29 Jsr Corp スペーサー形成用感放射線性樹脂組成物、スペーサーおよびその形成方法
MY152732A (en) 2008-04-28 2014-11-28 Hitachi Chemical Co Ltd Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for manufacturing printed wiring board
JP6237084B2 (ja) 2013-10-07 2017-11-29 Jsr株式会社 硬化性組成物、硬化膜及びその形成方法、並びに塩基発生剤

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005309384A (ja) * 2004-02-16 2005-11-04 Fuji Photo Film Co Ltd 感光性組成物
WO2019188652A1 (ja) * 2018-03-26 2019-10-03 富士フイルム株式会社 感光性組成物

Also Published As

Publication number Publication date
TWI752606B (zh) 2022-01-11
JP7223864B2 (ja) 2023-02-16
CN114375420A (zh) 2022-04-19
KR20220035454A (ko) 2022-03-22
WO2021049241A1 (ja) 2021-03-18
MY197706A (en) 2023-07-07
TW202120472A (zh) 2021-06-01

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