JPWO2021044611A1 - - Google Patents

Info

Publication number
JPWO2021044611A1
JPWO2021044611A1 JP2021543913A JP2021543913A JPWO2021044611A1 JP WO2021044611 A1 JPWO2021044611 A1 JP WO2021044611A1 JP 2021543913 A JP2021543913 A JP 2021543913A JP 2021543913 A JP2021543913 A JP 2021543913A JP WO2021044611 A1 JPWO2021044611 A1 JP WO2021044611A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021543913A
Other versions
JPWO2021044611A5 (ja
JP7153142B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021044611A1 publication Critical patent/JPWO2021044611A1/ja
Publication of JPWO2021044611A5 publication Critical patent/JPWO2021044611A5/ja
Application granted granted Critical
Publication of JP7153142B2 publication Critical patent/JP7153142B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
    • G05B23/0259—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterized by the response to fault detection
    • G05B23/0275—Fault isolation and identification, e.g. classify fault; estimate cause or root of failure
    • G05B23/0281—Quantitative, e.g. mathematical distance; Clustering; Neural networks; Statistical analysis
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2836—Fault-finding or characterising
    • G01R31/2846—Fault-finding or characterising using hard- or software simulation or using knowledge-based systems, e.g. expert systems, artificial intelligence or interactive algorithms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2894—Aspects of quality control [QC]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Artificial Intelligence (AREA)
  • Evolutionary Computation (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Software Systems (AREA)
  • Health & Medical Sciences (AREA)
  • Medical Informatics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Data Mining & Analysis (AREA)
  • Computing Systems (AREA)
  • Power Engineering (AREA)
  • Probability & Statistics with Applications (AREA)
  • Algebra (AREA)
  • Automation & Control Theory (AREA)
  • Pure & Applied Mathematics (AREA)
  • Mathematical Optimization (AREA)
  • Mathematical Analysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Biophysics (AREA)
  • Molecular Biology (AREA)
  • Computational Linguistics (AREA)
  • Biomedical Technology (AREA)
  • General Health & Medical Sciences (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • General Factory Administration (AREA)
JP2021543913A 2019-09-06 2019-09-06 レシピ情報提示システム、レシピエラー推定システム Active JP7153142B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/035140 WO2021044611A1 (ja) 2019-09-06 2019-09-06 レシピ情報提示システム、レシピエラー推定システム

Publications (3)

Publication Number Publication Date
JPWO2021044611A1 true JPWO2021044611A1 (ja) 2021-03-11
JPWO2021044611A5 JPWO2021044611A5 (ja) 2022-04-18
JP7153142B2 JP7153142B2 (ja) 2022-10-13

Family

ID=74853098

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021543913A Active JP7153142B2 (ja) 2019-09-06 2019-09-06 レシピ情報提示システム、レシピエラー推定システム

Country Status (6)

Country Link
US (1) US20220334172A1 (ja)
JP (1) JP7153142B2 (ja)
KR (1) KR20220034196A (ja)
CN (1) CN114245933A (ja)
TW (1) TWI743877B (ja)
WO (1) WO2021044611A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220132604A (ko) * 2020-03-30 2022-09-30 주식회사 히타치하이테크 진단 시스템
US20230168650A1 (en) * 2021-12-01 2023-06-01 United Microelectronics Corp. Recipe verifying method, recipe verifying server, and smart manufacturing controlling system using the same
US20230367288A1 (en) * 2022-05-16 2023-11-16 Applied Materials, Inc. Physically-informed multi-system hardware operating windows
WO2024105811A1 (ja) * 2022-11-16 2024-05-23 株式会社日立ハイテク エラー要因解析装置、および、エラー要因解析方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0727707A (ja) * 1993-07-09 1995-01-31 Nikon Corp 異物検査装置
WO2007013170A1 (ja) * 2005-07-29 2007-02-01 Topcon Corporation 自己診断機能を有する半導体デバイス製造検査装置
WO2018159190A1 (ja) * 2017-03-02 2018-09-07 東京エレクトロン株式会社 検査システム、および検査システムの故障解析・予知方法
WO2018179890A1 (ja) * 2017-03-30 2018-10-04 東京エレクトロン株式会社 検査システム、ウエハマップ表示器、ウエハマップ表示方法、およびコンピュータプログラム

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5933985B2 (ja) 1979-02-06 1984-08-20 富士通株式会社 半導体装置
US7065425B1 (en) 2005-06-22 2006-06-20 Internaitonal Business Machines Corporation Metrology tool error log analysis methodology and system
JP2010087070A (ja) * 2008-09-30 2010-04-15 Hitachi High-Technologies Corp 走査電子顕微鏡に用いられるレシピの診断装置
TWI644190B (zh) * 2017-06-29 2018-12-11 台灣積體電路製造股份有限公司 製程系統與製程方法
JP7236231B2 (ja) * 2018-09-07 2023-03-09 ルネサスエレクトロニクス株式会社 半導体装置及び解析システム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0727707A (ja) * 1993-07-09 1995-01-31 Nikon Corp 異物検査装置
WO2007013170A1 (ja) * 2005-07-29 2007-02-01 Topcon Corporation 自己診断機能を有する半導体デバイス製造検査装置
WO2018159190A1 (ja) * 2017-03-02 2018-09-07 東京エレクトロン株式会社 検査システム、および検査システムの故障解析・予知方法
WO2018179890A1 (ja) * 2017-03-30 2018-10-04 東京エレクトロン株式会社 検査システム、ウエハマップ表示器、ウエハマップ表示方法、およびコンピュータプログラム

Also Published As

Publication number Publication date
WO2021044611A1 (ja) 2021-03-11
KR20220034196A (ko) 2022-03-17
TWI743877B (zh) 2021-10-21
JP7153142B2 (ja) 2022-10-13
US20220334172A1 (en) 2022-10-20
CN114245933A (zh) 2022-03-25
TW202111591A (zh) 2021-03-16

Similar Documents

Publication Publication Date Title
BR112019017762A2 (ja)
BR112021017339A2 (ja)
BR112019016141A2 (ja)
BR112021017939A2 (ja)
BR112021017782A2 (ja)
AU2020104490A5 (ja)
BR112021017637A2 (ja)
BR112021008711A2 (ja)
BR112019016142A2 (ja)
BR112019016138A2 (ja)
BR112021018168A2 (ja)
BR112021017728A2 (ja)
JPWO2021044611A1 (ja)
BR112021017234A2 (ja)
BR112021017355A2 (ja)
BR112021017703A2 (ja)
BR112021018102A2 (ja)
BR112021015080A2 (ja)
BR112021012348A2 (ja)
BR112021018084A2 (ja)
BR112021018093A2 (ja)
BR112021013944A2 (ja)
BR112021013128A2 (ja)
BR112021017732A2 (ja)
BR112021017949A2 (ja)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220131

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220131

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20220913

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20220930

R150 Certificate of patent or registration of utility model

Ref document number: 7153142

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150