JPWO2021039047A1 - - Google Patents

Info

Publication number
JPWO2021039047A1
JPWO2021039047A1 JP2021542033A JP2021542033A JPWO2021039047A1 JP WO2021039047 A1 JPWO2021039047 A1 JP WO2021039047A1 JP 2021542033 A JP2021542033 A JP 2021542033A JP 2021542033 A JP2021542033 A JP 2021542033A JP WO2021039047 A1 JPWO2021039047 A1 JP WO2021039047A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021542033A
Other languages
Japanese (ja)
Other versions
JP7193001B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021039047A1 publication Critical patent/JPWO2021039047A1/ja
Application granted granted Critical
Publication of JP7193001B2 publication Critical patent/JP7193001B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/093—Forming inorganic materials
    • H10N30/097—Forming inorganic materials by sintering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Packaging Frangible Articles (AREA)
JP2021542033A 2019-08-23 2020-06-18 Jigs for chip-shaped electronic components Active JP7193001B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019152873 2019-08-23
JP2019152873 2019-08-23
PCT/JP2020/023938 WO2021039047A1 (en) 2019-08-23 2020-06-18 Chip-like electronic component jig

Publications (2)

Publication Number Publication Date
JPWO2021039047A1 true JPWO2021039047A1 (en) 2021-03-04
JP7193001B2 JP7193001B2 (en) 2022-12-20

Family

ID=74685788

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021542033A Active JP7193001B2 (en) 2019-08-23 2020-06-18 Jigs for chip-shaped electronic components

Country Status (4)

Country Link
JP (1) JP7193001B2 (en)
KR (1) KR102554646B1 (en)
CN (1) CN114245926B (en)
WO (1) WO2021039047A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022176296A1 (en) * 2021-02-22 2022-08-25
CN116670787A (en) * 2021-02-22 2023-08-29 株式会社村田制作所 Clamp for manufacturing electronic component and manufacturing method of electronic component

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003077776A (en) * 2001-06-21 2003-03-14 Tdk Corp Method and device for baking terminal electrode of ceramic electronic component
JP2006310763A (en) * 2005-03-28 2006-11-09 Tdk Corp Tool for chip electronic component
JP2008177188A (en) * 2007-01-16 2008-07-31 Tdk Corp Tool for chip electronic component
JP2012144433A (en) * 2012-04-20 2012-08-02 Tdk Corp Degreasing tool
JP2018193287A (en) * 2017-12-11 2018-12-06 三井金属鉱業株式会社 Ceramic lattice body

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5612154A (en) 1979-07-10 1981-02-06 Tamura Electric Works Ltd Answer signal transmission system
JP3166694B2 (en) * 1997-12-22 2001-05-14 松下電器産業株式会社 Manufacturing method of multilayer ceramic electronic component
JP2000012377A (en) * 1998-06-17 2000-01-14 Murata Mfg Co Ltd Laminated ceramic electronic component and manufacture of the same
JP2001074955A (en) * 1999-08-31 2001-03-23 Susumu Noda Photonic crystal waveguide
CN101390228B (en) * 2006-02-27 2010-12-08 京瓷株式会社 Process for producing ceramic member, ceramic member, gas sensor element, fuel cell element, filter element, layer-built piezoelectric element, injector, and fuel injection system
CN101347058B (en) * 2006-08-07 2010-09-22 株式会社村田制作所 Method of producing multilayer ceramic substrate
TWI530974B (en) * 2011-06-15 2016-04-21 Murata Manufacturing Co Manufacture of laminated ceramic electronic parts
JP6094682B2 (en) * 2013-09-30 2017-03-15 株式会社村田製作所 Multilayer piezoelectric ceramic electronic component and method for manufacturing multilayer piezoelectric ceramic electronic component
JP2016072279A (en) * 2014-09-26 2016-05-09 株式会社村田製作所 Multilayer ceramic capacitor, multilayer ceramic capacitor string including the same, and mounting body of multilayer ceramic capacitor
JP2018093051A (en) * 2016-12-02 2018-06-14 株式会社村田製作所 Electronic component
JP2018098247A (en) * 2016-12-08 2018-06-21 株式会社村田製作所 Manufacturing method of multilayer ceramic electronic component

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003077776A (en) * 2001-06-21 2003-03-14 Tdk Corp Method and device for baking terminal electrode of ceramic electronic component
JP2006310763A (en) * 2005-03-28 2006-11-09 Tdk Corp Tool for chip electronic component
JP2008177188A (en) * 2007-01-16 2008-07-31 Tdk Corp Tool for chip electronic component
JP2012144433A (en) * 2012-04-20 2012-08-02 Tdk Corp Degreasing tool
JP2018193287A (en) * 2017-12-11 2018-12-06 三井金属鉱業株式会社 Ceramic lattice body

Also Published As

Publication number Publication date
KR20220028100A (en) 2022-03-08
JP7193001B2 (en) 2022-12-20
CN114245926A (en) 2022-03-25
CN114245926B (en) 2024-04-19
KR102554646B1 (en) 2023-07-12
WO2021039047A1 (en) 2021-03-04

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