JPWO2021019867A1 - - Google Patents
Info
- Publication number
- JPWO2021019867A1 JPWO2021019867A1 JP2021536618A JP2021536618A JPWO2021019867A1 JP WO2021019867 A1 JPWO2021019867 A1 JP WO2021019867A1 JP 2021536618 A JP2021536618 A JP 2021536618A JP 2021536618 A JP2021536618 A JP 2021536618A JP WO2021019867 A1 JPWO2021019867 A1 JP WO2021019867A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019139451 | 2019-07-30 | ||
JP2019139451 | 2019-07-30 | ||
PCT/JP2020/019343 WO2021019867A1 (ja) | 2019-07-30 | 2020-05-14 | チップ部品、チップ部品の製造方法、および電子機器の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2021019867A1 true JPWO2021019867A1 (ja) | 2021-02-04 |
JPWO2021019867A5 JPWO2021019867A5 (ja) | 2022-02-09 |
JP7166464B2 JP7166464B2 (ja) | 2022-11-07 |
Family
ID=74228432
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021536618A Active JP7166464B2 (ja) | 2019-07-30 | 2020-05-14 | チップ部品、チップ部品の製造方法、および電子機器の製造方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7166464B2 (ja) |
CN (1) | CN114145080B (ja) |
WO (1) | WO2021019867A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11641717B2 (en) * | 2021-08-30 | 2023-05-02 | International Business Machines Corporation | Soldering of end chip components in series |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004296936A (ja) * | 2003-03-27 | 2004-10-21 | Kyocera Corp | セラミック電子部品 |
JP2006221690A (ja) * | 2005-02-08 | 2006-08-24 | Alps Electric Co Ltd | 磁気ヘッドアッセンブリの半田ボール接合方法 |
JP2010147406A (ja) * | 2008-12-22 | 2010-07-01 | Tdk Corp | 電子部品の製造方法 |
JP2011040720A (ja) * | 2009-08-17 | 2011-02-24 | Nan Ya Printed Circuit Board Corp | プリント回路基板及びその製造方法 |
WO2014038066A1 (ja) * | 2012-09-07 | 2014-03-13 | 三菱電機株式会社 | パワー半導体装置 |
WO2015108151A1 (ja) * | 2014-01-17 | 2015-07-23 | 京セラ株式会社 | 積層型電子部品およびその実装構造体 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003152325A (ja) * | 2001-11-13 | 2003-05-23 | Matsushita Electric Ind Co Ltd | チップ状電子部品の半田付け方法及びペースト半田形状 |
JP2003298220A (ja) * | 2002-03-29 | 2003-10-17 | Hitachi Ltd | 回路基板および電子機器、およびそれらの製造方法 |
JP2012238725A (ja) * | 2011-05-12 | 2012-12-06 | Toshiba Corp | 半導体装置とその製造方法、およびそれを用いた半導体モジュール |
JP2013251493A (ja) * | 2012-06-04 | 2013-12-12 | Toshiba Corp | 素子モジュール |
-
2020
- 2020-05-14 JP JP2021536618A patent/JP7166464B2/ja active Active
- 2020-05-14 CN CN202080052169.5A patent/CN114145080B/zh active Active
- 2020-05-14 WO PCT/JP2020/019343 patent/WO2021019867A1/ja active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004296936A (ja) * | 2003-03-27 | 2004-10-21 | Kyocera Corp | セラミック電子部品 |
JP2006221690A (ja) * | 2005-02-08 | 2006-08-24 | Alps Electric Co Ltd | 磁気ヘッドアッセンブリの半田ボール接合方法 |
JP2010147406A (ja) * | 2008-12-22 | 2010-07-01 | Tdk Corp | 電子部品の製造方法 |
JP2011040720A (ja) * | 2009-08-17 | 2011-02-24 | Nan Ya Printed Circuit Board Corp | プリント回路基板及びその製造方法 |
WO2014038066A1 (ja) * | 2012-09-07 | 2014-03-13 | 三菱電機株式会社 | パワー半導体装置 |
WO2015108151A1 (ja) * | 2014-01-17 | 2015-07-23 | 京セラ株式会社 | 積層型電子部品およびその実装構造体 |
Also Published As
Publication number | Publication date |
---|---|
CN114145080B (zh) | 2024-05-28 |
JP7166464B2 (ja) | 2022-11-07 |
CN114145080A (zh) | 2022-03-04 |
WO2021019867A1 (ja) | 2021-02-04 |
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