JPWO2021020081A1 - - Google Patents

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Publication number
JPWO2021020081A1
JPWO2021020081A1 JP2021536891A JP2021536891A JPWO2021020081A1 JP WO2021020081 A1 JPWO2021020081 A1 JP WO2021020081A1 JP 2021536891 A JP2021536891 A JP 2021536891A JP 2021536891 A JP2021536891 A JP 2021536891A JP WO2021020081 A1 JPWO2021020081 A1 JP WO2021020081A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021536891A
Other versions
JP7324283B2 (ja
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Publication of JPWO2021020081A1 publication Critical patent/JPWO2021020081A1/ja
Application granted granted Critical
Publication of JP7324283B2 publication Critical patent/JP7324283B2/ja
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Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2021536891A 2019-07-26 2020-07-10 熱伝導材料形成用組成物、熱伝導材料、熱伝導シート、熱伝導層付きデバイス Active JP7324283B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019138228 2019-07-26
JP2019138228 2019-07-26
PCT/JP2020/027057 WO2021020081A1 (ja) 2019-07-26 2020-07-10 熱伝導材料形成用組成物、熱伝導材料、熱伝導シート、熱伝導層付きデバイス

Publications (2)

Publication Number Publication Date
JPWO2021020081A1 true JPWO2021020081A1 (ja) 2021-02-04
JP7324283B2 JP7324283B2 (ja) 2023-08-09

Family

ID=74228579

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021536891A Active JP7324283B2 (ja) 2019-07-26 2020-07-10 熱伝導材料形成用組成物、熱伝導材料、熱伝導シート、熱伝導層付きデバイス

Country Status (2)

Country Link
JP (1) JP7324283B2 (ja)
WO (1) WO2021020081A1 (ja)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001055425A (ja) * 1999-06-10 2001-02-27 Nippon Kayaku Co Ltd レゾルシンノボラック樹脂、エポキシ樹脂組成物及びその硬化物
JP2007197518A (ja) * 2006-01-24 2007-08-09 Fujifilm Corp エポキシ樹脂化合物、熱硬化性樹脂組成物、及び感光性組成物
JP2012017405A (ja) * 2010-07-08 2012-01-26 Nippon Steel Chem Co Ltd エポキシ樹脂組成物、成形物、ワニス、フィルム状接着剤及びフィルム状接着剤付き銅箔
WO2012070402A1 (ja) * 2010-11-26 2012-05-31 日立化成工業株式会社 封止用エポキシ樹脂成形材料、及びこの成形材料で封止した素子を備えた電子部品装置
WO2012133587A1 (ja) * 2011-03-28 2012-10-04 日立化成工業株式会社 樹脂組成物、樹脂シート、樹脂シート硬化物、樹脂シート積層体、樹脂シート積層体硬化物及びその製造方法、半導体装置、並びにｌｅｄ装置
JP2016104862A (ja) * 2015-12-04 2016-06-09 日立化成株式会社 樹脂組成物、樹脂シート、金属箔付き樹脂シート、樹脂硬化物シート、構造体、および動力用又は光源用半導体デバイス
WO2019013343A1 (ja) * 2017-07-14 2019-01-17 富士フイルム株式会社 表面修飾無機窒化物、組成物、熱伝導材料、熱伝導層付きデバイス

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001055425A (ja) * 1999-06-10 2001-02-27 Nippon Kayaku Co Ltd レゾルシンノボラック樹脂、エポキシ樹脂組成物及びその硬化物
JP2007197518A (ja) * 2006-01-24 2007-08-09 Fujifilm Corp エポキシ樹脂化合物、熱硬化性樹脂組成物、及び感光性組成物
JP2012017405A (ja) * 2010-07-08 2012-01-26 Nippon Steel Chem Co Ltd エポキシ樹脂組成物、成形物、ワニス、フィルム状接着剤及びフィルム状接着剤付き銅箔
WO2012070402A1 (ja) * 2010-11-26 2012-05-31 日立化成工業株式会社 封止用エポキシ樹脂成形材料、及びこの成形材料で封止した素子を備えた電子部品装置
WO2012133587A1 (ja) * 2011-03-28 2012-10-04 日立化成工業株式会社 樹脂組成物、樹脂シート、樹脂シート硬化物、樹脂シート積層体、樹脂シート積層体硬化物及びその製造方法、半導体装置、並びにｌｅｄ装置
JP2016104862A (ja) * 2015-12-04 2016-06-09 日立化成株式会社 樹脂組成物、樹脂シート、金属箔付き樹脂シート、樹脂硬化物シート、構造体、および動力用又は光源用半導体デバイス
WO2019013343A1 (ja) * 2017-07-14 2019-01-17 富士フイルム株式会社 表面修飾無機窒化物、組成物、熱伝導材料、熱伝導層付きデバイス

Also Published As

Publication number Publication date
WO2021020081A1 (ja) 2021-02-04
JP7324283B2 (ja) 2023-08-09

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