JPWO2021039450A1 - - Google Patents

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Publication number
JPWO2021039450A1
JPWO2021039450A1 JP2021542752A JP2021542752A JPWO2021039450A1 JP WO2021039450 A1 JPWO2021039450 A1 JP WO2021039450A1 JP 2021542752 A JP2021542752 A JP 2021542752A JP 2021542752 A JP2021542752 A JP 2021542752A JP WO2021039450 A1 JPWO2021039450 A1 JP WO2021039450A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021542752A
Other versions
JP7297074B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2021039450A1 publication Critical patent/JPWO2021039450A1/ja
Application granted granted Critical
Publication of JP7297074B2 publication Critical patent/JP7297074B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/93—Detection standards; Calibrating baseline adjustment, drift correction
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G01J1/0228—Control of working procedures; Failure detection; Spectral bandwidth calculation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/10—Scanning
    • G01N2201/104—Mechano-optical scan, i.e. object and beam moving
    • G01N2201/1047—Mechano-optical scan, i.e. object and beam moving with rotating optics and moving stage
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/12—Circuits of general importance; Signal processing
    • G01N2201/127—Calibration; base line adjustment; drift compensation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2021542752A 2019-08-29 2020-08-17 検査装置の自己診断方法および検査装置 Active JP7297074B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019157271 2019-08-29
JP2019157271 2019-08-29
PCT/JP2020/030934 WO2021039450A1 (ja) 2019-08-29 2020-08-17 検査装置の自己診断方法および検査装置

Publications (2)

Publication Number Publication Date
JPWO2021039450A1 true JPWO2021039450A1 (ja) 2021-03-04
JP7297074B2 JP7297074B2 (ja) 2023-06-23

Family

ID=74684762

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021542752A Active JP7297074B2 (ja) 2019-08-29 2020-08-17 検査装置の自己診断方法および検査装置

Country Status (4)

Country Link
JP (1) JP7297074B2 (ja)
KR (1) KR20220051389A (ja)
CN (1) CN114258482A (ja)
WO (1) WO2021039450A1 (ja)

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63122908A (ja) * 1986-11-13 1988-05-26 Toshiba Corp 表面検査装置
JPH08338814A (ja) * 1995-06-09 1996-12-24 Toray Ind Inc フイルムの欠点検出装置およびフイルムの製造方法
JP2001074669A (ja) * 1999-09-07 2001-03-23 Nippon Columbia Co Ltd 光ディスク欠陥検査装置
US20030147070A1 (en) * 2001-12-12 2003-08-07 Abdurrahman Sezginer Method and apparatus for position-dependent optical metrology calibration
JP2004191324A (ja) * 2002-12-13 2004-07-08 Ricoh Co Ltd ピンホール検査装置
JP2010008336A (ja) * 2008-06-30 2010-01-14 Shin Etsu Handotai Co Ltd 画像検査装置の校正用サンプルウエーハ及び画像検査装置の校正方法
JP2011107144A (ja) * 2009-11-20 2011-06-02 Foundation Seoul Technopark 接合ウェハ検査方法
JP2012233880A (ja) * 2011-04-19 2012-11-29 Shibaura Mechatronics Corp 基板検査装置、基板検査方法及び該基板検査装置の調整方法
KR20130005748A (ko) * 2011-07-07 2013-01-16 한국전기연구원 다중 접합 반도체의 공극 검사 장치 및 방법
JP2014041956A (ja) * 2012-08-23 2014-03-06 Tokyo Electron Ltd 検査装置、接合システム、検査方法、プログラム及びコンピュータ記憶媒体
US10215695B1 (en) * 2018-04-25 2019-02-26 Globalfoundries Inc. Inspection system and method for detecting defects at a materials interface
WO2019208214A1 (ja) * 2018-04-23 2019-10-31 東京エレクトロン株式会社 測定方法および測定装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63122903A (ja) * 1986-11-12 1988-05-26 Sekisui Jushi Co Ltd 測長装置
JP5421825B2 (ja) 2010-03-09 2014-02-19 東京エレクトロン株式会社 接合システム、接合方法、プログラム及びコンピュータ記憶媒体
JP6848929B2 (ja) * 2018-04-17 2021-03-24 豊田合成株式会社 収納ボックス

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63122908A (ja) * 1986-11-13 1988-05-26 Toshiba Corp 表面検査装置
JPH08338814A (ja) * 1995-06-09 1996-12-24 Toray Ind Inc フイルムの欠点検出装置およびフイルムの製造方法
JP2001074669A (ja) * 1999-09-07 2001-03-23 Nippon Columbia Co Ltd 光ディスク欠陥検査装置
US20030147070A1 (en) * 2001-12-12 2003-08-07 Abdurrahman Sezginer Method and apparatus for position-dependent optical metrology calibration
JP2004191324A (ja) * 2002-12-13 2004-07-08 Ricoh Co Ltd ピンホール検査装置
JP2010008336A (ja) * 2008-06-30 2010-01-14 Shin Etsu Handotai Co Ltd 画像検査装置の校正用サンプルウエーハ及び画像検査装置の校正方法
JP2011107144A (ja) * 2009-11-20 2011-06-02 Foundation Seoul Technopark 接合ウェハ検査方法
JP2012233880A (ja) * 2011-04-19 2012-11-29 Shibaura Mechatronics Corp 基板検査装置、基板検査方法及び該基板検査装置の調整方法
KR20130005748A (ko) * 2011-07-07 2013-01-16 한국전기연구원 다중 접합 반도체의 공극 검사 장치 및 방법
JP2014041956A (ja) * 2012-08-23 2014-03-06 Tokyo Electron Ltd 検査装置、接合システム、検査方法、プログラム及びコンピュータ記憶媒体
WO2019208214A1 (ja) * 2018-04-23 2019-10-31 東京エレクトロン株式会社 測定方法および測定装置
US10215695B1 (en) * 2018-04-25 2019-02-26 Globalfoundries Inc. Inspection system and method for detecting defects at a materials interface

Also Published As

Publication number Publication date
CN114258482A (zh) 2022-03-29
KR20220051389A (ko) 2022-04-26
JP7297074B2 (ja) 2023-06-23
WO2021039450A1 (ja) 2021-03-04

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