JPWO2021005667A1 - - Google Patents

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Publication number
JPWO2021005667A1
JPWO2021005667A1 JP2021530362A JP2021530362A JPWO2021005667A1 JP WO2021005667 A1 JPWO2021005667 A1 JP WO2021005667A1 JP 2021530362 A JP2021530362 A JP 2021530362A JP 2021530362 A JP2021530362 A JP 2021530362A JP WO2021005667 A1 JPWO2021005667 A1 JP WO2021005667A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021530362A
Other versions
JP7223136B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2021005667A1 publication Critical patent/JPWO2021005667A1/ja
Application granted granted Critical
Publication of JP7223136B2 publication Critical patent/JP7223136B2/ja
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2021530362A 2019-07-05 2019-07-05 部品実装装置 Active JP7223136B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/026905 WO2021005667A1 (ja) 2019-07-05 2019-07-05 部品実装装置

Publications (2)

Publication Number Publication Date
JPWO2021005667A1 true JPWO2021005667A1 (ja) 2021-01-14
JP7223136B2 JP7223136B2 (ja) 2023-02-15

Family

ID=74113972

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021530362A Active JP7223136B2 (ja) 2019-07-05 2019-07-05 部品実装装置

Country Status (2)

Country Link
JP (1) JP7223136B2 (ja)
WO (1) WO2021005667A1 (ja)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03257894A (ja) * 1990-03-07 1991-11-18 Matsushita Electric Ind Co Ltd 電子部品実装装置及び電子部品実装方法
JPH11346096A (ja) * 1998-06-01 1999-12-14 Matsushita Electric Ind Co Ltd 電子部品実装装置におけるマルチノズルヘッドのノズル高さティーチ方法
JP2003536252A (ja) * 2000-06-07 2003-12-02 サイバーオプティクス コーポレーション オンヘッド式ラインスキャン感知を備えた配置機械のための較正方法
JP2007042987A (ja) * 2005-08-05 2007-02-15 Yamagata Casio Co Ltd ノズル高さティーチング方法
JP2012039302A (ja) * 2010-08-05 2012-02-23 Fuji Mach Mfg Co Ltd 工業用撮像システム
JP2017092200A (ja) * 2015-11-09 2017-05-25 富士機械製造株式会社 部品実装機
WO2019003336A1 (ja) * 2017-06-28 2019-01-03 株式会社Ｆｕｊｉ 部品装着機用ヘッド

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03257894A (ja) * 1990-03-07 1991-11-18 Matsushita Electric Ind Co Ltd 電子部品実装装置及び電子部品実装方法
JPH11346096A (ja) * 1998-06-01 1999-12-14 Matsushita Electric Ind Co Ltd 電子部品実装装置におけるマルチノズルヘッドのノズル高さティーチ方法
JP2003536252A (ja) * 2000-06-07 2003-12-02 サイバーオプティクス コーポレーション オンヘッド式ラインスキャン感知を備えた配置機械のための較正方法
JP2007042987A (ja) * 2005-08-05 2007-02-15 Yamagata Casio Co Ltd ノズル高さティーチング方法
JP2012039302A (ja) * 2010-08-05 2012-02-23 Fuji Mach Mfg Co Ltd 工業用撮像システム
JP2017092200A (ja) * 2015-11-09 2017-05-25 富士機械製造株式会社 部品実装機
WO2019003336A1 (ja) * 2017-06-28 2019-01-03 株式会社Ｆｕｊｉ 部品装着機用ヘッド

Also Published As

Publication number Publication date
WO2021005667A1 (ja) 2021-01-14
JP7223136B2 (ja) 2023-02-15

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